Semiconductor device
A semiconductor device includes a semiconductor layer of a first conductivity type having a first main surface at one side and a second main surface at another side, a trench gate structure including a gate trench formed in the first main surface of the semiconductor layer, and a gate electrode embedded in the gate trench via a gate insulating layer, a trench source structure including a source trench formed deeper than the gate trench and across an interval from the gate trench in the first main surface of the semiconductor layer, a source electrode embedded in the source trench, and a deep well region of a second conductivity type formed in a region of the semiconductor layer along the source trench, a ratio of a depth of the trench source structure with respect to a depth of the trench gate structure being not less than 1.5 and not more than 4.0, a body region of the second conductivity type formed in a region of a surface layer portion of the first main surface of the semiconductor layer between the gate trench and the source trench, a source region of the first conductivity type formed in a surface layer portion of the body region, and a drain electrode connected to the second main surface of the semiconductor layer.
1 . A semiconductor device comprising:
a semiconductor layer of a first conductivity type having a first main surface at one side and a second main surface at another side;
a trench gate structure including a gate trench formed in the first main surface of the semiconductor layer, and a gate electrode embedded in the gate trench via a gate insulating layer;
a trench source structure including a source trench formed deeper than the gate trench and formed across an interval from the gate trench in the first main surface of the semiconductor layer, a source electrode embedded in the source trench, and a well region of a second conductivity type formed in a region of the semiconductor layer along the source trench;
a body region of the second conductivity type formed in a region of a surface layer portion of the first main surface of the semiconductor layer between the gate trench and the source trench;
a source region of the first conductivity type formed in a surface layer portion of the body region;
a drain electrode connected to the second main surface of the semiconductor layer; and
an outer well region of the second conductivity region formed in an outer region outside of a region where the trench gate structure is formed,
wherein an aspect ratio of the trench source structure is greater than an aspect ratio of the trench gate structure.
2 . The semiconductor device according to claim 1 , wherein the aspect ratio of the trench source structure is not less than 0.5 and not more than 18.0.
3 . The semiconductor device according to claim 1 , wherein a depletion layer spreads further from a boundary region between the semiconductor layer and the well region toward a region of a second main surface side than from a bottom wall of the gate trench in the semiconductor layer toward a region of the second main surface side.
4 . The semiconductor device according to claim 3 , wherein the depletion layer overlaps to the bottom wall of the gate trench.
5 . The semiconductor device according to claim 1 , wherein the well region is formed in a region of the semiconductor layer along a side wall of the source trench.
6 . The semiconductor device according to claim 1 , wherein the well region is formed in a region of the semiconductor layer along a bottom wall of the source trench.
7 . The semiconductor device according to claim 1 , wherein the well region is formed continuously in a region of the semiconductor layer along a side wall, a bottom wall, and a corner portion connecting the side wall and the bottom wall of the source trench.
8 . The semiconductor device according to claim 1 , wherein the well region is connected to the body region.
9 . The semiconductor device according to claim 1 , wherein the trench source structure includes a barrier forming layer interposed in a region between the source trench and the source electrode and having a higher potential barrier than a potential barrier between the well region and the source electrode.
10 . The semiconductor device according to claim 9 , wherein the barrier forming layer includes an insulating barrier forming layer made of an insulating material.
11 . The semiconductor device according to claim 9 , wherein the barrier forming layer includes a conductive barrier forming layer made of a conductive material differing from a conductive material of the source electrode.
12 . The semiconductor device according to claim 9 , wherein the barrier forming layer includes an insulating barrier forming layer made of an insulating material, and a conductive barrier forming layer made of a conductive material differing from a conductive material of the source electrode.
13 . The semiconductor device according to claim 9 , wherein the barrier forming layer is formed along a side wall, a bottom wall, and a corner portion connecting the side wall and the bottom wall of the source trench.
14 . The semiconductor device according to claim 1 , further comprising: a contact region of the second conductivity type formed in a region of the semiconductor layer along a side wall of the source trench and having a second conductivity type impurity concentration higher than a second conductivity type impurity concentration of the body region.
15 . The semiconductor device according to claim 1 , further comprising: a contact region of the second conductivity type formed in a region of the semiconductor layer along a bottom wall of the source trench and having a second conductivity type impurity concentration higher than a second conductivity type impurity concentration of the body region.
16 . The semiconductor device according to claim 1 , wherein part of the first main surface is recessed and forming a recessed region, the outer well region is formed in the recessed region.
17 . A semiconductor device comprising:
a semiconductor layer of a first conductivity type having a first main surface at one side and a second main surface at another side;
a trench gate structure including a gate trench formed in the first main surface of the semiconductor layer, and a gate electrode embedded in the gate trench via a gate insulating layer;
a trench source structure including a source trench formed deeper than the gate trench and formed across an interval from the gate trench in the first main surface of the semiconductor layer, a source electrode embedded in the source trench, and a well region of a second conductivity type formed in a region of the semiconductor layer along the source trench;
a body region of the second conductivity type formed in a region of a surface layer portion of the first main surface of the semiconductor layer between the gate trench and the source trench;
a source region of the first conductivity type formed in a surface layer portion of the body region;
a drain electrode connected to the second main surface of the semiconductor layer; and
an outer well region of the second conductivity region formed in an outer region outside of a region where the trench gate structure is formed,
wherein the trench source structure includes a barrier forming layer interposed in a region between the source trench and the source electrode and having a higher potential barrier than a potential barrier between the well region and the source electrode, and
wherein the barrier forming layer includes an insulating barrier forming layer made of an insulating material, and a conductive barrier forming layer made of a conductive material differing from a conductive material of the source electrode.