IP Library Granted Patent US 12,480,222
Granted Patent B2
US 12,480,222 · App. 18/224,396 · Granted Nov 25, 2025

Alpha gallium oxide thin-film structure having high conductivity obtained using selective area growth in HVPE growth manner and method for manufacturing the same

Inventors: Dae-Woo Jeon (Jinju-si, KR); Ji-Hyeon Park (Gunsan-si, KR); Jae-Kyoung Mun (Daejeon, KR)
Assignees: KOREA INSTITUTE OF CERAMIC ENGINEERING AND TECHNOLOGY; ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
C30B25/04C30B25/10C30B25/165C30B25/22C30B29/16C30B29/38
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Quick Facts
Patent No.
US 12,480,222
App. No.
18/224,396
Granted
Nov 25, 2025
Kind
B2
Abstract

Disclosed are an alpha gallium oxide thin-film structure having high conductivity obtained using selective area growth in a HVPE growth manner, and a method for manufacturing the same, in which a nitride-based nitride film pattern is formed on an alpha gallium oxide thin-film so as to expose only a selected area thereof, and re-growth is performed only on the partially exposed area thereof, thereby forming a high-quality patterned alpha gallium oxide re-growth pattern.

Claims (24)

1 . A method for manufacturing an alpha gallium oxide thin-film structure having high conductivity using selective area growth in a HVPE (halide vapor phase epitaxy) growth manner, the method comprising:

providing a substrate;

forming an alpha gallium oxide thin-film on an upper surface of the substrate in a HVPE growth manner;

forming a nitride film pattern on the substrate and the alpha gallium oxide thin-film so as to expose only a selected area of the alpha gallium oxide thin-film; and

performing re-growth in a HVPE growth manner using a portion of the alpha gallium oxide thin-film located in the exposed selected area as a seed, thereby forming an alpha gallium oxide re-growth pattern,

wherein

the alpha gallium oxide thin-film is re-heated while the exposed selected area thereof is exposed to an inert gas atmosphere; and

the re-growth in the HVPE growth manner is carried out using the re-heated alpha gallium oxide thin-film as the seed to form the alpha gallium oxide re-growth pattern.

2 . The method of claim 1 , wherein the formation of the alpha gallium oxide thin-film is carried out under a source temperature in a range of 450 to 650° C. and a growth temperature in a range of 400 to 600° C. and under an inert gas atmosphere.

3 . The method of claim 2 , wherein the formation of the alpha gallium oxide thin-film is carried out using a deposition gas containing HCl and O 2 , wherein a supply flow rate of HCl is in a range of 5 to 50 sccm, and a supply flow rate of O 2 is in a range of 100 to 1,000 sccm.

4 . The method of claim 1 , wherein the nitride film pattern is made of Si 3 N 4 .

5 . The method of claim 4 , wherein the nitride film pattern has an opening defined therein so as to expose the selected area, wherein the alpha gallium oxide re-growth pattern is formed in the opening.

6 . The method of claim 1 , wherein the alpha gallium oxide thin-film is re-heated for 3 to 6 minutes.

7 . The method of claim 1 , wherein the re-growth in the HVPE growth manner is carried out under a source temperature in a range of 450 to 650° C. and a growth temperature in a range of 400 to 600° C. and under the inert gas atmosphere.

8 . The method of claim 7 , wherein the re-growth in the HVPE growth manner is carried out for 1 to 7 minutes.

9 . The method of claim 1 , wherein during performing the re-growth in the HVPE growth manner, the alpha gallium oxide re-growth pattern is deposited on the selected area of the alpha gallium oxide thin-film and is electrically directly connected to the alpha gallium oxide thin-film.

10 . The method of claim 1 , wherein the method further comprises removing the nitride film pattern from the substrate on which the alpha gallium oxide thin-film and the alpha gallium oxide re-growth pattern have been formed in a lift-off process.

11 . An alpha gallium oxide thin-film structure having high conductivity obtained using selective area growth in a HVPE growth manner, the alpha gallium oxide thin-film structure comprising:

a substrate;

an alpha gallium oxide thin-film formed on an upper surface of the substrate; and

an alpha gallium oxide re-growth pattern deposited only on a selected area of the alpha gallium oxide thin-film,

wherein the alpha gallium oxide thin-film structure is free of a nitride film pattern used as a mask.

12 . The alpha gallium oxide thin-film structure of claim 11 , wherein the alpha gallium oxide re-growth pattern is electrically directly connected to the alpha gallium oxide thin-film.

13 . The alpha gallium oxide thin-film structure of claim 11 , wherein the alpha gallium oxide re-growth pattern has a thickness of 200 nm to 300 nm.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 20, 2023
From: JEON, DAE-WOO; PARK, JI-HYEON; MUN, JAE-KYOUNG
To: KOREA INSTITUTE OF CERAMIC ENGINEERING AND TECHNOLOGY; ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Reel/Frame 064329/0812 →
Priority Claims (1)
KR 10-2022-0150535 · Nov 11, 2022 · national
Continuity (1)
Related Publication 20240158953A1 · May 16, 2024
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