Measuring apparatus for semiconductor device and measuring method using the same
A measuring apparatus for a semiconductor device includes a lower frame that provides a lower measurement space configured for performing a first measurement process, a lower measuring portion in the lower frame and configured to measure the first semiconductor substrate on a lower substrate stage, a lower vibration damping portion configured to offset a first vibration of the lower measuring portion with respect to a ground, an upper frame that provides an upper measurement space configured for performing a second measurement process, an upper measuring portion in the upper frame to measure a second semiconductor substrate=on an upper substrate stage, an upper vibration damping portion configured to offset a second vibration of the upper measuring portion with respect to the ground, and a plurality of support structures that support the upper frame such that the upper frame is spaced apart from the lower frame.
1 . A measuring apparatus for a semiconductor device, comprising:
a lower frame that provides a lower measurement space configured for performing a first measurement process on a first semiconductor substrate;
a lower measuring portion in the lower frame and configured to measure a characteristic of the first semiconductor substrate on a lower substrate stage;
a lower vibration damping portion configured to offset a first vibration of the lower measuring portion with respect to a ground;
an upper frame that provides an upper measurement space configured for performing a second measurement process on a second semiconductor substrate;
an upper measuring portion in the upper frame and configured to measure a characteristic of the second semiconductor substrate on an upper substrate stage;
an upper vibration damping portion configured to offset a second vibration of the upper measuring portion with respect to the ground; and
a plurality of support structures that support the upper frame such that the upper frame is spaced apart from the lower frame.
2 . The measuring apparatus of claim 1 , wherein the lower vibration damping portion comprises:
a plurality of first serial type dampers under the lower frame; and
a plurality of first parallel type dampers in the lower frame and configured to support the lower measuring portion, and
wherein the upper vibration damping portion comprises:
a plurality of second serial type dampers between the upper frame and the plurality of support structures; and
a plurality of second parallel type dampers in the upper frame and configured to support the upper measuring portion.
3 . The measuring apparatus of claim 2 , wherein the first and second serial type dampers and the first and second parallel type dampers comprise:
a plurality of vibration sensors configured to obtain vibration data from one of the first and second vibrations, respectively; and
a plurality of actuators configured to offset the one of the first and second vibrations based on the vibration data, respectively.
4 . The measuring apparatus of claim 3 , wherein the lower frame is spaced apart from the ground by a predetermined height through the plurality of first serial type dampers, and the predetermined height is within a range of about 0.7 meters (m) to about 1 m.
5 . The measuring apparatus of claim 3 , further comprising:
a lower plate between the plurality of first serial type dampers and the lower frame, wherein the lower plate supports the lower frame; and
an upper plate between the plurality of second serial type dampers and the upper frame, wherein the upper plate supports the upper frame.
6 . The measuring apparatus of claim 1 , wherein the lower and upper frames comprise lower and upper gates configured to load or to unload the first and second semiconductor substrates into or from the lower and upper measurement spaces, respectively.
7 . The measuring apparatus of claim 6 , further comprising:
a transport device spaced apart from the lower and upper frames,
wherein the transport device comprises:
a stroke extending along the lower and upper gates; and
a transport arm that is movable on the stroke, the transport arm being configured to load or to unload the first and second semiconductor substrates into or from the lower and upper measurement spaces, respectively.
8 . The measuring apparatus of claim 7 , wherein the transport device further comprises a bellows cover configured to damp vibration transmitted to the lower and upper frames.
9 . The measuring apparatus of claim 1 , further comprising:
a working structure spaced apart from the lower frame and the upper frame, the working structure providing a movement route around the upper frame.
10 . The measuring apparatus of claim 1 , wherein the lower frame further comprises a plurality of through openings through which the plurality of support structures extend, respectively, and
wherein an outer surface of each of the plurality of support structures is spaced apart from an inner wall of each of the plurality of through openings.
