Robot and substrate orientation examination method
A robot that transfers a substrate includes a hand, an arm, a substrate detector, and a substrate orientation examiner. The hand holds and transfers the substrate. The arm is connected to the hand and moves the hand. The substrate detector detects absence or presence of the substrate in a non-contact manner. The substrate orientation examiner examines an orientation of the substrate based on a height detected by the substrate detector at which the substrate is located when it is not held by the hand.
1 . A robot that transfers a substrate, comprising:
an arm;
a hand that is installed to the arm and holds and transfers the substrate, wherein the hand includes a first finger and a second finger separated along a separation direction;
a mapping sensor including a transmitter installed on the first finger and a receiver installed on the second finger, wherein the mapping sensor detects:
absence or presence of the substrate between the first finger and the second finger using a detection light, and
a height, along a direction perpendicular to the separation direction, at which the substrate is located when not held by the hand; and
control circuitry configured to determine a magnitude of a tilt of the substrate, by examining an orientation of the substrate while the orientation of the hand is changed, based on a plurality of detected thicknesses, wherein
each of the plurality of detected thicknesses is calculated from height information indicating the height detected by the mapping sensor during a vertical movement of the hand, and
each detected thickness is obtained at a different orientation of the hand in a plan view.
2 . The robot according to claim 1 , wherein
the control circuitry determines a maximum value and a minimum value of heights at which the presence of the substrate is detected based on output from the mapping sensor while the hand is vertically moved, and
the control circuitry examines the orientation of the substrate based on a detected thickness, which is a difference between the maximum value and the minimum value, and an actual thickness of the substrate.
3 . The robot according to claim 1 , wherein the control circuitry is further configured to acquire roll tilt information based on the output of the mapping sensor.
4 . The robot according to claim 1 , further comprising a tilter which adjusts an orientation of the hand.
5 . The robot according to claim 4 , wherein the tilter includes a tilter mechanism located between the arm and the hand.
6 . The robot according to claim 5 , wherein the tilter includes a top plate supporting the hand and a bottom plate fixed to the arm.
7 . The robot according to claim 6 , wherein the tilter further includes
a height adjuster between the top plate and the bottom plate, and
the height adjuster includes at least two supports which change a height between the top plate and the bottom plate.
8 . The robot according to claim 1 , wherein the control circuitry is further configured to control movement of the hand in a vertical direction, perpendicular to the separation direction, relative to the substrate for the mapping sensor to perform the scanning and while maintaining the hand oriented along a horizontal orientation.
9 . The robot according to claim 8 , wherein the control circuitry is further configured to calculate a detected thickness of the substrate based on a distance the hand moved in the vertical direction while the mapping sensor detected the presence of the substrate.
10 . The robot according to claim 9 , wherein the control circuitry is further configured to determine whether a difference between the calculated detected thickness and a known actual thickness of the substrate exceeds a predetermined threshold.
11 . The robot according to claim 10 , wherein the control circuitry is further configured to determine that the orientation of the substrate is tilted relative to the detection light in a case that the difference exceeds the predetermined threshold.
12 . The robot according to claim 11 , wherein in the case that the difference exceeds the predetermined threshold, the control circuitry is further configured to control a tilter to change a tilt of the hand relative to a horizontal plane to change an orientation of the detection light relative to the substrate.
13 . The robot according to claim 12 , wherein after the tilt of the hand is changed, the control circuitry is configured to acquire a renewed detected thickness by moving the hand vertically relative to the substrate.
14 . The robot according to claim 13 , wherein the control circuitry is further configured to
acquire multiple detected thicknesses, each corresponding to a different tilt of the detection light, and
determine the orientation of the substrate based on the tilt of the detection light corresponding to a detected thickness closest in value to the known actual thickness.
15 . The robot according to claim 8 , wherein the control circuitry is configured to control the movement of the hand in the vertical direction at a constant speed during the scanning by the mapping sensor.
16 . A substrate orientation examination method applied to a robot that transfers a substrate, the robot including an arm, a hand installed to the arm and a mapping sensor installed to the arm, the method comprising:
detecting, with the mapping sensor which includes a transmitter installed on a first finger of the hand and a receiver installed on a second finger the hand:
absence or presence of the substrate between the first finger and the second finger using a detection light, and
a height, the height along a direction perpendicular to the separation direction, at which the substrate is located when not held by the hand; and
determining a magnitude of a tilt of the substrate, by examining an orientation of the substrate based on a plurality of detected thicknesses, wherein
each of the plurality of detected thicknesses is calculated from height information indicating the height detected by the mapping sensor during a vertical movement of the hand, and
each detected thickness is obtained at a different orientation of the hand in a plan view.