IP Library Granted Patent US 12,501,202
Granted Patent B2
US 12,501,202 · App. 18/133,695 · Granted Dec 16, 2025

Microphone module and electronic device comprising microphone module

Inventors: Hongki Kim (Gyeonggi-do, KR); Hyunmin Oh (Gyeonggi-do, KR); Jungsoo Kim (Gyeonggi-do, KR); Chijeong Choi (Gyeonggi-do, KR); Yongsang Yun (Gyeonggi-do, KR)
Assignee: Samsung Electronics Co., Ltd.
H04R1/1075H04R1/04H04R1/1016H04R1/1041
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Quick Facts
Patent No.
US 12,501,202
App. No.
18/133,695
Granted
Dec 16, 2025
Kind
B2
Abstract

An electronic device and microphone module are disclosed. The electronic device includes a housing forming at least part of an exterior of the electronic device, a nozzle part protruding in one direction from a portion of the housing, at least one sound hole formed at one end of the nozzle part, a sound tube formed within the nozzle part, a microphone module disposed within the sound tube, and including a microphone hole formed on one side thereof, a speaker module disposed under the microphone module, wherein at least some of the microphone inclines in a specific direction within the sound tube, and is coupled to an interior of the nozzle part. The microphone module includes a microphone, a circuit board, a first and second plate, and a waterproofing member.

Claims (37)

1 . An electronic device, comprising:

a housing forming at least part of an exterior of the electronic device;

a nozzle part protruding in one direction from a portion of the housing;

at least one sound hole formed at one end of the nozzle part;

a sound tube formed in at least a portion of the nozzle part;

a microphone module disposed within the sound tube, and including a microphone hole formed on one side of the microphone module; and

a speaker module disposed under the microphone module,

wherein at least a portion of the microphone module inclines in a specific direction within the sound tube, and is coupled to an interior of the nozzle part,

wherein the microphone module includes:

a microphone that converts a voice input received through the microphone hole into an electrical signal;

a first plate;

a second plate substantially parallel to the first plate;

a printed circuit board (PCB) disposed between the first plate and the microphone;

a waterproof member disposed between the first plate and the second plate and coupled with the first plate and the second plate;

wherein the second plate is at least partially coupled to the first plate.

2 . The electronic device of claim 1 , wherein the nozzle part includes a protrusion portion formed along a circumference of one end thereof, and an ear tip detachably coupled to the protrusion portion.

3 . The electronic device of claim 1 , wherein the microphone hole is disposed at an obtuse angle with respect to the sound tube.

4 . The electronic device of claim 1 , further comprising a battery disposed under the speaker module wherein the battery supplies power to the microphone module and/or the speaker module.

5 . The electronic device of claim 1 ,

wherein at least a portion of the PCB electrically connected to the microphone is disposed along a sidewall of the speaker module, and is electrically connected to a main printed circuit board (PCB) of the speaker module through a connecting member.

6 . The electronic device of claim 1 , wherein at least a portion of the microphone is coupled to the interior of the nozzle part using an adhesive member.

7 . The electronic device of claim 1 , wherein a sealing member fills a space formed between the microphone and the PCB.

8 . The electronic device of claim 1 , wherein at least a portion of a lower surface of the first plate and at least a portion of an upper surface of the second plate are coupled together.

9 . The electronic device of claim 1 , wherein the speaker module is inclined towards a direction of the sound tube.

10 . The electronic device of claim 1 , wherein the microphone module is disposed between the sound hole and the speaker module.

11 . A microphone module, comprising:

a microphone that converts a voice input received through a microphone hole into an electrical signal;

a first plate;

a second plate substantially parallel to the first plate;

a printed circuit board (PCB) disposed between the first plate and the microphone; and

a waterproof member disposed between the first plate and the second plate and coupled with the first plate and the second plate, wherein the second plate is at least partially coupled to the first plate, and

wherein the first plate includes at least one hole formed at a position corresponding to the microphone hole;

the second plate includes at least one hole formed at a position corresponding to the microphone hole;

the PCB includes at least one hole formed at a position corresponding to the microphone hole; and

the waterproof member includes at least one hole formed at a position corresponding to the microphone hole.

12 . The microphone module of claim 11 , wherein a sealing member fills a space formed between the microphone and the printed circuit board.

13 . The microphone module of claim 11 , wherein at least a portion of a lower surface of the first plate and at least a portion of an upper surface of the second plate are coupled together.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 12, 2023
From: KIM, HONGKI; OH, HYUNMIN; KIM, JUNGSOO; CHOI, CHIJEONG; YUN, YONGSANG
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 063301/0590 →
Priority Claims (1)
KR 10-2021-0003807 · Jan 12, 2021 · national
Continuity (2)
Continuation PCTKR2021016957 · Nov 18, 2021
Related Publication 20230254628A1 · Aug 10, 2023
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