Storage devices with multiple NAND dies
A memory controller includes an interface and a control module. The interface interfaces with a memory device which includes a plurality of dies that each include a plurality of blocks. The control module groups a plurality of blocks included in different dies and manages the plurality of blocks as a super block. The control module performs scheduling to alternately perform a program on a part of an Nth super block, wherein N is a natural number, and a phased erase on an N+1st super block, and the control module completes the program on the Nth super block and the erase on the Nth super block before the program on the N+1st super block starts.
1. A storage device comprising:
a memory including a plurality of NAND dies that includes a first die and a second die,
wherein the first die includes a first block,
wherein the second die includes a second block, and
wherein a first super block includes the first block and the second block; and
a controller configured to perform an erase operation on the first die during a first time period, and to perform the erase operation on the second die during a second time period,
wherein the controller is configured not to perform the erase operation on the second die during the first time period, and
wherein the controller is configured not to perform the erase operation on the first die during the second time period, and
wherein the controller is configured to complete the erase operation on the first super block before starting a program operation on the first super block.
2. The storage device of claim 1 , wherein the controller is configured to, during a third time period which is between the first time period and the second time period, perform the erase operation on both the first die and the second die.
3. The storage device of claim 1 , wherein the controller is configured to perform the program operation on the second die during the first time period, and perform the program operation on the first die during the second time period.
4. The storage device of claim 1 , wherein the controller is configured not to, while the erase operation is performed on the first die, perform the erase operation on any other die among the plurality of NAND dies.
5. The storage device of claim 1 , wherein the controller is configured to, while the erase operation is performed on the first die, perform the program operation on all other dies of the plurality of NAND dies.
6. The storage device of claim 1 , wherein the first die further includes a third block,
wherein the second die further includes a fourth block, and
wherein a second super block includes the third block and the fourth block.
7. The storage device of claim 1 , wherein the controller is configured to perform the program operation on at least one die among the plurality of NAND dies while the controller performs the erase operation on at least one other die among the plurality of NAND dies.
8. A storage device comprising:
a memory including a plurality of NAND dies that include a first die and a second die,
wherein the first die includes a first block,
wherein the second die includes a second block, and
wherein a first super block includes the first block and the second block; and
a controller configured to perform an erase operation on the first die during a first time period, to perform the erase operation on both the first die and the second die during a second time period, and to perform the erase operation on the second die during a third time period,
wherein the controller is configured not to perform the erase operation on the second die during the first time period,
wherein the controller is configured not to perform the erase operation on the first die during the third time period, and
wherein the controller is configured to complete the erase operation on the first super block before starting a program operation on the first super block.
9. The storage device of claim 8 , wherein the second time period is between the first time period and the third time period.
10. The storage device of claim 8 , wherein the controller is configured to perform the program operation on the second die during the first time period, and to perform the program operation on the first die during the third time period.
11. The storage device of claim 8 , wherein the first die further includes a third block,
wherein the second die further includes a fourth block, and
wherein a second super block includes the third block and the fourth block.
12. The storage device of claim 11 , wherein the controller is configured to perform the program operation on the first super block while the controller performs the erase operation on the second super block.
13. The storage device of claim 8 , wherein the controller is configured to perform the program operation on at least one die among the plurality of NAND dies while the controller performs the erase operation on at least one other die among the plurality of NAND dies.
14. A storage device comprising:
a memory including a plurality of NAND dies that include a first die and a second die, wherein the first die includes a first block,
wherein the second die includes a second block, and
wherein a first super block includes the first block and the second block; and
a controller configured to perform an erase operation on the first die and perform a program operation on the second die during a first time period, and to perform the erase operation on the second die and perform the program operation on the first die during a second time period,
wherein the controller is configured not to perform the erase operation on the second die during the first time period, and not to perform the erase operation on the first die during the second time period, and
wherein the controller is configured to complete the erase operation on the first super block before starting the program operation on the first super block.
15. The storage device of claim 14 , wherein the controller is configured to, during a third time period which is between the first time period and the second time period, perform the erase operation on both the first die and the second die.
16. The storage device of claim 14 , wherein the controller is configured not to, while the erase operation is performed on the first die, perform the erase operation on any other die among the plurality of NAND dies.
17. The storage device of claim 14 , wherein the controller is configured to, while the erase operation is performed on the first die, perform the program operation on all other dies of the plurality of NAND dies.
18. The storage device of claim 14 , wherein the first die further includes a third block,
wherein the second die further includes a fourth block, and
wherein a second super block includes the third block and the fourth block.
19. The storage device of claim 18 , wherein the controller is configured to perform the program operation on the first block while the controller performs the erase operation on the fourth block,
and wherein the controller is configured to perform the program operation on the second block while the controller performs the erase operation on the third block.
20. The storage device of claim 14 , wherein the controller is configured to perform the program operation on at least one die among the plurality of NAND dies while the controller performs the erase operation on at least one other die among the plurality of NAND dies.