Semiconductor measurements with robust in-line tool matching
Methods and systems for improved monitoring of tool drift and tool-to-tool matching across large fleets of measurement systems employed to measure semiconductor structures are presented herein. One or more Quality Control (QC) wafers are measured by each of a fleet of measurement systems. Values of system variables are extracted from the QC measurement data associated with each measurement system using a trained QC encoder. The extracted values of the system variables are employed to condition the corresponding measurement model employed by each measurement tool to characterize structures under measurement having unknown values of one or more parameters of interest. Accurate tool-to-tool matching across a fleet of conditioned measurement systems is achieved by extracting values of system variables from measurement data collected from the same set of QC wafers. Tool health is monitored based on changes in values of system variables extracted from measurements performed at different times.
1 . A method comprising:
illuminating one or more Quality Control (QC) structures disposed on one or more QC semiconductor wafers with a first amount of illumination radiation generated by an illumination source of a first semiconductor measurement system of a fleet of semiconductor measurement systems, the first amount of illumination radiation characterized by one or more physical properties;
detecting a first amount of collected radiation from the one or more QC structures at a detector in response to the first amount of illumination radiation, the detected first amount of collected radiation dependent on the one or more physical properties of the first amount of illumination light and one or more physical characteristics of the one or more QC structures;
illuminating one or more structures disposed on one or more in-line semiconductor wafers with a second amount of illumination radiation generated by the illumination source of the first semiconductor measurement system of the fleet of semiconductor measurement systems, the second amount of illumination radiation characterized by the one or more physical properties;
detecting a second amount of collected radiation from the one or more structures at the detector in response to the second amount of illumination radiation, the detected second amount of collected radiation dependent on the one or more physical properties of the second amount of illumination light and one or more physical characteristics of the one or more structures;
generating a first set of measurement signals indicative of the detected first amount of collected radiation;
generating a second set of measurement signals indicative of the detected second amount of collected radiation;
determining a first set of values of one or more system variables associated with the first semiconductor measurement system from the first set of measurement signals using a trained QC encoder function; and
estimating values of one or more parameters of interest characterizing the structure disposed on the first in-line semiconductor wafer based on the first set of values of the one or more system variables and the second set of measurement signals using a trained QC conditioned measurement model.
2 . The method of claim 1 , further comprising:
generating a third set of measurement signals indicative of a measurement of one or more Design Of Experiments (DOE) structures disposed on one or more DOE semiconductor wafers by the first semiconductor measurement system of the fleet of semiconductor measurement systems, wherein values of the one or more parameters of interest characterizing the one or more DOE structures disposed on the one or more DOE semiconductor wafers are known; and
training the QC conditioned measurement model based on the first set of values of the one or more system variables and the third set of measurement signals.
3 . The method of claim 2 , wherein the trained QC conditioned model is a machine learning based model.
4 . The method of claim 1 , further comprising:
generating a third set of measurement signals indicative of a measurement of the one or more Quality Control (QC) structures disposed on the one or more QC semiconductor wafers by each semiconductor measurement system of the fleet of semiconductor measurement systems; and
training the QC encoder function based on the third set of measurement signals.
5 . The method of claim 4 , wherein the training of the QC encoder function involves any of an autoencoder, a principle component analysis, and contrastive learning.
6 . The method of claim 1 , further comprising:
generating a third set of measurement signals indicative of a measurement of the one or more Quality Control (QC) structures disposed on the one or more QC semiconductor wafers by the first semiconductor measurement system of the fleet of semiconductor measurement systems at a time subsequent to the generating of the first set of measurement signals; and
determining a second set of values of the one or more system variables associated with the first semiconductor measurement system from the third set of measurement signals using the trained QC encoder function.
7 . The method of claim 6 , further comprising:
generating a fourth set of measurement signals indicative of a measurement of one or more structures disposed on a second in-line semiconductor wafer by the first semiconductor measurement system; and
estimating values of one or more parameters of interest characterizing the structure disposed on the second in-line semiconductor wafer based on the second set of values of the one or more system variables and the fourth set of measurement signals using the trained QC conditioned measurement model.
8 . The method of claim 6 , further comprising:
estimating a difference between the first set of values of the one or more system variables and the second set of values of one or more of the system variables.
9 . The method of claim 8 , further comprising:
performing a preventative maintenance operation if the difference exceeds a predetermined threshold value.
10 . The method of claim 1 , wherein each of the semiconductor measurement systems of the fleet of semiconductor measurement systems is any of a spectroscopic ellipsometer, a spectroscopic reflectometer, a soft X-ray reflectometer, a small-angle x-ray scatterometer, an imaging system, a hyperspectral imaging system, and a scatterometry overlay metrology system.
11 . The method of claim 1 , wherein the first set of measurement signals includes measurement data associated with measurements of the one or more QC structures by a plurality of semiconductor measurement systems of the fleet of semiconductor measurement systems, and wherein the second set of measurement signals includes measurement data associated with measurements of the one or more structures by the plurality of semiconductor measurement systems of the fleet of semiconductor measurement systems.
