Alternative alignment technique for semiconductor device transfer print process
A method of aligning a semiconductor device for use in a storage device disclosed herein includes providing a semiconductor device on a first substrate. The first substrate includes a first alignment mark. A recording head comprising a second alignment mark is provided on a second substrate. A transfer print head comprising a third alignment mark is also provided. The transfer print head is aligned to the semiconductor device on the first substrate. After the transfer print head is aligned to the semiconductor device, the semiconductor device is transfer printed from the first substrate onto the second substrate. The transfer printing includes aligning the third alignment mark on the transfer print head to the second alignment mark on the second substrate.
1 . A method of aligning a semiconductor device for use in a storage device, the method comprising the steps of:
providing a semiconductor device on a first substrate, wherein the first substrate includes a first alignment mark;
providing a recording head on a second substrate, wherein the second substrate includes a second alignment mark;
providing a transfer print head, wherein the transfer print head includes a third alignment mark;
aligning the transfer print head to the semiconductor device on the first substrate; and
transfer printing the semiconductor device from the first substrate onto the second substrate, wherein the transfer printing includes aligning the third alignment mark on the transfer print head to the second alignment mark on the second substrate.
2 . The method of claim 1 , wherein providing the recording head on the second substrate includes aligning the recording head to the second alignment mark on the second substrate.
3 . The method of claim 2 , wherein aligning the recording head to the second alignment mark on the second substrate includes aligning the recording head to within −200 nm to +200 nm in an x-direction.
4 . The method of claim 2 , wherein aligning the recording head to the second alignment mark on the second substrate includes aligning the recording head to within −200 nm to +200 nm in a y-direction.
5 . The method of claim 1 , wherein aligning the transfer print head to the semiconductor device includes aligning the third alignment mark on the transfer print head to the first alignment mark on the first substrate.
6 . The method of claim 5 , wherein aligning the third alignment mark on the transfer print head to the first alignment mark on the first substrate includes aligning the transfer print head to within −200 nm to +200 nm in an x-direction.
7 . The method of claim 5 , wherein aligning the third alignment mark on the transfer print head to the first alignment mark on the first substrate includes aligning the transfer print head to within −200 nm to +200 nm in a y-direction.
8 . The method of claim 1 , wherein aligning the third alignment mark on the transfer print head to the second alignment mark on the second substrate includes aligning the transfer print head to within −200 nm to +200 nm in an x-direction.
9 . The method of claim 1 , wherein aligning the third alignment mark on the transfer print head to the second alignment mark on the second substrate includes aligning the transfer print head to within −200 nm to +200 nm in a y-direction.
10 . The method of claim 1 , wherein the recording head includes a waveguide.
11 . The method of claim 1 , wherein the semiconductor device comprises a laser diode.
12 . The method of claim 1 , wherein the first alignment mark includes at least one vertical edge.
13 . The method of claim 1 , wherein the first alignment mark includes at least one horizontal edge.
14 . The method of claim 1 , wherein the second alignment mark includes at least one vertical edge.
15 . The method of claim 1 , wherein the second alignment mark includes at least one horizontal edge.
16 . The method of claim 1 , wherein the third alignment mark includes at least one vertical edge.
17 . The method of claim 1 , wherein the third alignment mark includes at least one horizontal edge.
18 . A method of aligning a laser diode for use in a storage device, the method comprising the steps of:
providing a laser diode on a first substrate, wherein the first substrate includes a first alignment mark;
providing a recording head comprising a waveguide on a second substrate, wherein the second substrate includes a second alignment mark;
providing a transfer print head, wherein the transfer print head includes a third alignment mark;
aligning the transfer print head to the laser diode, wherein the alignment includes aligning the third alignment mark on the transfer print head to the first alignment mark on the first substrate and wherein aligning the third alignment mark on the transfer print head to the first alignment mark on the first substrate includes aligning the transfer print head to within −300 nm to +300 nm in an x-direction and to within −300 nm to +300 nm in a y-direction; and
transfer printing the laser diode from the first substrate onto the second substrate, wherein the transfer printing includes aligning the third alignment mark on the transfer print head to the second alignment mark on the second substrate and wherein aligning the third alignment mark on transfer print head to the second alignment mark on second substrate includes aligning the transfer print head to within −300 nm to +300 nm in an x-direction and to within −300 nm to +300 nm in a y-direction.