Granted Patent B2

US 12,455,193 · App. 17/890,120 · Granted Oct 28, 2025

Inventors: Tien C. Nguyen (Täby, SE); Henning Hagman (Täby, SE)

Assignee: FLIR Systems AB

G01J5/00G06T5/50G06V10/25G06V10/98G01J2005/0077G06T2207/10048G06T2207/20221

Abstract

Claims (64)

1 . A method comprising

determining a first temperature associated with a scene based on a first infrared image of the scene;

determining a first sensitivity setting based on a first ambient temperature associated with an infrared imager and the first temperature associated with the scene; and

capturing, by the infrared imager, a second infrared image of the scene using the first sensitivity setting.

2 . The method of claim 1 , further comprising:

determining a second temperature associated with the scene based on the second infrared image;

determining a second ambient temperature associated with the infrared imager;

determining a second sensitivity setting based on the second ambient temperature and the second temperature associated with the scene;

selectively setting the infrared imager to the second sensitivity setting based on a threshold; and

capturing, by the infrared imager, a third infrared image of the scene using the first sensitivity setting or the second sensitivity setting.

3 . The method of claim 1 , further comprising:

capturing, by the infrared imager using a second sensitivity setting, the first infrared image of the scene; and

applying a first correction term associated with the second sensitivity setting to the first infrared image to obtain a first corrected infrared image.

4 . The method of claim 3 , further comprising:

determining a second correction term based on the first sensitivity setting; and

applying the second correction term to the second infrared image to obtain a second corrected infrared image.

5 . The method of claim 3 , wherein the second sensitivity setting is associated with a lower sensitivity than the first sensitivity setting.

6 . The method of claim 1 , further comprising adjusting the infrared imager based on the first sensitivity setting.

7 . The method of claim 6 , wherein the adjusting comprises adjusting an integration time associated with the infrared imager, a capacitance associated with the infrared imager, and/or a bias voltage associated with the infrared imager.

8 . The method of claim 1 , further comprising:

identifying a first portion of the second infrared image encompassing an object;

determining a temperature of the object based on the first portion of the second infrared image;

determining a first set of image capture parameters based on the temperature of the object; and

capturing, by the infrared imager, a third infrared image of the scene using the first set of image capture parameters.

9 . The method of claim 8 , further comprising determining a first temperature range based on the determined temperature of the object, wherein the first set of image capture parameters is further based on the first temperature range.

10 . The method of claim 9 , further comprising:

determining a second temperature range based on a second portion of the second infrared image;

determining a second set of image capture parameters based on the second temperature range;

capturing, by the infrared imager, a fourth infrared image of the scene using the second set of image capture parameters; and

generating a composite image based at least on the third infrared image and the fourth infrared image.

11 . An infrared imaging system comprising:

an infrared imager configured to capture a first infrared image of a scene using a first sensitivity setting; and

a logic device configured to:

determine a first temperature associated with the scene based on a second infrared image of the scene; and

determine the first sensitivity setting based on a first ambient temperature associated with the infrared imager and the first temperature associated with the scene.

12 . The infrared imaging system of claim 11 , wherein:

the infrared imager is further configured to capture a third infrared image of the scene using the first sensitivity setting or a second sensitivity setting; and

the logic device is further configured to:

determine a second temperature associated with the scene based on the first infrared image;

determine a second ambient temperature associated with the infrared imager;

determine the second sensitivity setting based on the second ambient temperature and the second temperature associated with the scene; and

selectively set the infrared imager to the second sensitivity setting based on a threshold.

13 . The infrared imaging system of claim 11 , wherein:

the infrared imager is further configured to capture the second infrared image of the scene using a second sensitivity setting; and

the logic device is further configured to apply a first correction term associated with the second sensitivity setting to the first infrared image to obtain a first corrected infrared image.

14 . The infrared imaging system of claim 13 , wherein the logic device is further configured to:

determine a second correction term based on the first sensitivity setting; and

apply the second correction term to the first infrared image to obtain a second corrected infrared image.

15 . The infrared imaging system of claim 13 , wherein the second sensitivity setting is associated with a higher sensitivity than the first sensitivity setting.

16 . The infrared imaging system of claim 11 , wherein the logic device is configured to cause adjustment of the infrared imager based on the first sensitivity setting, and wherein the adjustment comprises an adjustment to an integration time associated with the infrared imager, an adjustment to a capacitance associated with the infrared imager, and/or an adjustment to a bias voltage associated with the infrared imager.

17 . The infrared imaging system of claim 11 , wherein:

the logic device is further configured to:

identify a first portion of the first infrared image encompassing an object;

determine a temperature of the object based on the first portion of the first infrared image; and

determine a first set of image capture parameters based on the temperature of the object; and

the infrared imager is further configured to capture a third infrared image of the scene using the first set of image capture parameters.

18 . The infrared imaging system of claim 17 , wherein the logic device is further configured to determine a first temperature range based on the determined temperature of the object, and wherein the first set of image capture parameters is further based on the first temperature range.

19 . The infrared imaging system of claim 18 , wherein:

the infrared imager is further configured to a fourth infrared image of the scene using a second set of image capture parameters;

the logic device is further configured to:

determine a second temperature range based on a second portion of the second infrared image;

determine the second set of image capture parameters based on the second temperature range; and

generate a composite image based at least on the third infrared image and the fourth infrared image.

20 . The infrared imaging system of claim 11 , wherein the infrared imager comprises a plurality of microbolometers.

Assignments (1)

Continuity (2)

References Cited (23)