IP Library Granted Patent US 12,514,021
Granted Patent B2
US 12,514,021 · App. 18/888,868 · Granted Dec 30, 2025

Solar cell, manufacturing method thereof, and photovoltaic module

Inventors: Kun Yu (Zhejiang, CN); Changming Liu (Zhejiang, CN); Xinyu Zhang (Zhejiang, CN)
Assignees: SHANGHAI JINKO GREEN ENERGY ENTERPRISE MANAGEMENT CO., LTD.; ZHEJIANG JINKO SOLAR CO., LTD.
H10F71/129H10F10/14H10F71/1224H10F77/1645H10F77/707
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,514,021
App. No.
18/888,868
Granted
Dec 30, 2025
Kind
B2
Abstract

A solar cell includes a semiconductor substrate, in which a rear surface of the semiconductor substrate having non-pyramid-shaped microstructures, the non-pyramid-shaped microstructures include two or more first substructures at least partially stacked on one another, and a one-dimensional size of the surface of the outermost first substructure is less than or equal to 45 μm; a first passivation layer located on a front surface of the semiconductor substrate; first and second tunnel oxide layers located on the non-pyramid-shaped microstructures; first and second doped conductive layers located on a surface of the first and second tunnel oxide layers, the first and second doped conductive layer has different conductive types; a second passivation layer located on a surface of the first and second doped conductive layers; and electrodes formed by penetrating through the second passivation layer to be in contact with the first and second doped conductive layers.

Claims (31)

1 . A solar cell, comprising:

a semiconductor substrate, wherein a rear surface of the semiconductor substrate includes non-pyramid-shaped microstructures, the non-pyramid-shaped microstructures include two or more first substructures at least partially stacked on one another, a surface of the first substructure is polygonal, and in a direction away from the rear surface and perpendicular to the rear surface, a distance between a surface of the outermost first substructure and a surface of an adjacent first substructure is equal to or less than 2 μm; and wherein a front surface of the semiconductor substrate includes pyramid-shaped microstructures, the pyramid-shaped microstructures include a top portion away from the front surface of the semiconductor substrate and a bottom portion close to the front surface of the semiconductor substrate, and in a direction away from the front surface and perpendicular to the front surface, a distance between the top portion and the bottom portion of the pyramid-shaped microstructure is less than or equal to 5 μm;

a first passivation layer located on a front surface of the semiconductor substrate;

a tunnel oxide layer located on the non-pyramid-shaped microstructures of the rear surface of the semiconductor substrate;

a doped conductive layer located on a surface of the tunnel oxide layer; and

a second passivation layer located on a surface of the doped conductive layer.

2 . The solar cell according to claim 1 , wherein a one-dimensional size of a surface of the outermost first substructure is less than or equal to 45 μm.

3 . The solar cell according to claim 1 , wherein a shape of the polygonal plane of the first substructure includes at least one of a diamond, a square, a trapezoid, a substantially diamond, a substantially square or a substantially trapezoid.

4 . The solar cell according to claim 1 , wherein the first passivation layer includes at least one of a silicon oxide layer, an aluminum oxide layer, a silicon nitride layer or a silicon oxynitride layer.

5 . The solar cell according to claim 4 , wherein the first passivation layer has a thickness ranging from 10 nm to 120 nm.

6 . The solar cell according to claim 1 , wherein the first passivation layer is a stacked layer of an aluminum oxide layer, a silicon nitride layer and a silicon oxynitride layer.

7 . The solar cell according to claim 6 , wherein the aluminum oxide layer has a thickness ranging from 2 nm to 10 nm.

8 . The solar cell according to claim 6 , wherein the silicon nitride layer has a thickness ranging from 40 nm to 80 nm.

9 . The solar cell according to claim 6 , wherein the silicon oxynitride layer has a thickness ranging from 10 nm to 60 nm.

10 . The solar cell according to claim 1 , wherein the second passivation layer includes at least one of a silicon nitride layer, a silicon oxide layer or a silicon oxynitride layer.

11 . The solar cell according to claim 10 , wherein the second passivation layer has a thickness ranging from 70 nm to 120 nm.

12 . The solar cell according to claim 1 , wherein the tunnel oxide layer includes at least one of a silicon oxide layer, an aluminum oxide layer, a silicon oxynitride layer, a molybdenum oxide layer or a hafnium oxide layer.

13 . The solar cell according to claim 12 , wherein the tunnel oxide layer has a thickness ranging from 0.8 nm to 2 nm.

14 . The solar cell according to claim 1 , wherein a thickness of the tunnel oxide layer on a top surface of the outermost first substructure is less than a thickness of the tunnel oxide layer on a side surface of the outermost first substructure.

15 . The solar cell according to claim 14 , wherein a thickness difference between the tunnel oxide layer on the top surface of the outermost first substructure and the tunnel oxide layer on a side surface of the outermost substructure is less than or equal to 0.15 nm.

16 . The solar cell according to claim 1 , wherein a band gap width of the tunnel oxide layer is greater than 3.0 eV.

17 . The solar cell according to claim 1 , wherein the doped conductive layer has a thickness ranging from 60 nm to 200 nm.

