IP Library Granted Patent US 12,484,279
Granted Patent B2
US 12,484,279 · App. 18/664,195 · Granted Nov 25, 2025

Semiconductor device

Inventors: Anbang Zhang (Zhuhai, CN); King Yuen Wong (Zhuhai, CN)
Assignee: INNOSCIENCE (ZHUHAI) TECHNOLOGY CO., LTD.
H10D64/118H01L23/3171H01L23/3192H10D30/015H10D30/475H10D62/824H10D62/8503H10D64/411
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Quick Facts
Patent No.
US 12,484,279
App. No.
18/664,195
Granted
Nov 25, 2025
Kind
B2
Abstract

Some embodiments of the disclosure provide a semiconductor device. The semiconductor device comprises: a substrate; a first nitride semiconductor layer on the substrate; a second nitride semiconductor layer on the first nitride semiconductor layer and having a band gap greater than a band gap of the first nitride semiconductor layer; a group III-V dielectric layer disposed on the second nitride semiconductor layer; a gate electrode disposed on the second nitride semiconductor layer; and a first passivation layer disposed on the group III-V dielectric layer, wherein the group III-V dielectric layer is separated from the gate electrode by the first passivation layer.

Claims (13)

1 . A semiconductor device, comprising:

a substrate;

a first nitride semiconductor layer on the substrate;

a second nitride semiconductor layer on the first nitride semiconductor layer and having a band gap greater than a band gap of the first nitride semiconductor layer;

a gate electrode having a first portion with a first length and in direct contact with the second nitride semiconductor layer, and a second portion with a second length different from the first length and on the first portion; and

a passivation layer disposed on the second nitride semiconductor layer,

wherein the first length and the second length are measured in a channel length direction, and

wherein the passivation layer has a sidewall in direct contact with the second nitride semiconductor layer, the first portion of the gate electrode and the second portion of the gate electrode.

2 . The semiconductor device according to claim 1 , wherein the second length is greater than the first length.

3 . The semiconductor device according to claim 1 , further comprising:

a group III-V dielectric layer in direct contact with the second nitride semiconductor layer.

4 . The semiconductor device according to claim 3 , wherein the passivation layer separates the gate electrode from the group III-V dielectric layer.

5 . The semiconductor device according to claim 3 , wherein the group III-V dielectric layer includes aluminum nitride (AlN).

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 5, 2026
From: STEGE, ALEXANDER; ZAGROBA, JOSEPH
To: AUMOVIO SYSTEMS, INC.
Reel/Frame 074870/0731 →
Continuity (2)
Division 16968875
Related Publication 20240304683A1 · Sep 12, 2024
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