Stage apparatus, lithography apparatus and article manufacturing method
A stage apparatus for holding a substrate, including a substrate holding unit including a holding surface that holds the substrate, a driving mechanism configured to transfer the substrate to the holding surface, and a control unit configured to decide, based on warpage information concerning warpage of the substrate measured while the substrate is supported by a supporting surface smaller than the holding surface, a driving profile of the substrate by the driving mechanism in a height direction of the substrate such that the substrate is transferred to the holding surface while the warping of the substrate is corrected.
1 . A stage apparatus for holding a substrate, comprising:
a substrate holding unit including a holding surface that holds the substrate;
a driving mechanism configured to place the substrate on the holding surface; and
a control unit configured to control, based on warpage information concerning warpage of the substrate measured while the substrate is supported by a supporting surface smaller than the holding surface, driving of the driving mechanism in a height direction,
wherein the warpage of the substrate is reduced before the substrate is placed on the holding surface,
the driving mechanism includes
a holding member provided to protrude from the holding surface via a hole formed in the substrate holding unit and configured to hold the substrate, and
a driving unit configured to relatively drive the substrate holding unit and the holding member in a protruding direction of the holding member,
the control unit controls a velocity at the time of placing the substrate from the holding member on the holding surface by relatively driving the substrate holding unit and the holding member via the driving unit,
the warpage information includes information representing a shape of the warpage of the substrate,
the control unit controls the driving of the driving mechanism such that the velocity at the time of placing the substrate from the holding member on the holding surface is changed in accordance with the shape of the warpage of the substrate,
if the shape of the warpage of the substrate is a downward convex shape with respect to the holding surface, the control unit controls the driving of the driving mechanism such that the velocity at the time of placing the substrate from the holding member on the holding surface is higher than a predetermined velocity, and
if the shape of the warpage of the substrate is an upward convex shape with respect to the holding surface, the control unit controls the driving of the driving mechanism such that the velocity at the time of placing the substrate from the holding member on the holding surface is lower than the predetermined velocity.
2 . The apparatus according to claim 1 , further comprising an obtaining unit configured to obtain the warpage information,
wherein the control unit controls, based on the warpage information, the pressure in the space between the substrate and the holding surface to a positive pressure or a negative pressure by controlling the driving of the driving mechanism in the height direction.
3 . The apparatus according to claim 2 , wherein the obtaining unit includes
a supporting member including the supporting surface,
a measurement unit configured to measure a position in the height direction of the substrate supported by the supporting surface, and
a processing unit configured to obtain the warpage information based on the position measured by the measurement unit.
4 . The apparatus according to claim 2 , wherein the obtaining unit obtains the warpage information from outside the stage apparatus.
5 . The apparatus according to claim 1 , wherein the predetermined velocity is a velocity at the time of placing the substrate from the holding member on the holding surface by relatively driving the substrate holding unit and the holding member via the driving unit if the shape of the substrate is flat.
6 . The apparatus according to claim 1 , wherein
the warpage information includes information representing a shape of the warpage of the substrate,
a suction unit configured to suck gas via the holding surface is further included, and
the control unit controls the suction unit such that a pressure for sucking the gas is changed in accordance with the shape of the warpage of the substrate.
7 . The apparatus according to claim 6 , wherein
if the shape of the warpage of the substrate is a downward convex shape with respect to the holding surface, the control unit controls the suction unit such that the pressure for sucking the gas is smaller than a predetermined pressure, and
if the shape of the warpage of the substrate is an upward convex shape with respect to the holding surface, the control unit controls the suction unit such that the pressure for sucking the gas is larger than the predetermined pressure.
8 . The apparatus according to claim 7 , wherein the predetermined pressure is a pressure at the time of sucking the gas if the shape of the substrate is flat.
9 . The apparatus according to claim 6 , wherein
the warpage information includes information representing a magnitude of the warpage of the substrate, and
the control unit controls the suction unit such that the pressure for sucking the gas is changed in accordance with the magnitude of the warpage of the substrate.
10 . The apparatus according to claim 1 , wherein
the warpage information includes information representing a shape of the warpage of the substrate,
a blow-out unit configured to blow out gas from the holding surface toward the substrate is further included, and
the control unit controls the blow-out unit to blow out the gas if the shape of the warpage of the substrate is a downward convex shape with respect to the holding surface, and controls the blow-out unit not to blow out the gas if the shape of the warpage of the substrate is an upward convex shape with respect to the holding surface.
11 . The apparatus according to claim 1 , wherein
the warpage information includes information representing a shape of the warpage of the substrate,
a blow-out unit configured to blow out gas from the holding surface toward the substrate is further included, and
the control unit controls the blow-out unit such that the pressure for blowing out the gas is changed in accordance with the shape of the warpage of the substrate.
12 . A lithography apparatus for forming a pattern on a substrate, comprising a stage apparatus defined in claim 1 and configured to hold the substrate.
13 . An article manufacturing method comprising:
forming a pattern on a substrate using a lithography apparatus defined in claim 12 ;
processing the substrate on which the pattern is formed in the forming; and
manufacturing an article from the processed substrate.
14 . A stage apparatus for holding a substrate, comprising:
a substrate holding unit including a holding surface that holds the substrate;
a driving mechanism configured to place the substrate on the holding surface; and
a control unit configured to control, based on warpage information concerning warpage of the substrate measured while the substrate is supported by a supporting surface smaller than the holding surface, driving of the driving mechanism in a height direction,
wherein the warpage of the substrate is reduced before the substrate is placed on the holding surface,
the driving mechanism includes
a holding member provided to protrude from the holding surface via a hole formed in the substrate holding unit and configured to hold the substrate, and
a driving unit configured to relatively drive the substrate holding unit and the holding member in a protruding direction of the holding member,
the control unit controls a velocity at the time of placing the substrate from the holding member on the holding surface by relatively driving the substrate holding unit and the holding member via the driving unit,
the warpage information includes information representing a magnitude of the warpage of the substrate,
the control unit controls the driving of the driving mechanism such that the velocity at the time of placing the substrate from the holding member on the holding surface is changed in accordance with the magnitude of the warpage of the substrate,
if the shape of the warpage of the substrate is a downward convex shape with respect to the holding surface, the control unit controls the driving of the driving mechanism such that as the magnitude of the warpage of the substrate is larger, the velocity at the time of placing the substrate from the holding member on the holding surface is higher than a predetermined velocity, and
if the shape of the warpage of the substrate is an upward convex shape with respect to the holding surface, the control unit controls the driving of the driving mechanism such that as the magnitude of the warpage of the substrate is larger, the velocity at the time of placing the substrate from the holding member on the holding surface is lower than the predetermined velocity.