18 . A photovoltaic module, comprising:

a plurality of solar cell strings, wherein each of the plurality of solar cell strings comprises solar cells, and at least one of the solar cells comprises:

a semiconductor substrate, wherein a rear surface of the semiconductor substrate includes non-pyramid-shaped microstructures, the non-pyramid-shaped microstructures include two or more first substructures at least partially stacked on one another, a surface of the first substructure is polygonal, and in a direction away from the rear surface and perpendicular to the rear surface, a distance between a surface of the outermost first substructure and a surface of an adjacent first substructure is equal to or less than 2 μm; and wherein a front surface of the semiconductor substrate includes pyramid-shaped microstructures, the pyramid-shaped microstructures include a top portion away from the front surface of the semiconductor substrate and a bottom portion close to the front surface of the semiconductor substrate, and in a direction away from the front surface and perpendicular to the front surface, a distance between the top portion and the bottom portion of the pyramid-shaped microstructure is less than or equal to 5 μm;

a first passivation layer located on a front surface of the semiconductor substrate;

a tunnel oxide layer located on the non-pyramid-shaped microstructures of the rear surface of the semiconductor substrate;

a doped conductive layer located on a surface of the tunnel oxide layer; and

a second passivation layer located on a surface of the doped conductive layer.

19 . The photovoltaic module according to claim 18 , wherein a one-dimensional size of a surface of the outermost first substructure is less than or equal to 45 μm.

20 . The photovoltaic module according to claim 18 , wherein a shape of the polygonal plane of the first substructure includes at least one of a diamond, a square, a trapezoid, a substantially diamond, a substantially square or a substantially trapezoid.

