Method for selectively depositing a conductive coating over a patterning coating and device including a conductive coating
A device includes: (1) a substrate; (2) a patterning coating covering at least a portion of the substrate, the patterning coating including a first region and a second region; and (3) a conductive coating covering the second region of the patterning coating, wherein the first region has a first initial sticking probability for a material of the conductive coating, the second region has a second initial sticking probability for the material of the conductive coating, and the second initial sticking probability is different from the first initial sticking probability.
1 . A device comprising:
a substrate;
a first coating covering at least a portion of the substrate, the first coating comprising a single layer divided into one of: a first region, and a second region, each extending substantially laterally along the substrate; and
a second coating comprising a metallic material, covering substantially all of the second region of the first coating;
wherein:
the first coating covering the first region has a first initial sticking probability for a material of the second coating, the first coating covering the second region has a second initial sticking probability for the material of the second coating, and the second initial sticking probability is different from the first initial sticking probability;
one of: the first region, and the second region, of the first coating comprises a first coating material, and the other of: the first region, and the second region, of the first coating comprises a treated first coating material, wherein the treated first coating material is a chemically modified material of the first coating material; and
the second coating absorbs light incident thereon.
2 . The device of claim 1 , wherein the second coating comprises at least one disconnected cluster on a surface of the first coating.
3 . The device of claim 1 , wherein the second coating partially overlaps the first coating.
4 . The device of claim 1 , wherein the second initial sticking probability is at least that of the first initial sticking probability.
5 . The device of claim 1 , wherein the first region has a first degree of crystallinity, the second region has a second degree of crystallinity, and the second degree of crystallinity is at least that of the first degree of crystallinity.
6 . The device of claim 1 , wherein the first region is substantially free of the first coating.
7 . The device of claim 1 , wherein the device is an opto-electronic device.
8 . The device of claim 7 , wherein the device is an organic light emitting diode device.
9 . The device of claim 8 , wherein the substrate comprises an emissive region and a non-emissive region.
10 . The device of claim 9 , wherein the first region is arranged to cover the emissive region, and the second region is arranged to cover the non-emissive region.
11 . The device of claim 10 , wherein the substrate further comprises, in the emissive region, a first electrode, a second electrode, and at least one semiconducting layer therebetween.
12 . The device of claim 11 , wherein the at least one semiconducting layer comprises an emissive layer.
13 . The device of claim 11 , wherein the substrate further comprises a thin film transistor, and the thin film transistor is electrically coupled with the second coating.
14 . The device of claim 11 , wherein a sheet resistance of the second coating is no more than that of the second electrode.
15 . The device of claim 10 , wherein the non-emissive region comprises a buffer region adjacent to the emissive region, and at least one of: the second coating, and the at least one disconnected cluster thereof, is provided in the buffer region.
16 . The device of claim 1 , wherein the first coating comprises a first surface region and a second surface region, the first surface region being disposed in the first region, and the second surface region being disposed in the second region.
17 . The device of claim 16 , wherein a concentration of an oxygen species in the second surface region is at least that in the first surface region.
18 . The device of claim 1 , wherein the first region of the first coating comprises a first material, and the second region of the first coating comprises a second different material.
19 . The device of claim 18 , wherein an average molecular weight of the first material is no more than that of the second material.
20 . The device of claim 1 , wherein the first region and the second region of the first coating are integrally formed with each other.
21 . The device of claim 1 , wherein the second coating comprises magnesium.
22 . The device of claim 10 , wherein the non-emissive region comprises a light transmissive region, and the first region is arranged to cover the light transmissive region.
23 . A method of selectively depositing a second coating, the method comprising actions of:
providing a substrate and a first coating covering a surface of the substrate in a single layer;
treating the first coating to divide it into a first region having a first initial sticking probability for a metallic material, and a second region having a second initial sticking probability for the metallic material; and
depositing the metallic material to form a second coating covering substantially all of the second region of the first coating.
24 . The method of claim 23 , wherein the second coating absorbs light incident thereon.
25 . The method of claim 23 , wherein the second coating comprises at least one disconnected cluster on a surface of the first coating.
