Light-emitting substrate, manufacturing method thereof, and display device
A light-emitting substrate, a manufacturing method thereof, and a display device are provided. The light-emitting substrate includes a driving circuit layer, a light-emitting diode (LED) chip, an encapsulation layer, and a cover plate. The driving circuit layer includes a binding electrode. A connection electrode of the LED chip is connected to the binding electrode. The encapsulation layer is disposed on a side of the LED chip away from the driving circuit layer. The encapsulation layer covers the LED chip and the driving circuit layer. The cover plate is disposed on a side of the encapsulation layer away from the LED chip. A surface of the cover plate away from the encapsulation layer is a light-emitting surface of the light-emitting substrate.
1 . A light-emitting substrate, comprising:
a driving circuit layer comprising a binding electrode;
a light-emitting diode (LED) chip comprising a connection electrode, wherein the connection electrode is connected to the binding electrode;
an encapsulation layer disposed on a side of the LED chip away from the driving circuit layer, wherein the encapsulation layer covers the LED chip and the driving circuit layer; and
a cover plate disposed on a side of the encapsulation layer away from the LED chip, wherein a surface of the cover plate away from the encapsulation layer is a light-emitting surface of the light-emitting substrate,
wherein the light-emitting substrate further comprises a substrate, and the substrate is disposed on a side of the driving circuit layer away from the LED chip, the driving circuit layer further comprises a bonding pad, the substrate is a flexible substrate, a via hole is provided on the substrate, and the via hole is arranged corresponding to the bonding pad and exposes a surface of the bonding pad away from the cover plate; and
the light-emitting substrate further comprises at least one driver chip, the driver chip comprises a binding pin, and the binding pin is correspondingly connected to the bonding pad through the via hole.
2 . The light-emitting substrate according to claim 1 , wherein a diameter of the via hole is greater than a radial dimension of the binding pin, and at least a portion of the binding pin is disposed in the via hole.
3 . The light-emitting substrate according to claim 1 , wherein the binding pin is fastened to the via hole.
4 . The light-emitting substrate according to claim 1 , wherein the driving circuit layer further comprises a bonding pad, the light-emitting substrate further comprises at least one driver chip, the driver chip is disposed on a side of the driving circuit layer away from the LED chip, the driver chip comprises a binding pin, and the binding pin is correspondingly connected to the bonding pad.
5 . The light-emitting substrate according to claim 1 , wherein the binding pin is in contact with the bonding pad, and a metallic bond is formed between the binding pin and the bonding pad.
6 . The light-emitting substrate according to claim 1 , wherein the light-emitting substrate further comprises a conductive adhesive layer, the conductive adhesive layer is disposed between the bonding pad and the driver chip, and the binding pin and the bonding pad are connected through the conductive adhesive layer.
7 . The light-emitting substrate according to claim 1 , wherein the light-emitting substrate is a display panel or a backlight.
8 . A display device, wherein the display device is formed by splicing at least two light-emitting substrates according to claim 1 .
9 . The display device according to claim 8 , wherein the light-emitting substrate further comprises a substrate, and the substrate is disposed on a side of the driving circuit layer away from the LED chip.
10 . The display device according to claim 9 , wherein the driving circuit layer further comprises a bonding pad, the substrate is a flexible substrate, a via hole is provided on the substrate, and the via hole is arranged corresponding to the bonding pad and exposes a surface of the bonding pad away from the cover plate; and
the light-emitting substrate further comprises at least one driver chip, the driver chip comprises a binding pin, and the binding pin is correspondingly connected to the bonding pad through the via hole.
11 . The display device according to claim 10 , wherein a diameter of the via hole is greater than a radial dimension of the binding pin, and at least a portion of the binding pin is disposed in the via hole.
12 . The display device according to claim 10 , wherein the binding pin is fastened to the via hole.
13 . The display device according to claim 8 , wherein the driving circuit layer further comprises a bonding pad, the light-emitting substrate further comprises at least one driver chip, the driver chip is disposed on a side of the driving circuit layer away from the LED chip, the driver chip comprises a binding pin, and the binding pin is correspondingly connected to the bonding pad.
14 . The display device according to claim 10 , wherein the binding pin is in contact with the bonding pad, and a metallic bond is formed between the binding pin and the bonding pad.
15 . The display device according to claim 10 , wherein the light-emitting substrate further comprises a conductive adhesive layer, the conductive adhesive layer is disposed between the bonding pad and the driver chip, and the binding pin and the bonding pad are connected through the conductive adhesive layer.
16 . The display device according to claim 8 , wherein the light-emitting substrate is a display panel or a backlight.
17 . A manufacturing method of a light-emitting substrate, comprising:
providing a rigid substrate;
sequentially forming a substrate and a driving circuit layer on the rigid substrate, wherein the driving circuit layer comprises a binding electrode and a bonding pad;
providing a plurality of light-emitting diode (LED) chips, wherein a connection electrode of one of the LED chips is correspondingly bound and connected to the binding electrode;
sequentially forming an encapsulation layer and a cover plate on a side of the LED chips away from the rigid substrate; and
removing the rigid substrate.
18 . The manufacturing method of the light-emitting substrate according to claim 17 , further comprising:
performing a full-surface etching or a hole-forming etching on the substrate to expose a surface of the bonding pad away from the cover plate; and
providing a driver chip, and binding the driver chip to the bonding pad.