Priority Claims (1)
CN 202110895225.8 · Aug 4, 2021 · national
Continuity (5)
Continuation 18367235 · Sep 12, 2023
Continuation 18071430 · Nov 29, 2022
Continuation In Part 17964190 · Oct 12, 2022
Division 17459689 · Aug 27, 2021
Related Publication 20250048774A1 · Feb 6, 2025
References Cited (99)
US 9893215B2 · Schmidt et al. · 2018 [cited by applicant]
US 10014419B2 · Ha et al. · 2018 [cited by applicant]
US 10522707B2 · Gibson et al. · 2019 [cited by applicant]
US 20130153025A1 · Hahn et al. · 2013 [cited by applicant]
US 20150102212A1 · Ruh · 2015 [cited by applicant]
US 20150162487A1 · Deshazer et al. · 2015 [cited by applicant]
US 20160225924A1 · Kwan et al. · 2016 [cited by applicant]
US 20160351737A1 · Chung et al. · 2016 [cited by applicant]
US 20170179325A1 · Chung et al. · 2017 [cited by applicant]
US 20180018295A1 · Chen et al. · 2018 [cited by applicant]
US 20180182905A1 · Nam et al. · 2018 [cited by applicant]
US 20180277701A1 · Lenes et al. · 2018 [cited by applicant]
US 20180315866A1 · Cheong et al. · 2018 [cited by applicant]
US 20190207040A1 · Harrington et al. · 2019 [cited by applicant]
CN 1780727A · 2006 [cited by applicant]
CN 102484168A · 2012 [cited by applicant]
CN 102683439 · 2012 [cited by applicant]
CN 103325871 · 2013 [cited by applicant]
CN 104103699A · 2014 [cited by applicant]
CN 104350607 · 2015 [cited by applicant]
CN 105655427A · 2016 [cited by applicant]
CN 105789343A · 2016 [cited by applicant]
CN 105826405 · 2016 [cited by applicant]
CN 105826411A · 2016 [cited by applicant]
CN 105914249A · 2016 [cited by applicant]
CN 107904663A · 2018 [cited by applicant]
CN 108400173A · 2018 [cited by applicant]
CN 108963013 · 2018 [cited by applicant]
CN 109545880 · 2019 [cited by applicant]
CN 110021681A · 2019 [cited by applicant]
CN 110197858A · 2019 [cited by applicant]
CN 110660883A · 2020 [cited by applicant]
CN 110797434A · 2020 [cited by applicant]
CN 110931596 · 2020 [cited by applicant]
CN 111015369A · 2020 [cited by applicant]
CN 111180538 · 2020 [cited by applicant]
CN 111341881A · 2020 [cited by applicant]
CN 111560249A · 2020 [cited by applicant]
CN 111628049 · 2020 [cited by applicant]
CN 111640824A · 2020 [cited by applicant]
CN 111668345A · 2020 [cited by applicant]
CN 111739984A · 2020 [cited by applicant]
CN 111834476A · 2020 [cited by applicant]
CN 112111279A · 2020 [cited by applicant]
CN 112186069A · 2021 [cited by applicant]
CN 112259614A · 2021 [cited by applicant]
CN 112309849A · 2021 [cited by applicant]
CN 112466962A · 2021 [cited by applicant]
CN 212750903 · 2021 [cited by applicant]
CN 112599615 · 2021 [cited by applicant]
CN 112635591A · 2021 [cited by applicant]
CN 113035978A · 2021 [cited by applicant]
EP 2149915 · 2010 [cited by applicant]
EP 2471109B1 · 2013 [cited by applicant]
EP 2645421 · 2013 [cited by applicant]
EP 3358627A1 · 2018 [cited by applicant]
EP 3017520B1 · 2020 [cited by applicant]
EP 4131425A1 · 2023 [cited by applicant]
EP 4372829A2 · 2024 [cited by applicant]
EP 4372829B1 · 2025 [cited by applicant]
JP 0661515 · 1994 [cited by applicant]
JP 2004273829 · 2004 [cited by applicant]
JP 2011129867A · 2011 [cited by applicant]
JP 2012216788 · 2012 [cited by applicant]
JP 2015531550A · 2015 [cited by applicant]
JP 2016506077A · 2016 [cited by applicant]
JP 2018037549A · 2018 [cited by applicant]
JP 6746854 · 2020 [cited by applicant]
KR 20120080583 · 2012 [cited by applicant]
KR 20180058099 · 2018 [cited by applicant]
KR 20190058017 · 2019 [cited by applicant]
WO 2013098955A1 · 2013 [cited by applicant]
WO WO2013186945 · 2013 [cited by applicant]
WO WO2015122257 · 2015 [cited by applicant]
WO 2016114271A1 · 2016 [cited by applicant]
WO WO2016129481 · 2016 [cited by applicant]
WO 2018084159A1 · 2018 [cited by applicant]
Chinese Grant of Patent for Application No. 202211229358.2 with English Translation, mailed Apr. 28, 2025, (5 pages). [cited by applicant]
Japanese Office Action for Application No. 2024-228550 with English Translation, mailed Apr. 8, 2025 (16 pages). [cited by applicant]
Japanese Notice of Reasons for Refusal for Application No. 2021-137285, mailed Jan. 11, 2022 (17 pages). [cited by applicant]
Japanese Notification of Reasons for Refusal for Application No. 2022-084397, mailed Aug. 2, 2022 (4 pages). [cited by applicant]
Australian Notice of Acceptance for Application No. 2021225144, mailed Jun. 10, 2022 (6 pages). [cited by applicant]
Extended European Search Report for Application No. 21194044.0, mailed Dec. 2, 2021, (7 pages). [cited by applicant]
Chinese Office Action for Application No. 202110895225.8, mailed Dec. 5, 2022 (14 pages). [cited by applicant]
U.S. Notice of Allowance for U.S. Appl. No. 17/459,689, dated Oct. 31, 2022, (12 pages). [cited by applicant]
U.S. Corrected Notice of Allowability for U.S. Appl. No. 17/964,190, dated Aug. 30, 2023, (8 pages). [cited by applicant]
Japanese Office Action for Application No. 2022-176074, mailed Apr. 11, 2023 (4 pages). [cited by applicant]
U.S. Non-Final Office Action for U.S. Appl. No. 18/071,430, dated Jun. 30, 2023 (11 Pages). [cited by applicant]
Japanese Notice of Reasons for Refusal for Application No. 2023-129723, mailed Dec. 5, 2023 (6 pages). [cited by applicant]
Japanese Grant of Patent for Application No. 2023-129723, mailed Dec. 3, 2024 (5 pages). [cited by applicant]
Rentsch et al., “Challenges for Single-Side Chemical Processing,” Photovoltaics International, Sixth Edition, May 2012, (5 pp.). [cited by applicant]
Pang, “Process Study of Trough Type Wet Method Alkaline Polishing of PERC Solar Cells,” Journal of Synthetic Crystals, vol. 48, No. 1, pp. 178-184, (Jan. 2019)—English Abstract. [cited by applicant]
Kafle et al., “TOPcon—Technology Options for Cost Efficient Industrial Manufacturing,” Solar Energy Materials and Solar Cells, No. 227, (2021). [cited by applicant]
Kim et al., “The Effect of Rear Surface Polishing to the Performance of Thin Crystalline Silicon Solar Cells,” Solar Energy, No. 85, pp. 1085-1090, (2011). [cited by applicant]
Wei et al., “Research on KOH Alkaline Etching Process of Monocrystalline Silicon Piece,” Energy and Energy Conservation, Jan. 2020, 172, pp. 129-131, English Abstract. [cited by applicant]
Wang et al., “The solar cell back-side polishing process study based on TMAH.”, Journal of Functional Materials, Jul. 30, 2015, vol. 46, No. 14, pp. 14127-14129, 14133, English Abstract. [cited by applicant]
Xin LV, “Study on Topcon N-Pert Double-Sided Solar Cell Technology,” Microelectronics and Solid State Electronics major, Xi'an University of Technology, Master's Degree Paper, English Abstract. [cited by applicant]
Wenija et al., “Study of Rear Surface Treatment for Perl Silicon Solar Cell,” Acta Energiae Solaris Sinica, Oct. 2016, vol. 37, No. 10, pp. 2460-2466, English Abstract. [cited by applicant]
Handbook of Photovoltaic Science and Engineering edited by A. Lugue and S. Hegedus, 2003, John Wiley & Sons, Ltd. [cited by applicant]