IP Library Granted Patent US 12,465,577
Granted Patent B2
US 12,465,577 · App. 16/885,366 · Granted Nov 11, 2025

Antimicrobial topical skin closure compositions and systems

Inventor: Duan Li Ou (Warren, NJ)
Assignee: Ethicon, Inc.
A61K9/7084A61K31/09A61K31/155A61K31/444A61K33/38A61K47/34
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Quick Facts
Patent No.
US 12,465,577
App. No.
16/885,366
Granted
Nov 11, 2025
Kind
B2
Abstract

Novel compositions and systems for closure of wounds with antimicrobial effectiveness provide devices of improved flexibility and elasticity and are readily applied to wound sites or over wound closure devices. A novel platinum catalyst comprising platinum tetramethyldivinyl disiloxane diethyl maleate complex for use in such compositions provides for rapid curing on topical surfaces such as skin and bonds to such surfaces in about 2-5 minutes.

Claims (22)

1 . A composition comprising:

a cross-linkable silicone polymer having reactive functionalities;

a silica-containing composition comprising a trimethyl silyl surface treated silica filler;

a silicone cross-linking agent;

a catalyst, wherein said catalyst comprises a platinum tetramethyldivinyl disiloxane diethyl maleate complex having the formula:

Pt[(CH 2 ═CH)(CH 3 ) 2 Si] 2 O·(COCH=CHCO)(C 2 H 5 O) 2 ; and

an antimicrobial agent.

2 . The composition of claim 1 , wherein the cross-linkable silicone polymer is selected from the group consisting of vinyl terminated polydialkylsiloxane, vinyl terminated polydimethylsiloxane, vinyl terminated polydiphenylsilane-dimethylsiloxane copolymer, vinyl terminated polyphenylmethylsiloxane, vinyl terminated polyfluoropropylmethyl-dimethylsiloxane copolymer, vinyl terminated polydiethylsiloxane, and SiH terminated polydimethyldisiloxane.

3 . The composition of claim 1 , wherein the cross-linkable silicone polymer comprises vinyl terminated polydimethylsiloxane.

4 . The composition of claim 1 , wherein the silicone cross-linking agent is selected from the group consisting of polymethylhydrosiloxane, polymethylhydro-co-polydimethylsiloxane, polyethyhydrosiloxane, polymethylhydrosiloxane-co-octylmethylsiloxane, and polymethylhydrosiloxane-co-methylphenylsiloxane.

5 . The composition of claim 1 , wherein the silicone cross-linking agent comprises polymethylhydrosiloxane, polymethylhydro-co-polydimethylsiloxane and combinations thereof.

6 . The composition of claim 1 , wherein the composition additionally comprises about 0 wt. % to about 30 wt. % of an organic solvent, based upon the weight of the composition.

7 . The composition of claim 1 , wherein the composition comprises about 1 wt. % to about 15 wt. % of the silicone cross-linking agent based on total solids, wherein the composition additionally comprises about 0 wt. % to about 30 wt. % of an organic solvent, based upon the weight of the composition.

8 . The composition of claim 1 , wherein the composition comprises about 0.003 wt. % to about 0.06 wt. % of the platinum catalyst, based on total solids, wherein the composition additionally comprises about 0 wt. % to about 30 wt. % of an organic solvent, based upon the weight of the composition.

9 . The composition of claim 1 , wherein the composition additionally comprises a solvent selected from the group consisting of pentane, hexane, heptanes, mixtures of low molecular weight olefins, and combinations thereof.

10 . The composition of claim 1 , wherein the antimicrobial agent is selected from the group consisting of triclosan, chlorhexidine, polyhexamethylene biguanide (PHMB), octenidine, elemental silver and silver salts.

11 . The composition of claim 10 wherein the antimicrobial agent is triclosan.

12 . The composition of claim 11 , wherein the triclosan comprises about 0.05 wt. % to about 2.0 wt. % of the composition.

13 . The composition of claim 12 , wherein the triclosan comprises about 0.1 wt. % to about 1.5 wt. % of the composition.

14 . The composition of claim 13 , wherein the triclosan comprises about 0.2 wt. % to about 1.0 wt. % of the composition.

15 . The composition of claim 1 , wherein the composition is curable at temperatures at about 19 C.

16 . The composition of claim 15 , wherein the composition is curable at temperatures of about 28 C in about 2-5 minutes.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 22, 2020
From: OU, DUAN LI
To: ETHICON, INC.
Reel/Frame 054728/0993 →
Continuity (1)
Related Publication 20210369639A1 · Dec 2, 2021
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