Wiring module
A wiring module is attached to a plurality of power storage elements, and includes: a flexible printed circuit board; and a protector holding the flexible printed circuit board, wherein the flexible printed circuit board includes a base film, a plurality of conduction paths that are disposed on a surface of the base film, and a connector that has an opposing surface opposing the surface of the base film and that is connected to the plurality of conduction paths, the plurality of conduction paths and electrode terminals of the plurality of power storage elements are electrically connected, the connector includes connection portions that are connected to the plurality of conduction paths, and at least some of the plurality of conduction paths are routed from the connection portions through a space between the surface of the base film and the opposing surface of the connector.
1 . A wiring module attached to a plurality of power storage elements, comprising:
a flexible printed circuit board; and
a protector holding the flexible printed circuit board,
wherein the flexible printed circuit board comprises a base film, a plurality of conduction paths that are disposed on a surface of the base film, and a connector that has an opposing surface opposing the surface of the base film and that is connected to the plurality of conduction paths,
the plurality of conduction paths and electrode terminals of the plurality of power storage elements are electrically connected,
the connector includes connection portions that are connected to the plurality of conduction paths, and
at least some of the plurality of conduction paths are routed from the connection portions through a space between the surface of the base film and the opposing surface of the connector.
2 . The wiring module according to claim 1 ,
wherein the surface of the base film intersects a first direction, and
the connector has an opening portion that is open on the opposite side to the opposing surface in the first direction and that receives a mating connector that is fitted to the connector.
3 . The wiring module according to claim 1 ,
wherein the surface of the base film intersects a first direction,
the connector includes an opening portion that is open on one side in a second direction intersecting the first direction and that receives a mating connector that is fitted to the connector, and
the connection portions are disposed on the other side of the connector in the second direction.
4 . The wiring module according to claim 3 ,
wherein the plurality of conduction paths include first conduction paths that are routed from the connection portions toward the opposite direction from the opening portion, and second conduction paths that are routed from the connection portions through the space between the surface of the base film and the opposing surface of the connector.
5 . The wiring module according to claim 4 ,
wherein the second conduction paths are routed from the connection portions toward the opening portion.
6 . The wiring module according to claim 5 ,
wherein the second conduction paths are bent in the vicinity of the opening portion of the connector and routed toward a direction that is different from the second direction.
7 . The wiring module according to claim 6 ,
wherein a reinforcement plate is provided on the reverse side of the base film from the connector in the first direction.
8 . The wiring module according to claim 7 ,
wherein a recess portion in which the bent second conduction paths are routed is provided in an end portion of the protector on the one side in the second direction.
9 . The wiring module according to claim 8 ,
wherein the protector is provided with a locking portion for locking the second conduction paths routed in the recess portion.
10 . The wiring module according to claim 1 ,
wherein electroconductive members are connected to the electrode terminals,
the flexible printed circuit board includes lands, and
the lands are connected to at least one side surface of the electroconductive members by soldering.
11 . The wiring module according to claim 10 ,
wherein the lands are connected to only one side surface of the electroconductive members by soldering.