Semiconductor devices and data storage systems including the same
A semiconductor device includes a peripheral circuit structure including: a first substrate, circuit devices on the first substrate, a lower wiring structure electrically connected to the circuit devices, a lower insulating layer covering the lower wiring structure, and a diffusion barrier layer on the lower insulating layer; and a memory cell structure including a second substrate including first and second regions on the peripheral circuit structure, gate electrodes stacked and spaced apart from each other in a first direction perpendicular to an upper surface of the second substrate in the first region and extending in a second direction perpendicular to the first direction to form a staircase shape in the second region, and channel structures penetrating the gate electrodes in the first direction and each including a channel layer. The diffusion barrier layer includes a first material layer having a hydrogen permeability lower than a hydrogen permeability of silicon nitride.
1 . A semiconductor device, comprising:
a peripheral circuit structure including a first substrate, circuit devices on the first substrate, a lower wiring structure electrically connected to the circuit devices, a lower insulating layer covering the lower wiring structure, and a diffusion barrier layer on the lower insulating layer; and
a memory cell structure including a second substrate including first and second regions on the peripheral circuit structure, gate electrodes stacked and spaced apart from each other in a first direction perpendicular to an upper surface of the second substrate in the first region and extending in a second direction perpendicular to the first direction to form a staircase shape in the second region, and channel structures penetrating the gate electrodes in the first direction and each including a channel layer,
wherein the diffusion barrier layer includes a first material layer having a hydrogen permeability lower than a hydrogen permeability of silicon nitride, and
wherein the diffusion barrier layer is in contact with the lower insulating layer.
2 . The semiconductor device of claim 1 , wherein the diffusion barrier layer is spaced apart from the lower wiring structure in the first direction.
3 . The semiconductor device of claim 1 ,
wherein the first material layer includes a two-dimensional material, polysilicon, or metal oxide, and
wherein the two-dimensional material includes graphene, hexagonal boron nitride (h-BN), black phosphorus, or transition metal di-chalcogenide (TMDC).
4 . The semiconductor device of claim 3 , wherein the first material layer includes two or more two-dimensional materials.
5 . The semiconductor device of claim 3 , wherein a thickness of the diffusion barrier layer is in a range of about 1 Å to about 200 Å.
6 . The semiconductor device of claim 1 , wherein the diffusion barrier layer further includes a second material layer on an upper surface of the first material layer and including a material different from that of the first material layer.
7 . The semiconductor device of claim 6 ,
wherein the diffusion barrier layer further includes a third material layer on a lower surface of the first material layer and including a material different from that of the first material layer,
wherein the second material layer is between the first material layer and the second substrate, and
wherein the third material layer is between the first material layer and the lower insulating layer.
8 . The semiconductor device of claim 7 , wherein at least one of the second and third material layers includes silicon nitride.
9 . The semiconductor device of claim 1 ,
wherein the lower insulating layer includes a first lower insulating layer having an upper surface coplanar with an upper surface of the lower wiring structure, and a second lower insulating layer covering the first lower insulating layer and the lower wiring structure,
wherein the peripheral circuit structure further includes a buffer layer between the lower wiring structure and the second lower insulating layer, and
wherein the diffusion barrier layer is on a vertical level higher than a vertical level of the buffer layer.
10 . The semiconductor device of claim 9 , wherein a first thickness of the diffusion barrier layer is smaller than a second thickness of the buffer layer.
11 . The semiconductor device of claim 9 , wherein the diffusion barrier layer includes a material having a hydrogen permeability lower than that of the buffer layer.
12 . The semiconductor device of claim 1 , further comprising:
a lower via extending from a lower surface of the second substrate and connected to the lower wiring structure,
wherein the lower via extends into the peripheral circuit structure and penetrates the diffusion barrier layer.
13 . The semiconductor device of claim 1 ,
wherein the memory cell structure further includes:
an external substrate insulating layer adjacent the second substrate on an external side of the second substrate on the first substrate; and
a through-via penetrating the external substrate insulating layer and connected to the lower wiring structure,
wherein the diffusion barrier layer extends from a region between the lower insulating layer and the second substrate to a region between the lower insulating layer and the external substrate insulating layer.
14 . The semiconductor device of claim 13 , wherein the through-via penetrates the diffusion barrier layer and is connected to the lower wiring structure.
15 . A semiconductor device, comprising:
a first substrate;
circuit devices on the first substrate;
a lower wiring structure electrically connected to the circuit devices;
a first lower insulating layer covering a side surface of the lower wiring structure;
a buffer layer covering the first lower insulating layer and the lower wiring structure;
a second lower insulating layer on the buffer layer;
a diffusion barrier layer on the second lower insulating layer;
a second substrate including first and second regions on the diffusion barrier layer;
gate electrodes stacked and spaced apart from each other in a first direction perpendicular to an upper surface of the second substrate in the first region and extending in a second direction perpendicular to the first direction at various lengths to form a staircase shape in the second region; and
channel structures penetrating the gate electrodes in the first direction and each including a channel layer,
wherein the diffusion barrier layer includes a first material layer which is a two-dimensional material layer, and
wherein the diffusion barrier layer is in contact with the second lower insulating layer.
16 . The semiconductor device of claim 15 , wherein a hydrogen permeability of the first material layer is less than about 7.4×1012/m2s (at 1 nm, 1 bar).
17 . The semiconductor device of claim 15 ,
wherein the buffer layer includes silicon nitride, and
wherein the first material layer has a thickness smaller than that of the buffer layer.
18 . The semiconductor device of claim 15 , wherein the diffusion barrier layer further includes a second material layer in contact with the first material layer and including the same material as that of the buffer layer.
19 . A data storage system, comprising:
a semiconductor storage device including: a peripheral circuit structure including a first substrate, circuit devices on the first substrate, a lower wiring structure electrically connected to the circuit devices, a lower insulating layer covering the lower wiring structure, and a diffusion barrier layer on the lower insulating layer; and a memory cell structure including a second substrate including first and second regions on the peripheral circuit structure, gate electrodes stacked and spaced apart from each other in a first direction perpendicular to an upper surface of the second substrate in the first region and extending in a second direction perpendicular to the first direction to form a staircase shape in the second region, and channel structures penetrating the gate electrodes in the first direction and each including a channel layer, and an input/output pad electrically connected to the circuit devices; and
a controller electrically connected to the semiconductor storage device through the input/output pad and configured to control the semiconductor storage device,
wherein the diffusion barrier layer includes a first material layer having a hydrogen permeability lower than a hydrogen permeability of silicon nitride, and
wherein the diffusion barrier layer is in contact with the lower insulating layer.
20 . The data storage system of claim 19 , wherein the first material layer includes at least one two-dimensional material.