Substrate fixing device
A substrate fixing device includes: a base plate; an electrostatic adsorption member that adsorbs and holds a substrate; and a first adhesive layer that adhesively bonds the electrostatic adsorption member to the base plate. A storage modulus of the first adhesive layer is not less than 0.01 MPa and not more than 25 MPa within a temperature range of −110° C. to 250° C.
1 . A substrate fixing device comprising:
a base plate;
an electrostatic adsorption member that adsorbs and holds a substrate; and
a first adhesive layer that adhesively bonds the electrostatic adsorption member to the base plate,
wherein a storage modulus of the first adhesive layer is not less than 0.01 MPa and not more than 25 MPa throughout a temperature range of −110° C. to 250° C.
2 . The substrate fixing device according to claim 1 , wherein
the storage modulus of the first adhesive layer is not less than 0.01 MPa and not more than 21 MPa throughout a temperature range of −110° C. to 140° C.
3 . The substrate fixing device according to claim 1 , wherein
thickness of the first adhesive layer is not less than 0.05 mm and not more than 0.4 mm.
4 . The substrate fixing device according to claim 3 , wherein
the thickness of the first adhesive layer is not less than 0.05 mm and not more than 0.2 mm.
5 . The substrate fixing device according to claim 1 , wherein
a thermal conductivity of the first adhesive layer is not less than 0.5 W/(m·K) and not more than 10 W/(m·K) throughout the temperature range.
6 . The substrate fixing device according to claim 1 , further comprising:
a second adhesive layer that is provided between the base plate and the first adhesive layer and thinner than the first adhesive layer,
wherein a thermal conductivity of the second adhesive layer is higher than a thermal conductivity of the first adhesive layer throughout the temperature range.
7 . The substrate fixing device according to claim 6 , wherein
a storage modulus of the second adhesive layer is higher than the storage modulus of the first adhesive layer throughout a temperature range of −100° C. to 0° C.
8 . The substrate fixing device according to claim 6 , wherein
a thickness of the second adhesive layer is not less than 0.05 mm and not more than 0.12 mm.
9 . The substrate fixing device according to claim 1 , wherein
the electrostatic adsorption member has an upper face, and a lower face that is opposite to the upper face and faces the base plate,
the substrate fixing device further comprises a second primer layer that is provided on the lower face of the electrostatic adsorption member, and
the first adhesive layer directly contacts the second primer layer.
10 . The substrate fixing device according to claim 1 , wherein
a distance between the base plate and the electrostatic adsorption member is not less than 0.025 mm and not more than 1.025 mm in a thicknesswise direction of the substrate fixing device.