11 . A measuring apparatus for a semiconductor device, comprising:
a lower measuring device including a lower frame that provides a lower measurement space configured for performing a first measurement process on a first semiconductor substrate, a lower measuring portion in the lower frame and configured to measure a characteristic of the first semiconductor substrate on a lower substrate stage, and a lower vibration damping portion configured to offset a first vibration of the lower measuring portion with respect to a ground;
an upper measuring device including an upper frame that provides an upper measurement space configured for performing a second measurement process on a second semiconductor substrate, an upper measuring portion in the upper frame and configured to measure a characteristic of the second semiconductor substrate on an upper substrate stage, and an upper vibration damping portion configured to offset a second vibration of the upper measuring portion with respect to the ground; and
a plurality of support structures that support the upper measuring device such that the upper measuring device is spaced apart from the lower measuring device.
12 . The measuring apparatus of claim 11 , wherein the lower vibration damping portion comprises:
a plurality of first serial type dampers under the lower frame; and
a plurality of first parallel type dampers in the lower frame and configured to support the lower measuring portion, and
the upper vibration damping portion comprises:
a plurality of second serial type dampers between the upper frame and the plurality of support structures; and
a plurality of second parallel type dampers in the upper frame and configured to support the upper measuring portion.
13 . The measuring apparatus of claim 12 , wherein the first and second serial type dampers and the first and second parallel type dampers comprise:
a plurality of vibration sensors configured to obtain vibration data from one of the first and second vibrations, respectively; and
plurality of actuators configured to offset the one of the first and second vibrations based on the vibration data, respectively.
14 . The measuring apparatus of claim 13 , wherein the lower measuring device further comprises a lower plate that is between the plurality of first serial type dampers and the lower frame, wherein the lower plate supports the lower frame, and
the upper measuring device further comprises an upper plate that is between the plurality of second serial type dampers and the upper frame, wherein the upper plate supports the upper frame.
15 . The measuring apparatus of claim 11 , wherein the lower and upper frames comprise lower and upper gates configured to load or to unload the first and second semiconductor substrates into or from the lower and upper measurement spaces, respectively.
16 . The measuring apparatus of claim 15 , further comprising:
a transport device spaced apart from the lower and upper frames,
wherein the transport device comprises:
a stroke extending along the lower and upper gates; and
a transport arm that is movable on the stroke, the transport arm being configured to load or to unload the first and second semiconductor substrates into or from the lower and upper measurement spaces, respectively.
17 . The measuring apparatus of claim 16 , wherein the transport device further comprises a bellows cover configured to damp vibration transmitted to the lower and upper frames.
18 . The measuring apparatus of claim 11 , further comprising:
a working structure spaced apart from the lower frame and the upper frame, the working structure providing a movement route around the upper frame.
19 . The measuring apparatus of claim 11 , wherein the lower frame further comprises a plurality of through openings through which the plurality of support structures extend, respectively, and
wherein an outer surface of each of the plurality of support structures is spaced apart from an inner wall of each of the plurality of through openings.
20 . A measuring apparatus for a semiconductor device, comprising:
a lower frame that provides a lower measurement space;
a lower measuring portion in the lower frame and configured to measure a characteristic of a first semiconductor substrate on a lower substrate stage;
a lower vibration damping portion configured to offset a first vibration of the lower measuring portion with respect to a ground;
an upper frame that provides an upper measurement space;
an upper measuring portion in the upper frame and configured to measure a characteristic of a second semiconductor substrate on an upper substrate stage;
an upper vibration damping portion configured to offset a second vibration of the upper measuring portion with respect to the ground; and
a plurality of support structures that support the upper frame such that the upper frame is spaced apart from the lower frame,
wherein the lower frame further comprises a plurality of through openings through which the plurality of support structures extend, respectively, and
wherein an outer surface of each of the plurality of support structures is spaced apart from an inner wall of each of the plurality of through openings.