26 . The device of claim 25 , wherein, upon treating the first coating, a portion of the first coating is partially treated, and at least one of: the second coating, and the at least one disconnected cluster thereof, is provided in the partially treated portion.
27 . The method of claim 23 , wherein the second coating partially overlaps the first coating.
28 . The method of claim 23 , wherein the second initial sticking probability is at least that of the first initial sticking probability.
29 . The method of claim 23 , wherein the action of treating comprises an action of exposing the second region to electromagnetic radiation.
30 . The method of claim 29 , wherein the electromagnetic radiation is one of: ultraviolet radiation, and extreme ultraviolet radiation.
31 . The method of claim 23 , wherein the first coating comprises a patterning coating material.
32 . The method of claim 31 , wherein a wavelength of the electromagnetic radiation substantially matches an absorption wavelength of the patterning coating material.
33 . The method of claim 23 , wherein, upon treating the first coating, a concentration of an oxygen species in the second region is at least that in the first region.
34 . The method of claim 23 , wherein the first coating comprises a patterning coating material, and, upon treating the first coating, the patterning coating material in the second region is polymerized.
35 . The method of claim 34 , wherein an average molecular weight of the patterning coating material in the first region is no more than that of the patterning coating material in the second region.
36 . The method of claim 23 , wherein the action of depositing comprises an action of subjecting both the first region and the second region to an evaporated flux thereof to form the second coating covering the second region, while at least a portion of the first region remains uncovered by a continuous coating of the second coating.
37 . The method of claim 23 , wherein the action of depositing is performed using one of: an open mask, and maskless deposition.
38 . The method of claim 23 , wherein one of: the first region, and the second region, of the first coating comprises a first coating material, and the other of: the first region, and the second region, of the first coating comprises a treated first coating material, wherein the treated first coating material is a chemically modified material of the first coating material.
39 . A method of manufacturing an opto-electronic device, the method comprising actions of:
providing a substrate comprising an emissive region and a non-emissive region, the emissive region comprising a first electrode and a second electrode, and at least one semiconducting layer disposed therebetween;
depositing a first coating in a single layer covering the emissive region and the non-emissive region;
treating a portion of the first coating covering the non-emissive region to increase an initial sticking probability of the first coating in such treated portion; and
depositing a second coating, comprising a metallic material, covering the non-emissive region.
40 . The method of claim 39 , wherein the second coating comprises at least one disconnected cluster on a surface of the first coating.
41 . The method of claim 39 , wherein the second coating partially overlaps the first coating.
42 . The method of claim 41 , wherein the action of exposing is performed using one of: a mask, and a laser.
43 . The method of claim 39 , wherein the substrate comprises the at least one semiconducting layer arranged over the first electrode, and the second electrode arranged over the at least one semiconducting layer.
44 . The method of claim 39 , wherein the second electrode is disposed in both the emissive region and the non-emissive region.
45 . The method of claim 39 , wherein the first coating is disposed over, and in direct contact with, the second electrode.
46 . The method of claim 39 , wherein the emissive region is arranged adjacent to the non-emissive region.
47 . The method of claim 39 , wherein the action of treating the portion of the first coating comprises an action of exposing such portion of the first coating to electromagnetic radiation.
48 . The method of claim 39 , wherein the second coating is deposited over, and in direct contact with, the treated portion of the first coating covering the non-emissive region.
49 . The method of claim 39 , wherein the action of depositing comprises an action of subjecting both the treated portion of the first coating and a remaining portion thereof to an evaporated flux of a metallic material to deposit the second coating covering the non-emissive region, while at least a portion of the emissive region remains uncovered by a closed coating of the second coating.
50 . The method of claim 49 , wherein the second coating absorbs light incident thereon.
51 . The method of claim 39 , wherein the action of depositing is performed using one of: open mask, and maskless deposition.
52 . The method of claim 39 , wherein, upon depositing the second coating, the second coating is electrically coupled with the second electrode.
53 . The method of claim 39 , wherein the non-emissive region comprises a light transmissive region, and the first coating in the light transmissive region remains untreated.
54 . The method of claim 39 , wherein an untreated portion of the first coating comprises a first coating material and the treated portion of the first coating comprises a treated first coating material, wherein the treated first coating material is a chemically modified material of the first coating material.