IP Library › Granted Patent US 12,492,488
Granted Patent B2
US 12,492,488 · App. 16/861,885 · Granted Dec 9, 2025

Silicon carbide epitaxial growth device and method of manufacturing silicon carbide epitaxial wafer

Inventors: Masashi Sakai (Tokyo, JP); Shinichiro Katsuki (Tokyo, JP); Kazuo Kobayashi (Tokyo, JP); Yasunari Hino (Tokyo, JP)
Assignee: Mitsubishi Electric Corporation
C30B25/12C23C16/325C23C16/4584C23C16/46C30B25/10C30B29/36H01L21/02378H01L21/02529H01L21/0262H01L21/02634H01L21/67103H01L21/68757H01L21/68785
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Quick Facts
Patent No.
US 12,492,488
App. No.
16/861,885
Granted
Dec 9, 2025
Kind
B2
Abstract

Provided are a silicon carbide epitaxial growth device capable of fostering epitaxial growth on a silicon carbide substrate. Mounting a wafer holder loaded with a silicon carbide substrate and a tantalum carbide member to a turntable in a susceptor, and supplying a growth gas, a doping gas, and a carrier gas into the susceptor by heating by induction heating coils placed around the susceptor, thereby epitaxial growth is fostered, and stable and proper device characteristics are obtained, moreover, the yield in a manufacturing step of the silicon carbide epitaxial wafer is significantly improved.

Claims (22)

1 . A silicon carbide epitaxial growth device comprising:

a wafer holder on which a silicon carbide substrate is mounted;

a turntable on which the wafer holder is mounted;

a susceptor covering the silicon carbide substrate and the wafer holder, and into which a growth gas, a doping gas, and a carrier gas are supplied;

induction heating coils provided around the susceptor; and

a tantalum carbide member mounted into the surface on a peripheral edge portion in an upper portion of the wafer holder and only at an outer edge of the silicon carbide substrate closest to an outermost periphery of the wafer holder.

2 . The silicon carbide epitaxial growth device according to claim 1 , wherein

the tantalum carbide member includes a tantalum carbide layer as a surface layer thereof which is formed from a carbon material, the tantalum carbide member being replaceable.

3 . The silicon carbide epitaxial growth device according to claim 1 , wherein

the tantalum carbide member has a shape extending along an outer peripheral of the wafer holder which is on outside of the silicon carbide substrate.

4 . The silicon carbide epitaxial growth device according to claim 1 , wherein

the wafer holder has a step shape at a peripheral edge portion thereof and the tantalum carbide member is mounted at a step of the peripheral edge portion of the wafer holder.

5 . A method of manufacturing a silicon carbide epitaxial wafer comprising:

carrying a wafer holder loaded with a silicon carbide substrate and a tantalum carbide member mounted into the surface on a peripheral edge portion in an upper portion of the wafer holder to a turntable in a susceptor by a transfer mechanism such that the tantalum carbide member is arranged at only an outer edge of the silicon carbide substrate closest to an outermost periphery of the wafer holder;

heating the silicon carbide substrate, the wafer holder, and the turntable by induction heating coils provided around the susceptor;

supplying a growth gas, a doping gas and a carrier gas into the susceptor;

cooling by stopping heating and gas supply; and

carrying the wafer holder out of the turntable by the transfer mechanism and unloading the silicon carbide substrate.

6 . The silicon carbide epitaxial growth device according to claim 1 , wherein

the portion of the surface of the wafer holder into which the tantalum carbide member is mounted is separate from the portion of the surface of the wafer holder that the silicon carbide substrate is mounted.

7 . The method according to claim 5 , wherein

the portion of the surface of the wafer holder into which the tantalum carbide member is mounted is separate from the portion of the surface of the wafer holder that the silicon carbide substrate is mounted.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 29, 2020
From: SAKAI, MASASHI; KATSUKI, SHINICHIRO; KOBAYASHI, KAZUO; HINO, YASUNARI
To: MITSUBISHI ELECTRIC CORPORATION
Reel/Frame 052527/0074 →
Priority Claims (1)
JP 2019-129923 · Jul 12, 2019 · national
Continuity (1)
Related Publication 20210010158A1 · Jan 14, 2021
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