12 . A system comprising:
a first semiconductor measurement system of a fleet of semiconductor measurement systems, comprising:
an illumination source configured to generate a first amount of illumination radiation illuminating one or more Quality Control (QC) structures disposed on one or more QC semiconductor wafers with a first amount of illumination radiation, the first amount of illumination radiation characterized by one or more physical properties, the first illumination source further configured to generate a second amount of illumination radiation illuminating one or more structures disposed on one or more in-line semiconductor wafers, the second amount of illumination radiation characterized by the one or more physical properties-;
a first detector configured to detect a first amount of collected radiation from the one or more QC structures at the detector in response to the first amount of illumination radiation, the detected first amount of collected radiation dependent on the one or more physical properties of the first amount of illumination light and one or more physical characteristics of the one or more QC structures, the first detector further configured to generate a first set of measurement signals indicative of the detected first amount of collected radiation, the first detector further configured to detect a second amount of collected radiation from the one or more structures at the detector in response to the second amount of illumination radiation, the detected second amount of collected radiation dependent on the one or more physical properties of the second amount of illumination light and one or more physical characteristics of the one or more structures, the first detector further configured to generate a second set of measurement signals indicative of the detected second amount of collected radiation; and
one or more computer systems configured to:
determine a first set of values of the one or more system variables associated with the first semiconductor measurement system from the first set of measurement signals using a trained QC encoder function; and
estimate values of one or more parameters of interest characterizing the structure disposed on the first in-line semiconductor wafer based on the first set of values of the one or more system variables and the second set of measurement signals using a trained QC conditioned measurement model.
13 . The system of claim 12 , the one or more computer systems further configured to:
receive a third set of measurement signals indicative of a measurement of one or more Design Of Experiments (DOE) structures disposed on one or more DOE semiconductor wafers by the first semiconductor measurement system of the fleet of semiconductor measurement systems, wherein values of the one or more parameters of interest characterizing the one or more DOE structures disposed on the one or more DOE semiconductor wafers are known; and
train the QC conditioned measurement model based on the first set of values of the one or more system variables and the third set of measurement signals.
14 . The system of claim 12 , the one or more computer systems further configured to:
generate a third set of measurement signals indicative of a measurement of the one or more Quality Control (QC) structures disposed on the one or more QC semiconductor wafers by each semiconductor measurement system of the fleet of semiconductor measurement systems; and
train the QC encoder function based on the third set of measurement signals.
15 . The system of claim 12 , the one or more computer systems further configured to:
receive a third set of measurement signals indicative of a measurement of the one or more Quality Control (QC) structures disposed on the one or more QC semiconductor wafers by the first semiconductor measurement system of the fleet of semiconductor measurement systems at a time subsequent to the generating of the first set of measurement signals; and
determine a second set of values of the one or more system variables associated with the first semiconductor measurement system from the third set of measurement signals using the trained QC encoder function.
16 . The system of claim 15 , the one or more computer systems further configured to:
receive a fourth set of measurement signals indicative of a measurement of one or more structures disposed on a second in-line semiconductor wafer by the first semiconductor measurement system; and
estimate values of one or more parameters of interest characterizing the structure disposed on the second in-line semiconductor wafer based on the second set of values of the one or more system variables and the fourth set of measurement signals using the trained QC conditioned measurement model.
17 . The system of claim 15 , the one or more computer systems further configured to:
estimate a difference between the first set of values of the one or more system variables and the second set of values of one or more of the system variables.
18 . The system of claim 17 , wherein a preventative maintenance operation is performed if the difference exceeds a predetermined threshold value.
19 . The system of claim 12 , wherein each of the semiconductor measurement systems of the fleet of semiconductor measurement systems is any of a spectroscopic ellipsometer, a spectroscopic reflectometer, a soft X-ray reflectometer, a small-angle x-ray scatterometer, an imaging system, a hyperspectral imaging system, and a scatterometry overlay metrology system.
20 . A system comprising:
a first semiconductor measurement system of a fleet of semiconductor measurement systems, comprising:
an illumination source configured to generate a first amount of illumination radiation illuminating one or more Quality Control (QC) structures disposed on one or more QC semiconductor wafers with a first amount of illumination radiation, the first amount of illumination radiation characterized by one or more physical properties, the first illumination source further configured to generate a second amount of illumination radiation illuminating one or more structures disposed on one or more in-line semiconductor wafers, the second amount of illumination radiation characterized by the one or more physical properties;
a first detector configured to detect a first amount of collected radiation from the one or more QC structures at the detector in response to the first amount of illumination radiation, the detected first amount of collected radiation dependent on the one or more physical properties of the first amount of illumination light and one or more physical characteristics of the one or more QC structures, the first detector further configured to generate a first set of measurement signals indicative of the detected first amount of collected radiation, the first detector further configured to detect a second amount of collected radiation from the one or more structures at the detector in response to the second amount of illumination radiation, the detected second amount of collected radiation dependent on the one or more physical properties of the second amount of illumination light and one or more physical characteristics of the one or more structures, the first detector further configured to generate a second set of measurement signals indicative of the detected second amount of collected radiation; and
a non-transitory, computer-readable medium storing computer-readable instructions, the computer-readable instructions, when executed by the one or more processors, cause the computing system to:
determine a first set of values of one or more system variables associated with the first semiconductor measurement system from the first set of measurement signals using a trained QC encoder function; and
estimate values of one or more parameters of interest characterizing the structure disposed on the first in-line semiconductor wafer based on the first set of values of the one or more system variables and the second set of measurement signals using a trained QC conditioned measurement model.