Multilayer substrate
A maximum width of a second connection portion in a line width direction is smaller than a maximum width of a first connection portion in the line width direction. A first intermediate portion includes a first thick-line portion of which the width is greater than that of a transmission line portion in the line width direction. A second intermediate portion includes a second thick-line portion of which the width is greater than that of a transmission line portion in the line width direction. The first thick-line portion and the second thick-line portion adjoin the transmission line portion.
1. A multilayer substrate comprising:
a multilayer body in which multiple insulator layers including an intermediate insulator layer and a negative-side adjoining insulator layer are laminated in a Z-axis direction, each one of the multiple insulator layers having a positive-side principal surface and a negative-side principal surface positioned closer to a negative side of Z-axis than the positive-side principal surface, the negative-side adjoining insulator layer being positioned closer to the negative side of Z-axis than the intermediate insulator layer and adjoining the intermediate insulator layer;
a radiation conductor layer disposed in the multilayer body at a position closer to a positive side of Z-axis than the intermediate insulator layer;
a signal conductor layer disposed in the multilayer body at a position closer to the negative side of Z-axis than the intermediate insulator layer;
a connection conductor layer disposed on the negative-side principal surface of the intermediate insulator layer in the multilayer body, the connection conductor layer including a first connection portion, a second connection portion, a transmission line portion, a first intermediate portion, and a second intermediate portion; the first intermediate portion adjoining the first connection portion, the second intermediate portion adjoining the second connection portion, and the transmission line portion adjoining the first intermediate portion and the second intermediate portion;
a first ground conductor layer disposed in the multilayer body at a position closer to the negative side of Z-axis than the connection conductor layer and the signal conductor layer, the first ground conductor layer overlapping the connection conductor layer at least partially and also overlapping the signal conductor layer at least partially as viewed in the Z-axis direction;
a first inter-layer connection conductor being in contact with the first connection portion; and
a second inter-layer connection conductor being in contact with the second connection portion, wherein
one of the first inter-layer connection conductor and the second inter-layer connection conductor pierces through the intermediate insulator layer in the Z-axis direction and electrically connects the connection conductor layer and the radiation conductor layer to each other,
the other one of the first inter-layer connection conductor and the second inter-layer connection conductor pierces through the negative-side adjoining insulator layer in the Z-axis direction and electrically connects the connection conductor layer and the signal conductor layer to each other,
a longitudinal direction of the connection conductor layer is defined as a direction in which the connection conductor layer is elongated, and a line width direction of the connection conductor layer is defined as a direction orthogonally intersecting both the longitudinal direction and the Z-axis direction,
the first connection portion is positioned at a first end portion of the connection conductor layer in the longitudinal direction, and the second connection portion is positioned at a second end portion of the connection conductor layer in the longitudinal direction,
the first end portion and the second end portion of the connection conductor layer are positioned opposite to each other in the longitudinal direction,
in the longitudinal direction, opposite ends of the first connection portion are positioned equidistantly from a center of the first inter-layer connection conductor as viewed in the Z-axis direction,
in the longitudinal direction, opposite ends of the second connection portion are positioned equidistantly from a center of the second inter-layer connection conductor as viewed in the Z-axis direction,
in the line width direction, a maximum width of the second connection portion is smaller than a maximum width of the first connection portion,
the first intermediate portion includes a first thick-line portion of which a width is greater than that of the transmission line portion in the line width direction,
the second intermediate portion includes a second thick-line portion of which a width is greater than that of the transmission line portion in the line width direction, and
the first thick-line portion and the second thick-line portion adjoin the transmission line portion.
2. The multilayer substrate according to claim 1 , wherein
the width of the first thick-line portion is greater than that of the second thick-line portion in the line width direction.
3. The multilayer substrate according to claim 2 , wherein
the first intermediate portion includes a first thin-line portion of which a width is smaller than the width of the first thick-line portion in the line width direction,
the second intermediate portion includes a second thin-line portion of which a width is smaller than the width of the second thick-line portion in the line width direction,
the first thin-line portion adjoins the first connection portion, and
the second thin-line portion adjoins the second connection portion.
4. The multilayer substrate according to claim 2 , wherein
the first ground conductor layer overlaps the radiation conductor layer as viewed in the Z-axis direction.
5. The multilayer substrate according to claim 2 , wherein
the multilayer body includes a first segment and a second segment that are positioned next to each other in an X-axis direction that orthogonally intersects the Z-axis direction,
in the Z-axis direction, a thickness of the first segment is greater than a thickness of the second segment,
the connection conductor layer is positioned in the first segment, and
the signal conductor layer is positioned in the first segment and the second segment.
