Micro-semiconductor chip transfer apparatus and chip extraction apparatus
A micro-semiconductor chip transfer apparatus includes: a wet chip supply module configured to supply a plurality of micro-semiconductor chips and liquid onto a transfer substrate; a chip alignment module including an absorber configured to move along a surface of the transfer substrate while absorbing the liquid; and a chip extraction module configured to extract, from the absorber, the micro-semiconductor chips remaining in the absorber.
1 . A micro-semiconductor chip transfer apparatus for wet-aligning a plurality of micro-semiconductor chips in a plurality of grooves of a transfer substrate, the micro-semiconductor chip transfer apparatus comprising:
a wet chip supply module configured to supply the plurality of micro-semiconductor chips and a first liquid onto the transfer substrate in a flowable manner;
a chip alignment module comprising an absorber configured to move along a surface of the transfer substrate to align first micro-semiconductor chips, among the plurality of micro-semiconductor chips, respectively in the plurality of grooves and to absorb the first liquid; and
a chip extraction module configured to extract, from the absorber, second micro-semiconductor chips, among the plurality of micro-semiconductor chips, which are attached to the absorber.
2 . The micro-semiconductor chip transfer apparatus of claim 1 , wherein the chip extraction module comprises a liquid spray cleaner configured to spray a second liquid to the absorber to extract the second micro-semiconductor chips from the absorber.
3 . The micro-semiconductor chip transfer apparatus of claim 2 , wherein the liquid spray cleaner is configured to be rotatable or movable.
4 . The micro-semiconductor chip transfer apparatus of claim 1 , wherein the chip extraction module comprises a holder configured to fix the absorber.
5 . The micro-semiconductor chip transfer apparatus of claim 1 , wherein the chip extraction module comprises an ultrasonic cleaner configured to emit ultrasonic waves towards the absorber to extract the second micro-semiconductor chips from the absorber.
6 . The micro-semiconductor chip transfer apparatus of claim 1 , wherein the chip extraction module comprises a vibration cleaner configured to vibrate the absorber to extract the second micro-semiconductor chips from the absorber.
7 . The micro-semiconductor chip transfer apparatus of claim 1 , wherein the wet chip supply module comprises a liquid supply module configured to supply the first liquid, and a chip supply module configured to supply the plurality of micro-semiconductor chips.
8 . The micro-semiconductor chip transfer apparatus of claim 1 , wherein the wet chip supply module is further configured to supply a suspension containing the plurality of micro-semiconductor chips and the first liquid.
9 . The micro-semiconductor chip transfer apparatus of claim 1 , wherein the chip alignment module further comprises a supply roller to supply the absorber, a recovery roller to recover the absorber, a roller arranged between the supply roller and the recovery roller to support the absorber, and a pressing roller to press the absorber to contact with the transfer substrate.
10 . The micro-semiconductor chip transfer apparatus of claim 9 , wherein
the chip alignment module and the chip extraction module are arranged adjacent to each other,
the chip alignment module and the chip extraction module are provided between the supply roller and the recovery roller, and the absorber is supported between the supply roller and the recovery roller to be continuously moved from the chip alignment module to the chip extraction module.
11 . The micro-semiconductor chip transfer apparatus of claim 1 , wherein the chip extraction module comprises a reservoir, and a plurality of rollers arranged above the reservoir to guide and move the absorber.
12 . The micro-semiconductor chip transfer apparatus of claim 1 , further comprising an inspection module configured to inspect a state of the transfer substrate.
13 . The micro-semiconductor chip transfer apparatus of claim 12 , further comprising a controller configured to control operations of the wet chip supply module and the chip alignment module, based on a result of inspection performed by the inspection module.
14 . The micro-semiconductor chip transfer apparatus of claim 1 , further comprising a cleaning module configured to remove dummy micro-semiconductor chips remaining on the surface of the transfer substrate.
15 . The micro-semiconductor chip transfer apparatus of claim 1 , wherein the chip extraction module further comprises a recovery module configured to recover the second micro-semiconductor chips separated from the transfer substrate.
16 . The micro-semiconductor chip transfer apparatus of claim 1 , wherein the chip extraction module further comprises a filtration module configured to separate impurities from the micro-semiconductor chips extracted by the chip extraction module.
17 . The micro-semiconductor chip transfer apparatus of claim 1 , further comprising an antistatic module configured to supply, onto the transfer substrate, ions for preventing an occurrence of static electricity.
18 . The micro-semiconductor chip transfer apparatus of claim 1 , wherein the absorber comprises a woven, a tissue, polyester fiber, paper, or a wiper.
19 . The micro-semiconductor chip transfer apparatus of claim 1 , wherein the micro-semiconductor chip is one of a micro-light-emitting device, a pressure sensor, a photodiode, a thermistor, or a piezoelectric device.
20 . A chip extraction apparatus comprising:
a holder configured to hold an absorber configured to move along a surface of a transfer substrate to absorb liquid from a transfer substrate during a wet alignment process;
a cleaner configured to release micro-semiconductor chips attached to the absorber during the wet alignment process; and
a container configured to collected the micro-semiconductor chips released from the absorber.
21 . The chip extraction apparatus of claim 20 , wherein the cleaner comprises:
a liquid spray cleaner configured to spray liquid onto the absorber to release the micro-semiconductor chips attached to the absorber during the wet alignment process.