IP Library › Granted Patent US 12,463,013
Granted Patent B2
US 12,463,013 · App. 18/583,943 · Granted Nov 4, 2025

Plasma processing apparatus

Inventors: Taro Ikeda (Nirasaki, JP); Yuki Osada (Nirasaki, JP); Hiroyuki Miyashita (Nirasaki, JP)
Assignee: Tokyo Electron Limited
H01J37/32256H01J37/3222H01J37/32238H01J37/32293
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Quick Facts
Patent No.
US 12,463,013
App. No.
18/583,943
Granted
Nov 4, 2025
Kind
B2
Abstract

A plasma processing apparatus includes: a processing container; a resonator configured to resonate electromagnetic waves to be supplied; a slot antenna connected to the resonator; and a transmission window configured to transmit the electromagnetic waves radiated from the slot antenna and supply the electromagnetic waves into the processing container, wherein the resonator includes: an input port including an inner shaft and an outer cylinder; an output port including an inner shaft and an outer cylinder; a power supply fin connecting the inner shaft of the input port and the inner shaft of the output port and provided in the resonator; and a ground fin connected to the outer cylinder of the input port and the outer cylinder of the output port at a same potential and provided to protrude within the resonator so as to be inserted between fins of the power supply fin.

Claims (21)

1 . A plasma processing apparatus, comprising:

a processing container;

a resonator configured to resonate electromagnetic waves to be supplied;

a slot antenna connected to the resonator; and

a transmission window configured to transmit the electromagnetic waves radiated from the slot antenna and supply the electromagnetic waves into the processing container,

wherein the resonator includes:

an input port including an inner shaft and an outer cylinder;

an output port including an inner shaft and an outer cylinder;

a power supply fin connecting the inner shaft of the input port and the inner shaft of the output port and provided in the resonator; and

a ground fin connected to the outer cylinder of the input port and the outer cylinder of the output port at a same potential and provided to protrude within the resonator so as to be inserted between fins of the power supply fin.

2 . The plasma processing apparatus of claim 1 , wherein a dielectric is provided between the power supply fin and the ground fin.

3 . The plasma processing apparatus of claim 1 , wherein each of the input port and the output port has a coaxial structure.

4 . The plasma processing apparatus of claim 1 , wherein each of the power supply fin and the ground fin has a cylindrical shape.

5 . The plasma processing apparatus of claim 4 , wherein the power supply fin is a multipole antenna.

6 . The plasma processing apparatus of claim 1 , further comprising a phase adjustor configured to adjust a phase of the electromagnetic waves adjacent to the slot antenna of the output port.

7 . The plasma processing apparatus of claim 1 , wherein the ground fin is configured to be capable of changing a depth of insertion into the power supply fin.

8 . The plasma processing apparatus of claim 7 , wherein a dielectric is provided between the power supply fin and the ground fin, and

wherein the ground fin moves along the dielectric when the depth of insertion into the power supply fin changes.

9 . The plasma processing apparatus of claim 1 , wherein the processing container includes a plasma generating room, and

wherein the transmission window is configured to supply the electromagnetic waves into the plasma generating room.

10 . The plasma processing apparatus of claim 1 , wherein sets of the resonator, the slot antenna, and the transmission window are provided at the processing container.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 22, 2024
From: IKEDA, TARO; OSADA, YUKI; MIYASHITA, HIROYUKI
To: TOKYO ELECTRON LIMITED
Reel/Frame 066525/0616 →
Priority Claims (1)
JP 2023-031114 · Mar 1, 2023 · national
Continuity (1)
Related Publication 20240297020A1 · Sep 5, 2024
References Cited (2)
US 20250104977A1 · Ikeda · 2025 [cited by examiner]
JP 2011014542A · 2011 [cited by applicant]
Cited By (1)
US 12,614,699