IP Library › Granted Patent US 12,530,096
Granted Patent B2
US 12,530,096 · App. 18/747,987 · Granted Jan 20, 2026

Chip on flex

Inventors: Xuerui Gong (Beijing, CN); Jiangsheng Wang (Beijing, CN); Yong Yu (Beijing, CN); Chang Zhang (Beijing, CN)
Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.; BOE TECHNOLOGY GROUP CO., LTD.
G06F3/04164G06F3/044H05K1/0281H05K1/117H05K1/118H05K2201/10128
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Quick Facts
Patent No.
US 12,530,096
App. No.
18/747,987
Granted
Jan 20, 2026
Kind
B2
Abstract

The embodiments of the present disclosure provide a chip on flex (COF), a touch assembly, and a display device. The chip on flex includes a flexible base provided with a first opening, the flexible base includes a bonding area provided with a plurality of metal bonding pads; on the flexible base, a spacing area with a preset range is provided between the first opening and the bonding area; wherein, the flexible base is provided with a reinforcement sheet thereon, the reinforcement sheet is located on a portion of the flexible base other than the first opening, the spacing area and the bonding area.

Claims (23)

1 . A chip on flex, comprising a flexible base provided with a first opening, the flexible base comprising a bonding area provided with a plurality of metal bonding pads; on the flexible base, a spacing area with a preset range being provided between the first opening and the bonding area; wherein, the flexible base is provided with a reinforcement sheet thereon, the reinforcement sheet is located on a portion of the flexible base other than the first opening, the spacing area and the bonding area, wherein the reinforcement sheet is made of steel;

wherein along a first direction, the width of the chip on flex at the bonding area is larger than the width of the chip on flex at a location corresponding to the first opening;

wherein the reinforcement sheet is provided with a second opening, and an orthographic projection of the first opening on a plane where the reinforcement sheet is located is inside the second opening or coincides with edges of the first opening.

2 . The chip on flex according to claim 1 , wherein the reinforcement sheet is provided on a surface of the flexible base opposite to the display flexible circuit board.

3 . The chip on flex according to claim 1 , wherein the reinforcement sheet is provided at least along one edge of the first opening.

4 . The chip on flex according to claim 1 , wherein the plurality of metal bonding pads in the bonding area are arranged along the first direction, the first opening is provided on a side away from the bonding area along a second direction, the second direction is vertical to the first direction;

between the first opening and the bonding area, a size range of the preset range in the first direction is equal to a size range of the flexible base in the first direction, and a size range of the preset range in the second direction is a preset width range from the bonding area.

5 . The chip on flex according to claim 4 , wherein, in the second direction, a distance between the first opening and the bonding area is larger than a width value of the preset width range.

6 . The chip on flex according to claim 1 , wherein the metal bonding pads and the reinforcement sheet are located on a same surface of the flexible base.

7 . The chip on flex according to claim 1 , wherein the chip on flex further comprises a control chip which is located on a portion of the flexible base other than the first opening, the spacing area, the bonding area and the reinforcement sheet.

8 . The chip on flex according to claim 1 , wherein the reinforcement sheet is adhered and fixed to the flexible base.

9 . A chip on flex, comprising a flexible base provided with a first opening, the flexible base comprising a bonding area provided with a plurality of metal bonding pads; on the flexible base, a spacing area with a preset range being provided between the first opening and the bonding area; wherein, the flexible base is provided with a reinforcement sheet thereon, the reinforcement sheet is located on a portion of the flexible base other than the first opening, the spacing area and the bonding area, wherein the reinforcement sheet is made of steel;

wherein along a first direction, the width of the chip on flex at the bonding area is larger than the width of the chip on flex at a location corresponding to the first opening;

wherein a bending area portion is formed between the first opening and the bonding area; and on a portion of the flexible base extending from the bonding area towards a second direction, a size range of the spacing area on the flexible base is larger than or equal to a size range of the bending area portion.

10 . The chip on flex according to claim 9 , wherein the reinforcement sheet is provided on a surface of the flexible base opposite to the display flexible circuit board.

11 . The chip on flex according to claim 9 , wherein the reinforcement sheet is provided at least along one edge of the first opening.

12 . The chip on flex according to claim 9 , wherein the reinforcement sheet is provided with a second opening, and an orthographic projection of the first opening on a plane where the reinforcement sheet is located is inside the second opening or coincides with edges of the first opening.

13 . The chip on flex according to claim 9 , wherein the plurality of metal bonding pads in the bonding area are arranged along the first direction, the first opening is provided on a side away from the bonding area along the second direction, the second direction is vertical to the first direction;

between the first opening and the bonding area, a size range of the preset range in the first direction is equal to a size range of the flexible base in the first direction, and a size range of the preset range in the second direction is a preset width range from the bonding area.

14 . The chip on flex according to claim 13 , wherein, in the second direction, a distance between the first opening and the bonding area is larger than a width value of the preset width range.

15 . The chip on flex according to claim 9 , wherein the metal bonding pads and the reinforcement sheet are located on a same surface of the flexible base.

16 . The chip on flex according to claim 9 , wherein the chip on flex further comprises a control chip which is located on a portion of the flexible base other than the first opening, the spacing area, the bonding area and the reinforcement sheet.

17 . The chip on flex according to claim 9 , wherein the reinforcement sheet is adhered and fixed to the flexible base.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 19, 2024
From: GONG, XUERUI; WANG, JIANGSHENG; YU, YONG; ZHANG, CHANG
To: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.; BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 067772/0458 →
Continuity (3)
Continuation 18322494 · May 23, 2023
Continuation 16767577
Related Publication 20240338093A1 · Oct 10, 2024
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