Semiconductor memory device having connection pattern between the bit line contact and the separation insulating pattern
A semiconductor memory device includes active patterns spaced apart from each other in first and second directions intersecting each other, each active pattern having a central portion, a first end portion, and a second end portion, bit line contacts disposed on the central portions and spaced apart from each other in the first and second directions, separation insulating patterns, each of which is disposed between the bit line contacts adjacent to each other in the first and second directions, intermediate insulating patterns, each of which is disposed between the bit line contact and the separation insulating pattern which are adjacent to each other in the first direction, and connection patterns, each of which is disposed between the bit line contact and the separation insulating pattern which are adjacent to each other in the second direction.
1. A semiconductor memory device, comprising:
active patterns spaced apart from each other in a first direction and a second direction intersecting the first direction, each of the active patterns including a central portion, a first end portion, and a second end portion;
bit line contacts spaced apart from each other in the first direction and the second direction, each of the bit line contacts being on a corresponding central portion;
separation insulating patterns between the bit line contacts, each of the separation insulating patterns being between adjacent ones of the bit line contacts in the first direction and the second direction;
intermediate insulating patterns between the bit line contacts and the separation insulating patterns, each of the intermediate insulating patterns being between one of the bit line contacts and one of the separation insulating patterns that are adjacent to each other in the first direction; and
connection patterns between the bit line contacts and the separation insulating patterns, each of the connection patterns being between one of the bit line contacts and one of the separation insulating patterns that are adjacent to each other in the second direction.
2. The semiconductor memory device as claimed in claim 1 , wherein bottom surfaces of the bit line contacts are at a higher height than bottom surfaces of the separation insulating patterns.
3. The semiconductor memory device as claimed in claim 1 , wherein a depth from top surfaces of the first and second end portions to bottom surfaces of the bit line contacts is less than a depth from the top surfaces of the first and second end portions to bottom surfaces of the separation insulating patterns.
4. The semiconductor memory device as claimed in claim 1 , wherein a top surface of the central portion is at a substantially same height as or a lower height than top surfaces of the first and second end portions.
5. The semiconductor memory device as claimed in claim 1 , wherein each of the separation insulating patterns is between the first end portion of a first one of a pair of the active patterns and the second end portion of a second one of the pair of the active patterns, the pair of the active patterns being adjacent to each other in the first direction.
6. The semiconductor memory device as claimed in claim 1 , wherein:
the bit line contacts include a line of the bit line contacts arranged in the first direction,
the separation insulating patterns include a line of the separation insulating patterns arranged in the first direction, and
the line of the bit line contacts and the line of the separation insulating patterns are alternately arranged in the first direction.
7. The semiconductor memory device as claimed in claim 1 , wherein:
each of the connection patterns includes a first surface facing an adjacent one of the separation insulating patterns in the second direction, and
the first surface is concavely recessed from the adjacent one of the separation insulating patterns when viewed in a plan view.
8. The semiconductor memory device as claimed in claim 7 , wherein:
each of the connection patterns further includes a second surface facing an adjacent one of the bit line contacts in the second direction, and
the second surface is concavely recessed from the adjacent one of the bit line contacts when viewed in a plan view.
9. The semiconductor memory device as claimed in claim 1 , wherein the intermediate insulating patterns extend in the second direction and are spaced apart from each other in the first direction.
10. The semiconductor memory device as claimed in claim 1 , wherein the separation insulating patterns extend in a third direction intersecting the first and second directions.
11. The semiconductor memory device as claimed in claim 1 , wherein:
each of the connection patterns includes a first surface facing an adjacent one of the separation insulating patterns in the second direction, and
the first surface extends in a third direction intersecting the first direction and the second direction.
12. The semiconductor memory device as claimed in claim 11 , wherein:
each of the connection patterns further includes a second surface facing an adjacent one of the bit line contacts in the second direction, and
the second surface is concavely recessed from the adjacent one of the bit line contacts when viewed in a plan view.
13. The semiconductor memory device as claimed in claim 1 , wherein each of the intermediate insulating patterns has a bar shape extending lengthwise in the second direction.
14. A semiconductor memory device, comprising:
active patterns spaced apart from each other in a first direction and a second direction intersecting the first direction, each of the active patterns including a central portion, a first end portion, and a second end portion;
bit line contacts spaced apart from each other in the first direction and the second direction, each of the bit line contacts being on a corresponding central portion;
separation insulating patterns between the bit line contacts, each of the separation insulating patterns extending in a third direction intersecting the first direction and the second direction; and
connection patterns between the bit line contacts and the separation insulating patterns, each of the connection patterns being between one of the bit line contacts and one of the separation insulating patterns that are adjacent to each other in the second direction.
15. The semiconductor memory device as claimed in claim 14 , wherein bottom surfaces of the bit line contacts are at a higher height than bottom surfaces of the separation insulating patterns.
16. The semiconductor memory device as claimed in claim 14 , wherein a depth from top surfaces of the first and second end portions to bottom surfaces of the bit line contacts is less than a depth from the top surfaces of the first and second end portions to bottom surfaces of the separation insulating patterns.
17. A semiconductor memory device, comprising:
active patterns spaced apart from each other in a first direction and a second direction intersecting the first direction, each of the active patterns including a central portion, a first end portion, and a second end portion;
word lines extending in the second direction in the active patterns;
bit line contacts spaced apart from each other in the first direction and the second direction, each of the bit line contacts being on a corresponding central portion;
bit lines extending in the first direction on the bit line contacts;
separation insulating patterns between the bit line contacts, each of the separation insulating patterns being between adjacent ones of the bit line contacts in the first direction and the second direction;
contact plugs between the bit lines;
intermediate insulating patterns between the bit line contacts and the separation insulating patterns, each of the intermediate insulating patterns being between one of the bit line contacts and one of the separation insulating patterns that are adjacent to each other in the first direction;
connection patterns between the bit line contacts and the separation insulating patterns, each of the connection patterns connecting between each of the first and second end portions to each of the contact plugs that are adjacent to each other in the second direction;
landing pads on the contact plugs; and
data storage patterns connected to the first and second end portions through the contact plugs and the landing pads.
18. The semiconductor memory device as claimed in claim 17 , wherein bottom surfaces of the bit line contacts are at a higher height than bottom surfaces of the separation insulating patterns.
19. The semiconductor memory device as claimed in claim 17 , wherein:
the bit line contacts include a line of the bit line contacts arranged in the first direction,
the separation insulating patterns include a line of the separation insulating patterns arranged in the first direction, and
the line of the bit line contacts and the line of the separation insulating patterns are alternately arranged in the first direction.
20. The semiconductor memory device as claimed in claim 17 , wherein the separation insulating patterns extend in a third direction intersecting the first direction and the second direction.