Light-emitting device array substrate and method for fabricating the same
A light-emitting device array substrate includes a carrier, a plurality of adhesive patterns, and a plurality of light-emitting devices. The adhesive patterns are arranged in an array on the carrier. Each of the light-emitting devices is disposed on a first adhesive pattern among the adhesive patterns. An area of a first surface of each of the first adhesive patterns adjacent to the light-emitting device is less than or equal to an area of a second surface of the light-emitting device adjacent to the first adhesive pattern. A method for fabricating a light-emitting device array substrate is also proposed.
1 . A light-emitting device array substrate, comprising:
a carrier;
a plurality of adhesive patterns arranged in an array on the carrier; and
a plurality of light-emitting devices, wherein each of the light-emitting devices is disposed on a first adhesive pattern among the adhesive patterns, wherein an area of a first surface of each of the first adhesive patterns adjacent to the light-emitting device is less than or equal to an area of a second surface of the light-emitting device adjacent to the first adhesive pattern, and a first spacing between a geometric center of a first light-emitting device among the light-emitting devices and a symmetrical center of the first adhesive pattern under the first light-emitting device is different from a second spacing between a geometric center of a second light-emitting device among the light-emitting devices and a symmetrical center of the first adhesive pattern under the second light-emitting device.
2 . The light-emitting device array substrate according to claim 1 , wherein the area of the first surface is greater than or equal to 4% of the area of the second surface.
3 . The light-emitting device array substrate according to claim 1 , wherein the first spacing is not greater than 10% of a length of the first light-emitting device.
4 . The light-emitting device array substrate according to claim 1 , wherein the adhesive patterns are separated from one another.
5 . The light-emitting device array substrate according to claim 1 , wherein each of the adhesive patterns has an opening.
6 . The light-emitting device array substrate according to claim 1 , wherein each of the adhesive patterns has a trench.
7 . The light-emitting device array substrate according to claim 1 , wherein a second adhesive pattern among the adhesive patterns is not provided with the light-emitting devices.
8 . The light-emitting device array substrate according to claim 1 , further comprising an adhesive material covering the light-emitting devices.
9 . A method for fabricating a light-emitting device array substrate, comprising:
providing a first carrier, wherein a plurality of light-emitting devices are disposed on the first carrier;
providing a second carrier, wherein a plurality of adhesive patterns are arranged in an array on the second carrier; and
transferring the light-emitting devices from the first carrier to the second carrier and arranging each of first light-emitting devices among the light-emitting devices on a first adhesive pattern among the adhesive patterns, wherein an area of a first surface of each of the first adhesive patterns adjacent to the first light-emitting device is less than or equal to an area of a second surface of the first light-emitting device adjacent to the first adhesive pattern, and a first spacing between a geometric center of a first sub-light-emitting device among the first light-emitting devices and a symmetrical center of the first adhesive pattern under the first sub-light-emitting device is different from a second spacing between a geometric center of a second sub-light-emitting device among the first light-emitting devices and a symmetrical center of the first adhesive pattern under the second sub-light-emitting device.
10 . The method for fabricating the light-emitting device array substrate according to claim 9 , wherein the light-emitting devices are disposed on the first carrier through an adhesive material.
11 . The method for fabricating the light-emitting device array substrate according to claim 10 , further comprising removing the adhesive material after transferring the light-emitting devices from the first carrier to the second carrier.
12 . The method for fabricating the light-emitting device array substrate according to claim 11 , wherein portions of the adhesive patterns are removed at the same time when the adhesive material is removed.
13 . The method for fabricating the light-emitting device array substrate according to claim 12 , wherein the area of the first surface is reduced by 5% to 50% after the adhesive material is removed.
14 . The method for fabricating the light-emitting device array substrate according to claim 11 , wherein a third sub-light-emitting device among the first light-emitting devices is removed at the same time when the adhesive material is removed.