Substrate treating apparatus and substrate treating method
Provided is an apparatus for treating a substrate including: a processing vessel having a processing space; a support unit for supporting the substrate in the processing space and rotating the substrate; a liquid supply unit for supplying a processing liquid to the substrate; and a heating unit for heating the substrate, wherein the support unit includes: a spin chuck; a rotation driver for rotating the spin chuck; a chuck pin installed on the spin chuck to be rotated with the spin chuck; a chuck pin moving unit for moving the chuck pin between a contact position wherein the chuck pin is in contact with a side portion of the substrate and an open position at which the chuck pin is spaced apart from the side portion of the substrate, and the chuck pin moving unit moves the chuck pin while the substrate is rotated by the spin chuck.
1 . An apparatus for treating a substrate, the apparatus comprising:
a processing vessel having a processing space;
a support unit for supporting the substrate in the processing space and rotating the substrate;
a liquid supply unit for supplying a processing liquid to the substrate supported by the support unit; and
a heating unit for heating the substrate,
wherein the support unit includes:
a spin chuck;
a rotation driver for rotating the spin chuck;
a chuck pin installed on the spin chuck so as to be rotated together with the spin chuck; and
a chuck pin moving unit including a cam ring, a cam ring driver for rotating the cam ring, and a slip-ring assembly for providing power to the cam ring driver, wherein the chuck pin moving unit is configured for moving the chuck pin between a contact position at which the chuck pin is in contact with a side portion of the substrate and an open position at which the chuck pin is spaced apart from the side portion of the substrate, and
the chuck pin moving unit moves the chuck pin while the substrate is rotated by the spin chuck.
2 . The apparatus of claim 1 , wherein the slip-ring assembly includes:
a ring member rotated together with the spin chuck; and
a brush member provided to be movable with respect to the ring member; and
a moving member for moving the brush member in a direction closer to the ring member or a direction away from the ring member.
3 . The apparatus unit of claim 2 , wherein the brush member is provided to be selectively contactable to the ring member by the moving member.
4 . The apparatus of claim 2 , wherein the cam ring includes a protrusion protruding from an outer surface, and
the chuck pin moving unit includes a rod member having one end coupled to the chuck pin and the other end that is in contact with the protrusion.
5 . The apparatus of claim 4 , wherein the protrusion includes a first inclined surface having a first inclination angle with respect to the outer surface of the cam ring, and a second inclined surface having a second inclination angle greater than the first inclination angle, and
the other end of the rod member is provided to be movable along the first inclined surface of the protrusion.
6 . The apparatus of claim 5 , wherein the protrusion includes a first position closest to the outer surface of the cam ring on the first inclined surface, and a second position located farthest apart from the outer surface of the cam ring on the first inclined surface, and
the other end of the rod member is moved between the first position and the second position.
7 . The apparatus of claim 6 , wherein when the other end of the rod member is located at the first position, the chuck pin is located at the contact position, and
when the other end of the rod member is located at the second position, the chuck pin is located at the open position.
8 . The apparatus of claim 7 , wherein the spin chuck is rotated such that the substrate is rotated at a first speed or a second speed faster than the first speed, and
the chuck pin moving unit locates the chuck pin at the open position while the substrate is rotated at the first speed.
9 . The apparatus of claim 7 , wherein the spin chuck is rotated such that the substrate is rotated at a first speed or a second speed faster than the first speed,
the brush member is in contact with the ring member when the substrate is rotated at the first speed, and
the brush member is not in contact with the ring member when the substrate is rotated at the second speed.
10 . The apparatus of claim 9 , wherein when the brush member is in contact with the ring member, the slip-ring assembly provides power to the cam ring driver, and
when the brush member is not in contact with the ring member, the slip-ring assembly does not provide power to the cam ring driver.
11 . The apparatus of claim 1 , wherein the spin chuck has a through-hole penetrating in a vertical direction, and
the heating unit heats a bottom surface of the substrate through the through-hole.
12 . The apparatus of claim 11 , wherein the heating unit includes a laser.
13 . The apparatus of claim 12 , wherein the spin chuck includes:
a body portion; and
an extension portion extending upwardly from an upper end of the body portion, and
wherein an inner diameter of the extension portion increases toward the upper direction.
14 . An apparatus for treating a substrate, the apparatus comprising:
a processing vessel having a processing space;
a support unit for supporting the substrate in the processing space and rotating the substrate; and
a liquid supply unit for supplying a processing liquid to the substrate supported by the support unit;
wherein the support unit includes:
a spin chuck;
a rotation driver for rotating the spin chuck;
a chuck pin installed on the spin chuck so as to be rotated together with the spin chuck; and
a chuck pin moving unit including a cam ring, a cam ring driver for rotating the cam ring, and a slip-ring assembly for providing power to the cam ring driver, wherein the chuck pin moving unit is configured for moving the chuck pin between a contact position at which the chuck pin is in contact with a side portion of the substrate and an open position at which the chuck pin is spaced apart from the side portion of the substrate.
15 . The apparatus of claim 14 , wherein the slip-ring assembly includes:
a ring member rotated together with the spin chuck; and
a brush member provided to be movable with respect to the ring member; and
a moving member for moving the brush member in a direction closer to the ring member or a direction away from the ring member,
wherein the brush member is provided to be selectively contactable to the ring member by the moving member.
16 . The apparatus of claim 15 , wherein the cam ring includes a protrusion protruding from an outer surface, and
the chuck pin moving unit includes a rod member having one end coupled to the chuck pin and the other end that is in contact with the protrusion.
17 . The apparatus of claim 16 , wherein the protrusion includes a first inclined surface having a first inclination angle with respect to the outer surface of the cam ring, and a second inclined surface having a second inclination angle greater than the first inclination angle, and
the other end of the rod member is provided to be movable along the first inclined surface of the protrusion.
18 . The apparatus of claim 17 , wherein the protrusion includes a first position closest to the outer surface of the cam ring on the first inclined surface, and a second position located farthest apart from the outer surface of the cam ring on the first inclined surface, and
the other end of the rod member is moved between the first position and the second position.
19 . The apparatus of claim 18 , wherein when the other end of the rod member is located at the first position, the chuck pin is located at the contact position, and
when the other end of the rod member is located at the second position, the chuck pin is located at the open position.
20 . The apparatus of claim 15 , wherein when the brush member is in contact with the ring member, the slip-ring assembly provides power to the cam ring driver, and
when the brush member is not in contact with the ring member, the slip-ring assembly does not provide power to the cam ring driver.