IP Library › Granted Patent US 12,476,042
Granted Patent B2
US 12,476,042 · App. 18/593,402 · Granted Nov 18, 2025

Coil device

Inventors: Chen Wang (Tokyo, JP); Syun Ashizawa (Tokyo, JP); Satoshi Sugimoto (Tokyo, JP)
Assignee: TDK CORPORATION
H01F27/327H01F27/02H01F27/24H01F27/2866H01F41/125
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Quick Facts
Patent No.
US 12,476,042
App. No.
18/593,402
Granted
Nov 18, 2025
Kind
B2
Abstract

A coil device includes a first conductor, a second conductor, and a core. The second conductor is disposed inside the first conductor and at least partly extending along the first conductor. The core internally arranges the first conductor and the second conductor. An insulating layer is formed at least between the first conductor and the second conductor.

Claims (60)

1 . A coil device comprising:

a first conductor;

a second conductor disposed inside the first conductor and at least partly extending along the first conductor;

a core for internally arranging the first conductor and the second conductor; and

an insulating layer formed at least between the first conductor and the second conductor, wherein

the insulating layer has a first part covering an outer surface of the second conductor, a second part covering an inner surface of the second conductor and a third part covering a side surface connecting the outer surface and the inner surface,

a gap is formed between the first part and an inner surface of the first conductor,

the first conductor has a pair of outer mounting parts at both ends, which can face a mounting surface,

the second conductor has a pair of inner mounting parts at both ends, which can face the mounting surface,

each of the inner mounting parts is arranged with an interval between each of the outer mounting parts, and

the inner mounting parts and the outer mounting parts are arranged with an interval between each inner mounting part and the corresponding outer mounting part.

2 . The coil device according to claim 1 , wherein

the second conductor is made of a flat wire, and

the insulating layer is made of an insulating film formed on a surface of the second conductor.

3 . The coil device according to claim 1 , wherein the first conductor and the second conductor are adhered via a fusion layer formed by fusing the insulating layer formed on a surface of the second conductor.

4 . The coil device according to claim 1 , wherein the insulating layer is formed between the core and the first conductor or the second conductor.

5 . The coil device according to claim 1 , wherein the first conductor is made of a conductive plate with a plating layer formed on a surface of the conductive plate.

6 . The coil device according to claim 1 , wherein

an outer bending part bending outward is provided at an end of the first conductor,

an inner bending part bending inward is provided at an end of the second conductor, and

a radius of curvature of an inner surface of the outer bending part is larger than that of an outer surface of the inner bending part.

7 . The coil device according to claim 1 , wherein a cross-sectional area of the first conductor perpendicular to its extending direction is larger than that of the second conductor perpendicular to its extending direction.

8 . The coil device according to claim 1 , wherein a bottom surface of the core is disposed away from the mounting surface.

9 . The coil device according to claim 1 , wherein an insulating coating layer is provided at least on a bottom surface of the core.

10 . The coil device according to claim 1 , wherein a mounting part of the first conductor and a mounting part of the second conductor are insulated by a resin spacer.

11 . A coil device comprising:

a first conductor including a first outer mounting part formed at one end and a second outer mounting part formed at the other end;

a second conductor disposed inside the first conductor and including a first inner mounting part formed at one end and a second inner mounting part formed at the other end;

a core for internally arranging the first conductor and the second conductor; and

a resin spacer comprising:

a first side insulating part disposed between the first outer mounting part and the first inner mounting part; and

a second side insulating part disposed between the second outer mounting part and the second inner mounting part, wherein

the resin spacer has a base part made of a board-shaped body, a first opening formed between the base part and the first side insulating part, and a second opening formed between the base part and the second side insulating part, and

one conductor side part of the second conductor passes through the first opening, and the other conductor side part of the second conductor passes through the second opening.

12 . The coil device according to claim 11 , wherein a bottom surface of the resin spacer is disposed higher than bottom surfaces of the first inner mounting part and the second inner mounting part and is disposed higher than bottom surfaces of the first outer mounting part and the second outer mounting part.

13 . The coil device according to claim 11 , wherein the resin spacer includes an inner insulating part disposed between one end and the other end of the second conductor and disposed between a bottom surface of the core and the first inner mounting part or between the bottom surface of the core and the second inner mounting part.

14 . The coil device according to claim 13 , wherein

a first gap is formed between the first side insulating part and one end of the inner insulating part in a first direction,

a second gap is formed between the second side insulating part and the other end of the inner insulating part in the first direction,

the first side insulating part, the second side insulating part, and the inner insulating part extend in a second direction perpendicular to the first direction, and

the resin spacer further comprises:

a first connection part connecting one ends in the second direction of the first side insulating part, the second side insulating part, and the inner insulating part along the first direction; and

a second connection part connecting the other ends in the second direction of the first side insulating part, the second side insulating part, and the inner insulating part along the first direction.

15 . The coil device according to claim 14 , wherein

a first concave part located on one side in the first direction and a second concave part located on the other side in the first direction are formed on a bottom surface of the resin spacer,

the first inner mounting part is housed in the first concave part, and

the second inner mounting part is housed in the second concave part.

16 . The coil device according to claim 14 , wherein

the resin spacer includes a first arm part standing from the first connection part and a second arm part standing from the second connection part,

a first convex part protruding inward in the second direction is formed at a tip of the first arm part,

a second convex part protruding inward in the second direction is formed at a tip of the second arm part,

a first concave part is formed on a side surface of the core on one side in the second direction,

a second concave part is formed on a side surface of the core on the other side in the second direction,

the first convex part engages with the first concave part, and

the second convex part engages with the second concave part.

17 . The coil device according to claim 11 , wherein

one of the first inner mounting part and the first outer mounting part has a bent shape bent in a substantially L-shaped manner,

the other of the first inner mounting part and the first outer mounting part has a substantially linear shape,

one of the second inner mounting part and the second outer mounting part has a bent shape bent in a substantially L-shaped manner, and

the other of the second inner mounting part and the second outer mounting part has a substantially linear shape.

Priority Claims (2)
JP 2020-137581 · Aug 17, 2020 · national
JP 2021-121897 · Jul 26, 2021 · national
Continuity (2)
Continuation 17404146 · Aug 17, 2021
Related Publication 20240203640A1 · Jun 20, 2024
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