Heat dissipating element
An electronic device includes an electronic die in a package and a heat diffusion element. The heat diffusion element is made of a thermally-conductive material and is formed of a single block (unitary body) that includes: a main portion resting on at least a portion of an upper surface of the electronic die; at least one secondary portion flush with an upper surface of the package; and at least one intermediate portion coupling the main portion to the at least one secondary portion.
1. An electronic device, comprising:
an electronic die within a package; and
a heat diffusion element made of a thermally-conductive material;
wherein said heat diffusion element comprises:
a main portion resting on at least a portion of an upper surface of the electronic die;
at least one secondary portion flush with an upper surface of the package; and
at least one intermediate portion coupling the main portion to the at least one secondary portion;
wherein each secondary portion is formed of a first portion having the shape of a rectangle and a second portion having the shape of a trapezoid, one side of the rectangle and a long base of the trapezoid being contiguous.
2. The device according to claim 1 , wherein the heat diffusion element is formed of a single block.
3. The device according to claim 2 , wherein the main portion is located in a first plane and the at least one secondary portion is located in a second plane, the first and second planes being distinct and parallel.
4. The device according to claim 3 , wherein said at least one intermediate portion extends at an angle relative to a perpendicular from the first and second planes.
5. The device according to claim 3 , wherein a distance between the first and second planes is greater than 90 nm.
6. The device according to claim 1 , wherein the main portion rests on at least 75% of the upper surface of the electronic die.
7. The device according to claim 1 , wherein the electronic die is electrically coupled to a support by a lower surface of the electronic die, the main portion entirely covering the upper surface of the electronic die.
8. The device according to claim 1 , wherein the electronic die is electrically coupled to a support by electric wires, the main portion partially covering the upper surface of the electronic die.
9. The device according to claim 8 , wherein the package comprises a protection layer, the at least one secondary portion being flush with an upper surface of the protection layer.
10. The device according to claim 9 , wherein the main portion is covered with a region of the protection layer.
11. The device according to claim 9 , wherein the electric wires are separated from the heat diffusion element by a region of the protection layer.
12. The device according to claim 1 , wherein the main portion is bonded to the electronic die by thermal glue.
13. The device according to claim 1 , wherein the heat diffusion element comprises four secondary portions and four intermediate portions, each secondary portion being coupled by one of the intermediate portions to a different side of the main portion.
14. The device according to claim 1 , wherein the at least one intermediate portion forms an angle with a normal direction orthogonal to the main portion in a range from 5° to 45°.
15. An electronic device, comprising:
an electronic die; and
a heat diffusion element made of a thermally-conductive material;
wherein said heat diffusion element comprises:
a main portion on a first plane mounted to an upper surface of the electronic die;
at least one secondary portion on a second plane; and
at least one intermediate portion coupling the main portion to the at least one secondary portion and extending at an angle relative to a perpendicular from the first and second planes;
wherein said at least one secondary portion comprises a first portion having, in the second plane, the shape of a rectangle and a second portion having, in the second plane, the shape of a trapezoid, one side of the rectangle and a long base of the trapezoid being contiguous.
16. The device according to claim 15 , wherein the electronic die is encapsulated within a package having an upper surface coplanar with the second plane.
17. The device according to claim 16 , wherein the package further encapsulates the main portion and the at least one intermediate portion.
18. The device according to claim 15 , wherein the heat diffusion element is formed of a single block.
19. The device according to claim 15 , wherein the heat diffusion element comprises four secondary portions and four intermediate portions, each secondary portion being coupled by one of the intermediate portions to a different side of the main portion.
20. The device according to claim 15 , wherein the at least one intermediate portion forms an angle with a normal direction orthogonal to the first and second planes in a range from 5° to 45°.