IP Library › Granted Patent US 12,531,184
Granted Patent B2
US 12,531,184 · App. 18/071,248 · Granted Jan 20, 2026

Coil component

Inventor: Jun Seok Oh (Suwon-si, KR)
Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
H01F27/324H01F27/02H01F27/2828H01F27/292H01F27/30
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Quick Facts
Patent No.
US 12,531,184
App. No.
18/071,248
Granted
Jan 20, 2026
Kind
B2
Abstract

A coil component includes: a body having one surface, and opposite end surfaces facing each other while each being connected to the one surface; a coil unit disposed within the body; slit portions formed in edges at which the one surface of the body meets the opposite end surfaces of the body, respectively; first and second external electrodes disposed on the opposite end surfaces of the body, each thereof being connected to the coil unit, and extending to the one surface of the body through the slit portions, respectively; and a cover insulating layer covering each of the first and second external electrodes disposed on the opposite end surfaces of the body and on the slit portions.

Claims (32)

1 . A coil component comprising:

a body having one surface, and opposite end surfaces facing each other while each being connected to the one surface;

a coil unit disposed within the body;

slit portions disposed in edges at which the one surface of the body meets the opposite end surfaces of the body, respectively;

first and second external electrodes disposed on the opposite end surfaces of the body, each thereof being connected to the coil unit, and extending to the one surface of the body through the slit portions, respectively; and

a cover insulating layer covering each of the first and second external electrodes disposed on the opposite end surfaces of the body and on the slit portions.

2 . The coil component of claim 1 , wherein the coil unit includes first and second lead-out portions extending from the opposite end surfaces of the body to be connected to the first and second external electrodes, respectively, and

the slit portions are spaced apart from the first and second lead-out portions, respectively.

3 . The coil component of claim 2 , wherein each of the slit portions has an inner wall and a lower surface, and

a mean depth from the one surface of the body to the lower surface of the slit portion is 30 μm or more and 80 μm or less.

4 . The coil component of claim 1 , wherein each of the slit portions has an inner wall and a lower surface, and

a mean depth from the one surface of the body to the lower surface of the slit portion is 30 μm or more and 80 μm or less.

5 . The coil component of claim 4 , wherein the coil unit is a wire-wound type coil.

6 . The coil component of claim 1 , wherein each of the first and second external electrodes includes a connection portion connected to the coil unit on each of the opposite end surfaces of the body, and a pad portion extending from the connection portion to the one surface of the body, and

each of the connection portion and the pad portion includes a first metal layer.

7 . The coil component of claim 6 , wherein the first metal layer of the connection portion and the first metal layer of the pad portion are integrally formed.

8 . The coil component of claim 6 , wherein the pad portion further includes a second metal layer disposed on the first metal layer.

9 . The coil component of claim 8 , wherein the pad portion further includes a third metal layer disposed on the second metal layer.

10 . The coil component of claim 9 , wherein a portion of the third metal layer is disposed on the cover insulating layer.

11 . The coil component of claim 8 , wherein, along a thickness direction of the coil component, the first metal layer disposed on at least one of the slit portions overlaps the cover insulating layer and the second metal layer, in order.

12 . The coil component of claim 8 , wherein a portion of the second metal layer is disposed on the cover insulating layer.

13 . The coil component of claim 6 , wherein the cover insulating layer includes a first region covering the first metal layer disposed on each of the opposite end surfaces of the body, and a second region covering the first metal layer disposed on each of the slit portions, and

a mean thickness CT 2 of the cover insulating layer in the second region is larger than a mean thickness CT 1 of the cover insulating layer in the first region.

14 . The coil component of claim 1 , further comprising a surface insulating layer covering regions in which the first and second external electrodes are not disposed on surfaces of the body.

15 . The coil component of claim 14 , wherein the body further has the other surface facing the one surface, and

the coil component further comprises recess portions disposed at edges at which the other surface of the body meets the opposite end surfaces of the body, respectively.

16 . The coil component of claim 15 , wherein at least portions of the surface insulating layer are disposed in the recess portions.

17 . The coil component of claim 1 , further comprising a substrate disposed within the body, with the coil unit being disposed on at least one surface thereof,

wherein a side surface of the substrate contacts each of the first and second external electrodes.

18 . The coil component of claim 1 , wherein the coil unit is a wire-wound type coil.

19 . The coil component of claim 1 , wherein each of the slit portions has an inner wall and a lower surface, and

a mean depth from the one surface of the body to the lower surface of the slit portion is more than 29 μm and 82 μm or less.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 29, 2022
From: OH, JUN SEOK
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 061913/0990 →
Priority Claims (1)
KR 10-2021-0184077 · Dec 21, 2021 · national
Continuity (1)
Related Publication 20230197334A1 · Jun 22, 2023
References Cited (23)
US 11600434B2 · Kim · 2023 [cited by examiner]
US 20100219925A1 · Yamamoto · 2010 [cited by examiner]
US 20160268038A1 · Choi · 2016 [cited by examiner]
US 20180182537A1 · Shimizu · 2018 [cited by examiner]
US 20180277296A1 · Endo · 2018 [cited by examiner]
US 20190189338A1 · Kim · 2019 [cited by examiner]
US 20190304671A1 · Yang · 2019 [cited by examiner]
US 20190333679A1 · Lee · 2019 [cited by examiner]
US 20200020477A1 · Kang · 2020 [cited by examiner]
US 20200035404A1 · Lim · 2020 [cited by examiner]
US 20200098508A1 · Park · 2020 [cited by examiner]
US 20200286674A1 · Han · 2020 [cited by examiner]
US 20200350115A1 · Kang · 2020 [cited by examiner]
US 20200381170A1 · Park · 2020 [cited by examiner]
US 20210057138A1 · Yang et al. · 2021 [cited by applicant]
US 20210151248A1 · Ohkubo · 2021 [cited by examiner]
US 20210202157A1 · Shin et al. · 2021 [cited by applicant]
JP 2007266487A · 2007 [cited by examiner]
JP 2012060013A · 2012 [cited by examiner]
JP 2018107346A · 2018 [cited by applicant]
KR 102138885B1 · 2020 [cited by applicant]
KR 102248520B1 · 2021 [cited by applicant]
KR 1020210082829A · 2021 [cited by applicant]