6. The multilayer substrate according to claim 2 , wherein
the multilayer body includes a first segment, a second segment, and a third segment that are positioned next to each other in this order in an X-axis direction that orthogonally intersects the Z-axis direction,
in the Z-axis direction, a thickness of the first segment is greater than that of the second segment,
in the Z-axis direction, a thickness of the third segment is greater than that of the second segment,
the multilayer substrate further comprises a second ground conductor layer positioned in the third segment and not positioned in the first segment nor in the second segment,
the first ground conductor layer is positioned in the first segment, the second segment, and the third segment,
the second ground conductor layer is positioned closer to the positive side of Z-axis than the signal conductor layer and overlaps the signal conductor layer at least partially as viewed in the Z-axis direction,
the signal conductor layer forms a microstrip line structure together with the first ground conductor layer in the first segment and the second segment, and
the signal conductor layer forms a strip line structure together with the first ground conductor layer and the second ground conductor layer in the third segment.
7. The multilayer substrate according to claim 2 , wherein
the multilayer body includes a first multilayer portion and a second multilayer portion,
the first multilayer portion includes the intermediate insulator layer and at least one insulator layer that is positioned closer to the positive side of Z-axis than the intermediate insulator layer,
the second multilayer portion includes at least one insulator layer that is positioned closer to the negative side of Z-axis than the intermediate insulator layer, and
a main insulating material of the second multilayer portion is different from a main insulating material of the first multilayer portion.
8. The multilayer substrate according to claim 7 , wherein
the main insulating material of the second multilayer portion has a Young's modulus smaller than that of the main insulating material of the first multilayer portion.
9. The multilayer substrate according to claim 2 , wherein
the multilayer body has flexibility, and
a material of the multiple insulator layers is a thermoplastic resin.
10. The multilayer substrate according to claim 1 , wherein
the first intermediate portion includes a first thin-line portion of which a width is smaller than the width of the first thick-line portion in the line width direction,
the second intermediate portion includes a second thin-line portion of which a width is smaller than the width of the second thick-line portion in the line width direction,
the first thin-line portion adjoins the first connection portion, and
the second thin-line portion adjoins the second connection portion.
11. The multilayer substrate according to claim 10 , wherein
in the line width direction, the width of the first thin-line portion and the width of the second thin-line portion are smaller than the width of the transmission line portion.
12. The multilayer substrate according to claim 1 , wherein
the first ground conductor layer overlaps the radiation conductor layer as viewed in the Z-axis direction.
13. The multilayer substrate according to claim 1 , wherein
the multilayer body includes a first segment and a second segment that are positioned next to each other in an X-axis direction that orthogonally intersects the Z-axis direction,
in the Z-axis direction, a thickness of the first segment is greater than a thickness of the second segment,
the connection conductor layer is positioned in the first segment, and
the signal conductor layer is positioned in the first segment and the second segment.
14. The multilayer substrate according to claim 1 , wherein
the multilayer body includes a first segment, a second segment, and a third segment that are positioned next to each other in this order in an X-axis direction that orthogonally intersects the Z-axis direction,
in the Z-axis direction, a thickness of the first segment is greater than that of the second segment,
in the Z-axis direction, a thickness of the third segment is greater than that of the second segment,
the multilayer substrate further comprises a second ground conductor layer positioned in the third segment and not positioned in the first segment nor in the second segment,
the first ground conductor layer is positioned in the first segment, the second segment, and the third segment,
the second ground conductor layer is positioned closer to the positive side of Z-axis than the signal conductor layer and overlaps the signal conductor layer at least partially as viewed in the Z-axis direction,
the signal conductor layer forms a microstrip line structure together with the first ground conductor layer in the first segment and the second segment, and
the signal conductor layer forms a strip line structure together with the first ground conductor layer and the second ground conductor layer in the third segment.
15. The multilayer substrate according to claim 1 , wherein
the multilayer body includes a first multilayer portion and a second multilayer portion,
the first multilayer portion includes the intermediate insulator layer and at least one insulator layer that is positioned closer to the positive side of Z-axis than the intermediate insulator layer,
the second multilayer portion includes at least one insulator layer that is positioned closer to the negative side of Z-axis than the intermediate insulator layer, and
a main insulating material of the second multilayer portion is different from a main insulating material of the first multilayer portion.
16. The multilayer substrate according to claim 15 , wherein
the main insulating material of the second multilayer portion has a Young's modulus smaller than that of the main insulating material of the first multilayer portion.
17. The multilayer substrate according to claim 15 , wherein
a material of the second inter-layer connection conductor is different from that of the first inter-layer connection conductor.
18. The multilayer substrate according to claim 15 , wherein
a material of the second inter-layer connection conductor is different from that of the first inter-layer connection conductor.
19. The multilayer substrate according to claim 1 , wherein
the multilayer body has flexibility.
20. The multilayer substrate according to claim 1 , wherein
a material of the multiple insulator layers is a thermoplastic resin.