Small footprint independent heatsink attachment for a pluggable optical module
A heatsink assembly including a printed circuit board having a primary side and a secondary side, a pluggable optical module cage coupled to the primary side of the printed circuit board and adapted to receive a pluggable optical module on the primary side of the printed circuit board, a plurality of pins coupled to the printed circuit board and protruding from the secondary side of the printed circuit board, a secondary side heatsink disposed on the secondary side of the printed circuit board and in thermal contact with the pluggable optical module through openings defined in the printed circuit board and a secondary side of the pluggable optical module cage, and a spring clip coupled to the plurality of pins and adapted to bias the secondary side heatsink towards a secondary side of the pluggable optical module to promote the thermal contact between the secondary side heatsink and the pluggable optical module.
1 . A heatsink assembly, comprising:
a printed circuit board having a primary side and a secondary side;
a pluggable optical module cage coupled to the primary side of the printed circuit board and adapted to receive a pluggable optical module on the primary side of the printed circuit board;
a plurality of pins coupled to the printed circuit board and protruding from the secondary side of the printed circuit board;
a secondary side heatsink disposed on the secondary side of the printed circuit board and in thermal contact with the pluggable optical module through an opening defined in the printed circuit board and an opening defined in a secondary side of the pluggable optical module cage; and
a spring clip coupled to the plurality of pins and adapted to bias the secondary side heatsink towards a secondary side of the pluggable optical module to promote the thermal contact between the secondary side heatsink and the pluggable optical module.
2 . The heatsink assembly of claim 1 , further comprising:
a primary side heatsink disposed on the primary side of the printed circuit board and in thermal contact with the pluggable optical module through an opening defined in a primary side of the pluggable optical module cage; and
one or more clip springs coupled to the pluggable optical module cage and adapted to bias the primary side heatsink towards a primary side of the pluggable optical module to promote the thermal contact between the primary side heatsink and the pluggable optical module.
3 . The heatsink assembly of claim 2 , wherein the biasing of the secondary side heatsink towards the secondary side of the pluggable optical module is independent of the biasing of the primary side heatsink towards the primary side of the pluggable optical module.
4 . The heatsink assembly of claim 2 , wherein a thickness of the printed circuit board may be varied to a degree without affecting the biasing of the secondary side heatsink towards the secondary side of the pluggable optical module or the biasing of the primary side heatsink towards the primary side of the pluggable optical module.
5 . The heatsink assembly of claim 1 , wherein the plurality of pins do not protrude from the primary side of the printed circuit board adjacent to the pluggable optical module cage to an extent that the pins constrain the placement of the pluggable optical module cage or any primary side components on the printed circuit board.
6 . The heatsink assembly of claim 1 , wherein each of the plurality of pins defines a circumferential recess at an end thereof.
7 . The heatsink assembly of claim 6 , wherein the spring clip is a Z-shaped spring clip comprising slotted end portions and a central spring portion, wherein the slotted end portions are adapted to engage the circumferential recesses of the plurality of pins and the central spring portion is adapted to bias the secondary side heatsink towards the secondary side of the pluggable optical module.
8 . The heatsink assembly of claim 1 , wherein the secondary side heatsink defines a recess adapted to receive a portion of the spring clip therein.
9 . The heatsink assembly of claim 2 , wherein the primary side heatsink defines one or more recesses adapted to receive portions of the one or more clip springs.
10 . A heatsink assembly, comprising:
a printed circuit board having a primary side and a secondary side;
a pluggable optical module cage coupled to the primary side of the printed circuit board and adapted to receive a pluggable optical module on the primary side of the printed circuit board;
a plurality of pins coupled to the printed circuit board and protruding from the secondary side of the printed circuit board;
a secondary side heatsink disposed on the secondary side of the printed circuit board and in thermal contact with the pluggable optical module through an opening defined in the printed circuit board and an opening defined in a secondary side of the pluggable optical module cage;
a spring clip coupled to the plurality of pins and adapted to bias the secondary side heatsink towards a secondary side of the pluggable optical module to promote the thermal contact between the secondary side heatsink and the pluggable optical module;
a primary side heatsink disposed on the primary side of the printed circuit board and in thermal contact with the pluggable optical module through an opening defined in a primary side of the pluggable optical module cage; and
one or more clip springs coupled to the pluggable optical module cage and adapted to bias the primary side heatsink towards a primary side of the pluggable optical module to promote the thermal contact between the primary side heatsink and the pluggable optical module.
11 . The heatsink assembly of claim 10 , wherein:
the biasing of the secondary side heatsink towards the secondary side of the pluggable optical module is independent of the biasing of the primary side heatsink towards the primary side of the pluggable optical module; and
the plurality of pins do not protrude from the primary side of the printed circuit board adjacent to the pluggable optical module cage to an extent that the pins constrain the placement of the pluggable optical module cage or any primary side components on the printed circuit board.
12 . A method for cooling a pluggable optical module received in a primary side pluggable optical module cage coupled to a printed circuit board having a primary side and a secondary side, the method comprising:
coupling a plurality of pins to the printed circuit board such that the plurality of pins protrude from the secondary side of the printed circuit board;
disposing a secondary side heatsink on the secondary side of the printed circuit board in thermal contact with the pluggable optical module through an opening defined in the printed circuit board and an opening defined in a secondary side of the pluggable optical module cage; and
coupling a spring clip to the plurality of pins such that the spring clip biases the secondary side heatsink towards a secondary side of the pluggable optical module to promote the thermal contact between the secondary side heatsink and the pluggable optical module.
13 . The method of claim 12 , further comprising:
disposing a primary side heatsink on the primary side of the printed circuit board in thermal contact with the pluggable optical module through an opening defined in a primary side of the pluggable optical module cage; and
coupling one or more clip springs to the pluggable optical module cage such that the one or more clip springs bias the primary side heatsink towards a primary side of the pluggable optical module to promote the thermal contact between the primary side heatsink and the pluggable optical module.
14 . The method of claim 13 , wherein the biasing of the secondary side heatsink towards the secondary side of the pluggable optical module is independent of the biasing of the primary side heatsink towards the primary side of the pluggable optical module.
15 . The method of claim 13 , wherein a thickness of the printed circuit board may be varied to a degree without affecting the biasing of the secondary side heatsink towards the secondary side of the pluggable optical module or the biasing of the primary side heatsink towards the primary side of the pluggable optical module.
16 . The method of claim 12 , wherein the plurality of pins do not protrude from the primary side of the printed circuit board adjacent to the pluggable optical module cage to an extent that the pins constrain the placement of the pluggable optical module cage or any primary side components on the printed circuit board.
17 . The method of claim 12 , wherein each of the plurality of pins defines a circumferential recess at an end thereof.
18 . The method of claim 17 , wherein the spring clip is a Z-shaped spring clip comprising slotted end portions and a central spring portion, wherein the slotted end portions are adapted to engage the circumferential recesses of the plurality of pins and the central spring portion is adapted to bias the secondary side heatsink towards the secondary side of the pluggable optical module.
19 . The method of claim 12 , wherein the secondary side heatsink defines a recess adapted to receive a portion of the spring clip therein.
20 . The method of claim 13 , wherein the primary side heatsink defines one or more recesses adapted to receive portions of the one or more clip springs.