High-voltage electrostatic discharge device
The present disclosure relates to semiconductor structures and, more particularly, to high-voltage electrostatic discharge devices and methods of manufacture. The structure includes: a semiconductor material including an emitter region, a base region adjacent to the emitter region; and a collector region; a thermally grown insulator region on the semiconductor material extending from the base region to the collector region; and a field plate on the thermally grown insulator region and overlapping with the base region.
1. A structure comprising:
a semiconductor material comprising an emitter region, a base region adjacent to the emitter region, and a collector region;
a thermally grown insulator region on the semiconductor material extending from the base region to the collector region; and
a field plate on the thermally grown insulator region, partially overlapping with the base region, laterally remote from a side edge of the collector region and closer to the emitter region than the collector region,
wherein the emitter region comprises a stepped junction, the stepped junction comprises p-typed doped regions at different depths of the semiconductor material in which a first region of the p-typed doped regions laterally abuts the base region and a second region of the p-typed doped regions is deeper than the first region and is remotely positioned away from the base region.
2. The structure of claim 1 , wherein the field plate is polysilicon material.
3. The structure of claim 1 , wherein the field plate extends over a drift region comprising the semiconductor material that separates the collector region and the base region.
4. The structure of claim 1 , further comprising a silicide block material on the thermally grown insulator region, adjacent to the field plate and extending to over the collector region.
5. The structure of claim 1 ,
wherein the thermally grown insulator region comprises a local oxidation of the semiconductor material which extends above a top surface of the semiconductor material, and further comprising:
a doped region in the semiconductor material, the doped region being separated from the emitter region by a shallow trench isolation region, the doped region being electrically connected to the base region and the field plate by a first metal field plate extending over the emitter region and the field plate.
6. The structure of claim 1 , wherein the emitter region comprises a first dopant type partially extending within the base region comprising a second dopant type.
7. The structure of claim 6 , further comprising a second field plate on the thermally grown insulator region and electrically connected to the collector region.
8. A structure comprising:
a semiconductor material comprising an emitter region, a base region adjacent to the emitter region, and a collector region;
a thermally grown insulator region on the semiconductor material extending from the base region to the collector region;
a field plate on the thermally grown insulator region, partially overlapping with the base region, laterally remote from a side edge of the collector region and closer to the emitter region than the collector region; and
a first metal field plate that extends over the emitter region and the field plate and electrically connects to the emitter region, the base region and the field plate, and a second metal field plate electrically connected to the collector region.
9. The structure of claim 8 , further comprising a second field plate on the thermally grown insulator region which electrically connects to the collector region.
10. A structure comprising:
a semiconductor material comprising an emitter region of a first dopant type, a base region of a second dopant type, and a collector region of the first dopant type;
a thermal oxide region in the semiconductor material extending from the base region to the collector region;
a field plate on the thermal oxide region and partially overlapping with the base region; and
a wiring structure electrically coupling the field plate to the base region and the emitter region, wherein the wiring structure comprises a first metal field plate that extends over the emitter region and the field plate and electrically connects to the emitter region, the base region and the field plate, and a second metal field plate electrically connected to the collector region.
11. The structure of claim 10 , further comprising a silicide block material on the thermal oxide region adjacent to the field plate.
12. The structure of claim 10 , wherein the thermal oxide region extends within and above a surface of the semiconductor material, and thermal oxide region spans over a portion of the semiconductor material that separates the collector region from the base region.
13. The structure of claim 10 , further comprising a second field plate on the thermal oxide region, the second field plate being electrically coupled to the collector region.
14. The structure of claim 10 , wherein the emitter region comprises a stepped junction with the first dopant type at different concentrations.
15. The structure of claim 10 , wherein the emitter region of the first dopant type is partially within the base region of the second dopant type, and the field plate on the thermal oxide is laterally remote from a side edge of the collector region and closer to the emitter region than the collector region.
16. The structure of claim 10 , wherein the emitter region of the first dopant type is fully within the base region of the second dopant type.