Micro element structure and display device
A micro element structure including a body, two electrodes, two solder patterns and a confinement structure is provided. The two electrodes are disposed on a side of the body. The two solder patterns are disposed on the two electrodes, respectively. The confinement structure protrudes relative to the body, wherein the confinement structure surrounds one of the electrodes and the solder pattern thereon, and at least a portion of the confinement structure is separated from the surrounded solder pattern with a gap. A display device is also provided.
1 . A micro element structure, comprising:
a body;
two electrodes, disposed on a side of the body;
two solder patterns, respectively disposed on the two electrodes;
a confinement structure, protruding relative to the body, wherein the confinement structure surrounds one of the electrodes and the solder pattern thereon, and at least a portion of the confinement structure is separated from the surrounded solder pattern with a gap; and
an insulating layer, covering the body and having two openings, wherein the two electrodes are disposed on the insulating layer and are respectively connected to the body through the two openings, and the confinement structure is disposed on the insulating layer.
2 . The micro element structure according to claim 1 , further comprising:
two eutectic barrier patterns, respectively located between one of the electrodes and the solder pattern thereon and between the other one of the electrodes and the solder pattern thereon.
3 . The micro element structure according to claim 2 , wherein:
one of the solder patterns exposes a peripheral portion of the eutectic barrier pattern located thereunder, and the confinement structure is disposed on the peripheral portion of the eutectic barrier pattern and protrudes relative to the peripheral portion.
4 . The micro element structure according to claim 3 , wherein the confinement structure and the eutectic barrier pattern are integrally formed.
5 . The micro element structure according to claim 3 , wherein the confinement structure and the eutectic barrier pattern have different materials.
6 . The micro element structure according to claim 2 ,
wherein the two electrodes are respectively sealed by the insulating layer and the two eutectic barrier patterns to separate from the two solder patterns.
7 . The micro element structure according to claim 1 , wherein the confinement structure and the insulating layer are integrally formed, or the confinement structure and the insulating layer have different materials.
8 . The micro element structure according to claim 1 , further comprising:
two eutectic barrier patterns, wherein the two electrodes, the two eutectic barrier patterns, and the two solder patterns are sequentially stacked conformally on the body, and each of the solder patterns has a groove on a side away from the body.
9 . The micro element structure according to claim 1 , wherein an end portion of the confinement structure is located between a top portion of the solder pattern and a bottom portion of the solder pattern.
10 . The micro element structure according to claim 1 , wherein an orthogonal projection of the surrounded solder pattern on the body is completely surrounded by an orthogonal projection of the confinement structure on the body.
11 . The micro element structure according to claim 1 , wherein a ratio of a width of the gap to a thickness of the surrounded solder pattern is greater than or equal to 0.25.
12 . The micro element structure according to claim 1 , wherein a protrusion height of the confinement structure relative to the body is 0.1 μm to 0.5 μm.
13 . The micro element structure according to claim 1 , wherein a cross-sectional shape of the confinement structure comprises a horn shape, a triangle, a quadrilateral, a circular convex shape, or a bent shape.
14 . A display device, comprising:
a circuit substrate; and
a plurality of micro element structures, disposed on the circuit substrate and electrically connected to the circuit substrate, wherein each of the micro element structures comprises:
a body;
two electrodes, disposed on a side of the body facing the circuit substrate;
two solder patterns, respectively disposed on the two electrodes and located between the two electrodes and the circuit substrate;
a confinement structure, protruding relative to the body, wherein the confinement structure surrounds one of the electrodes and the solder pattern thereon, and at least a portion of the confinement structure is separated from the surrounded solder pattern with a gap; and
an insulating layer, covering the body and having two openings, wherein the two electrodes are disposed on the insulating layer and are respectively connected to the body through the two openings, and the confinement structure is disposed on the insulating layer.
15 . The display device according to claim 14 , wherein the confinement structure has an end portion, the solder pattern has a top portion away from the body and a bottom portion close to the body, and the end portion is located between the top portion and the bottom portion.
16 . The display device according to claim 14 , wherein an orthogonal projection of the confinement structure on the body completely covers an orthogonal projection of the surrounded solder pattern on the body.