IP Library Granted Patent US 12,481,906
Granted Patent B2
US 12,481,906 · App. 17/463,548 · Granted Nov 25, 2025

Majorana-based qubits in 3D topological insulator flakes

Inventors: Dmitry Pikulin (Redmond, WA); Roman Lutchyn (Santa Barbara, CA)
Assignee: Microsoft Technology Licensing, LLC
G06N10/40G06N10/20
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Quick Facts
Patent No.
US 12,481,906
App. No.
17/463,548
Granted
Nov 25, 2025
Kind
B2
Abstract

Embodiments of the present disclosure includes qubit architectures and qubit elements of a quantum processor. A superconductor region overlaps a three-dimensional topological insulator layer. A vortex region extends through the superconductor region to the three-dimensional topological insulator layer. A peripheral portion of the vortex region is located on an edge of the superconductor region.

Claims (54)

1 . A quantum processor, comprising:

a three-dimensional topological insulator layer;

a superconductor region disposed on the three-dimensional topological insulator layer; and

a vortex region extending through the superconductor region to the three-dimensional topological insulator layer and having a peripheral portion located on an edge of the superconductor region, wherein the vortex region includes a cavity extending through the superconductor region to a surface of the three-dimensional topological insulator layer.

2 . The quantum processor of claim 1 , further comprising:

a gate region adjacent to the peripheral portion at the edge, the gate region being selectively tunable to activate tunneling in the three-dimensional topological insulator layer.

3 . The quantum processor of claim 1 , wherein the superconductor region includes a thin wall at the peripheral portion, the thin wall facilitating transfer of a Marjorana zero mode from the vortex region to an exterior of the superconductor region.

4 . The quantum processor of claim 1 , further comprising:

an aperture in the superconductor region at the peripheral portion.

5 . The quantum processor of claim 1 , further comprising:

a magnetic insulator region disposed on the three-dimensional topological insulator layer and at least partially surrounding the superconductor region.

6 . The quantum processor of claim 5 , further comprising:

a quantum dot region that includes a first gate region that extends in a first direction on the magnetic insulator region; and

a second gate region disposed on the magnetic insulator region and positioned between the first gate region and the superconductor region, wherein the superconductor region extends in the first direction.

7 . The quantum processor of claim 5 , wherein the superconductor region is adjacent to the magnetic insulator region on the three- dimensional topological insulator.

8 . A qubit architecture, comprising:

a three-dimensional topological insulator layer;

a first superconductor region on the three-dimensional topological insulator layer;

a first plurality of vortex regions extending through the first superconductor region to the three-dimensional topological insulator layer; and

a first plurality of peripheral portions of the first plurality of vortex regions located at a first edge of the first superconductor region, wherein each of the first plurality of vortex regions include a cavity extending through the first superconductor region to a surface of the three-dimensional topological insulator layer.

9 . The qubit architecture of claim 8 , wherein one or more of the first plurality of peripheral portions include a thin wall that facilitates transfer of a Marjorana zero mode of a vortex region of the first plurality of vortex regions to an exterior of the first superconductor region.

10 . The qubit architecture of claim 8 , wherein one or more of the first plurality of peripheral portions include an aperture extending through the first edge of the first superconductor region.

11 . The qubit architecture of claim 8 , further comprising:

a plurality of gate regions positioned on the first edge of the first superconductor region and adjacent to the first plurality of peripheral portions.

12 . The qubit architecture of claim 8 , further comprising:

a second plurality of vortex regions extending through the first superconductor region to the three-dimensional topological insulator layer; and

a second plurality of peripheral portions of the second plurality of vortex regions located on a second edge of the first superconductor region.

13 . The qubit architecture of claim 8 , further comprising:

a magnetic insulator layer on the three-dimensional topological insulator layer;

a quantum dot region extending along and spaced apart from the first edge; and

a plurality of gate regions on the magnetic insulator layer, the plurality of gate regions positioned between the quantum dot region and the first plurality of peripheral portions.

14 . The qubit architecture of claim 8 , further comprising:

a second superconductor region on the three-dimensional topological insulator layer; and

a second plurality of vortex regions extending through the second superconductor region to the three-dimensional topological insulator layer; and

a second plurality of peripheral portions of the second plurality of vortex regions located on a second edge of the second superconductor region.

15 . The qubit architecture of claim 8 , further comprising:

a quantum dot region extending along and spaced apart from the first edge;

a Fu wire; and

a first set of gate regions positioned on a side of the first superconductor region and configured to selectively couple the Fu wire to a vortex region of the first plurality of vortex regions.

16 . The qubit architecture of claim 15 , wherein the Fu wire includes:

a second superconductor region disposed on the three-dimensional topological insulator;

a second plurality of vortex regions extending through the second super conductor region to the three-dimensional topological insulator layer; and

a second set of gate region positioned on a side of the second superconductor region and configured to selectively couple the Fu wire to the quantum dot region.

17 . A quantum processor, comprising:

a three-dimensional topological insulator layer;

a superconductor region disposed on the three-dimensional topological insulator layer; and

a vortex region extending through the superconductor region to the three-dimensional topological insulator layer and having a peripheral portion located on an edge of the superconductor region, wherein the vortex region includes a cavity extending through the superconductor region to a surface of the three-dimensional topological insulator layer, and wherein the cavity is fillable with a material having a different electromagnetic characteristic than a superconductor material of the superconductor region.

18 . The quantum processor of claim 17 , further comprising:

a gate region adjacent to the peripheral portion at the edge, the gate region being selectively tunable to activate tunneling in the three-dimensional topological insulator layer.

19 . The quantum processor of claim 17 , further comprising:

a magnetic insulator region disposed on the three-dimensional topological insulator layer and at least partially surrounding the superconductor region.

20 . The quantum processor of claim 19 , further comprising:

a quantum dot region that includes a first gate region that extends in a first direction on the magnetic insulator region; and

a second gate region disposed on the magnetic insulator region and positioned between the first gate region and the superconductor region, wherein the superconductor region extends in the first direction.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 1, 2021
From: PIKULIN, DMITRY; LUTCHYN, ROMAN
To: MICROSOFT TECHNOLOGY LICENSING, LLC
Reel/Frame 057359/0726 →
Continuity (1)
Related Publication 20240403680A1 · Dec 5, 2024
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