IP Library › Granted Patent US 12,471,222
Granted Patent B2
US 12,471,222 · App. 18/209,551 · Granted Nov 11, 2025

Circuit board for antenna, antenna package including the same and image display device including the same

Inventors: Dae Kyu Kim (Gyeonggi-do, KR); Byung Soo Bang (Gyeonggi-do, KR); Gi Taek Oh (Gyeonggi-do, KR)
Assignee: DONGWOO FINE-CHEM CO., LTD.
H05K3/4605H01Q1/2291H05K1/0242H05K2201/093H05K2201/10098H05K2201/10128
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Quick Facts
Patent No.
US 12,471,222
App. No.
18/209,551
Granted
Nov 11, 2025
Kind
B2
Abstract

A circuit board for an antenna may include a core layer, a signal wiring disposed on a surface of the core layer, and a co-planar ground disposed around the signal wiring on the surface of the core layer. The co-planar ground may include line patterns adjacent to a front end portion of the signal wiring.

Claims (33)

1 . A circuit board for an antenna, comprising:

a core layer;

a signal wiring disposed on a surface of the core layer; and

a co-planar ground disposed around the signal wiring on the surface of the core layer, the co-planar ground comprising line patterns adjacent to a front end portion of the signal wiring,

wherein a plurality of the signal wirings are arranged in a width direction of the core layer, and a plurality of the line patterns are arranged between neighboring signal wirings of the plurality of the signal wirings.

2 . The circuit board for an antenna according to claim 1 , wherein a plurality of the line patterns are arranged at each of both lateral sides of the front end portion of the signal wiring.

3 . The circuit board for an antenna according to claim 1 , wherein the core layer has a first region in which the front end portion of the signal wiring is disposed and a second region adjacent to the first region, and the co-planar ground has a solid conductive layer structure in the second region.

4 . The circuit board for an antenna according to claim 3 , wherein a pair of the co-planar grounds are disposed with the signal wiring interposed therebetween in the second region.

5 . The circuit board for an antenna according to claim 1 , wherein the signal wiring has a branched structure comprising a plurality of feeding portions, and the line patterns are arranged around the feeding portions.

6 . The circuit board for an antenna according to claim 5 , wherein bonding units are defined by one feeding potion of the feeding portions, and the line patterns arranged at both lateral sides of the one feeding portion, and

the line patterns in each of the bonding units are spaced apart by a first slit, and the bonding units neighboring each other are spaced apart by a second slit.

7 . The circuit board for an antenna according to claim 6 , wherein a width of the second slit is greater than a width of the first slit.

8 . An image display device comprising:

a display panel;

an antenna unit disposed on the display panel; and

the circuit board for an antenna of claim 1 electrically connected to the antenna unit.

9 . The image display device according to claim 8 , further comprising an antenna driving integrated circuit chip disposed under the display panel.

10 . The image display device according to claim 9 , wherein the circuit board for the antenna is bent under the display panel to be electrically connected to the antenna driving integrated circuit chip.

11 . An antenna package comprising:

an antenna device; and

a circuit board bonded with the antenna device, the circuit board comprising:

a core layer;

a signal wiring disposed on a surface of the core layer; and

a co-planar ground disposed around the signal wiring on the surface of the core layer, the co-planar ground comprising line patterns adjacent to a front end portion of the signal wiring,

wherein a plurality of the signal wirings are arranged in a width direction of the core layer, and a plurality of the line patterns are arranged between neighboring signal wirings of the plurality of the signal wirings.

12 . The antenna package according to claim 11 , further comprising a bonding intermediate film coupling the antenna device and the circuit board.

13 . The antenna package according to claim 12 , wherein the line patterns are spaced apart with slits interposed therebetween, and the bonding intermediate film is attached on the line patterns to fill the slits.

14 . The antenna package according to claim 13 , wherein the bonding intermediate film has convex portions on the line patterns.

15 . The antenna package according to claim 11 , wherein the antenna device comprises:

a dielectric layer; and

an antenna unit disposed on the dielectric layer, the antenna unit comprising a radiator, a transmission line extending from the radiator, a signal pad formed at an end portion of the transmission line and a ground pad disposed around the signal pad.

16 . The antenna package according to claim 15 , wherein the line patterns comprise first line patterns arranged on the ground pad and second line patterns not overlapping the ground pad.

17 . The antenna package according to claim 16 , wherein the number of the second line patterns is greater than the number of the first line patterns.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 14, 2023
From: KIM, DAE KYU; BANG, BYUNG SOO; OH, GI TAEK
To: DONGWOO FINE-CHEM CO., LTD.
Reel/Frame 063943/0805 →
Priority Claims (1)
KR 10-2022-0076118 · Jun 22, 2022 · national
Continuity (1)
Related Publication 20230422409A1 · Dec 28, 2023
References Cited (5)
US 20070229366A1 · Kim · 2007 [cited by examiner]
US 20220190467A1 · Kim · 2022 [cited by examiner]
US 20220190469A1 · Kim · 2022 [cited by examiner]
KR 1020200005950A · 2020 [cited by applicant]
WO WO2011100492A1 · 2011 [cited by applicant]