IP Library › Granted Patent US 12,626,996
Granted Patent B2
US 12,626,996 · App. 18/271,956 · Granted May 12, 2026

Wiring module

Inventors: Shuya Ikeda (Osaka, JP); Osamu Nakayama (Osaka, JP); Katsuhi Miyazaki (Osaka, JP); Mitsutoshi Morita (Osaka, JP)
Assignees: AUTONETWORKS TECHNOLOGIES, LTD.; SUMITOMO WIRING SYSTEMS, LTD.; SUMITOMO ELECTRIC INDUSTRIES, LTD.
H01M50/298H01M50/519
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Quick Facts
Patent No.
US 12,626,996
App. No.
18/271,956
Granted
May 12, 2026
Kind
B2
Abstract

A wiring module is attached to a plurality of power storage elements and includes an FPC, a reinforcing plate attached to the FPC, and a protector for holding the FPC and the reinforcing plate. The FPC is electrically connected to electrode terminals of the plurality of power storage elements. The reinforcing plate has an attachment surface to which the FPC is attached. The protector is provided with a mounting recess where the reinforcing plate is mounted. The mounting recess includes a plurality of side surface portions for suppressing displacement of the reinforcing plate in a direction that is perpendicular to a plate thickness direction of the reinforcing plate and an engaging portion for engaging an end portion of the attachment surface and suppressing displacement of the reinforcing plate in the plate thickness direction.

Claims (38)

1 . A wiring module to be attached to a plurality of power storage elements comprising:

a flexible printed circuit board;

a reinforcing plate attached to the flexible printed circuit board; and

a protector for holding the flexible printed circuit board and the reinforcing plate,

wherein the flexible printed circuit board is electrically connected to electrode terminals of the plurality of power storage elements,

the reinforcing plate has an attachment surface to which the flexible printed circuit board is attached,

the protector is provided with a mounting recess where the reinforcing plate is mounted, and

the mounting recess includes a plurality of side surface portions for suppressing displacement of the reinforcing plate in a direction that is perpendicular to a plate thickness direction of the reinforcing plate and an engaging portion for engaging an end portion of the attachment surface and suppressing displacement of the reinforcing plate in the plate thickness direction.

2 . The wiring module according to claim 1 ,

wherein the flexible printed circuit board includes a connector, and

the connector is provided on an opposite side of the flexible printed circuit board to the reinforcing plate.

3 . The wiring module according to claim 2 ,

wherein the connector includes an opening which is open in the plate thickness direction and into which a mating connector fits.

4 . The wiring module according to claim 2 ,

wherein the connector includes an opening which extends in a direction perpendicular to the plate thickness direction and into which a mating connector fits.

5 . The wiring module according to claim 1 ,

wherein a plurality of the engaging portions are provided, and the engaging portions are disposed so as to be spaced apart from each other around an outer periphery of the mounting recess.

6 . The wiring module according to claim 1 ,

wherein the engaging portion includes:

an engagement catch capable of elastic deformation in a direction perpendicular to the plate thickness direction; and

a restraining portion that suppresses displacement of the reinforcing plate toward an outside of the mounting recess when the reinforcing plate is mounted in the mounting recess by bending the engagement catch.

7 . The wiring module according to claim 6 ,

wherein the plurality of side surface portions include a first side surface portion and a second side surface portion that are perpendicular to a first direction that is perpendicular to the plate thickness direction,

the engagement catch is provided on the first side surface portion and is capable of elastic deformation in the first direction,

the restraining portion is provided on the second side surface portion, and

the engagement catch includes an inclined portion that is inclined so that a length by which the engagement catch protrudes from the first side surface portion toward the second side surface portion increases in a depth direction of the mounting recess, which is the plate thickness direction.

8 . The wiring module according to claim 7 ,

wherein the mounting recess includes a pressing portion that suppresses displacement of the reinforcing plate in the first direction by pressing an outer edge portion of the reinforcing plate against the first side surface portion.

9 . The wiring module according to claim 8 ,

wherein the pressing portion is provided on the second side surface portion side of the mounting recess,

a direction that is perpendicular to the plate thickness direction and the first direction is a second direction, and

the engagement catch and the pressing portion are disposed at a same position in the second direction.

10 . The wiring module according to claim 7 ,

wherein the flexible printed circuit board is disposed at one end in the first direction of the protector.

11 . The wiring module according to claim 1 , further comprising bus bars to be connected to the electrode terminals,

wherein the protector includes a bus bar holding portion for holding the bus bars,

the flexible printed circuit board includes bus bar connecting portions to be connected to the bus bars, and

the reinforcing plate is disposed between the bus bar connecting portions that are adjacent.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 12, 2023
From: IKEDA, SHUYA; NAKAYAMA, OSAMU; MIYAZAKI, KATSUHI; MORITA, MITSUTOSHI
To: AUTONETWORKS TECHNOLOGIES, LTD.; SUMITOMO WIRING SYSTEMS, LTD.; SUMITOMO ELECTRIC INDUSTRIES, LTD.
Reel/Frame 064231/0796 →
Priority Claims (1)
JP 2021-010280 · Jan 26, 2021 · national
Continuity (1)
Related Publication 20240154235A1 · May 9, 2024
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