Multilayer electronic component
A multilayer electronic component may include: a body including a dielectric layer and internal electrodes; and external electrodes including an electrode layer disposed on the body and a plating layer disposed on the electrode layer, wherein the plating layer includes an extension extending onto the body to contact the body, and the extension includes one or more grains in which an angle between a surface of the body in contact with the extension and a major axis of the grain is 70 degrees or greater and 110 degrees or less.
1 . A multilayer electronic component comprising:
a body including a dielectric layer and internal electrodes; and
external electrodes including an electrode layer disposed on the body and a plating layer disposed on the electrode layer,
wherein the plating layer includes extension extending onto the body to contact the body, and
the extension includes one or more grains in which an angle between a surface of the body in contact with the extension and a major axis of the one or more grains is 70 degrees or greater and 110 degrees or less.
2 . The multilayer electronic component of claim 1 , wherein
the extension includes a first region adjacent to the body and a second region disposed on the first region, and
the first region includes a first grain, the second region includes a second grain, and an angle between a major axis of the second grain and the surface of the body in contact with the extension is θ2, the second grain satisfies: θ2 is 70 degrees or greater and 110 degrees or less.
3 . The multilayer electronic component of claim 2 , wherein the second grain satisfies: θ2 is 80 degrees or greater and 100 degrees or less.
4 . The multilayer electronic component of claim 2 , wherein an average θ2 value is 70 degrees or greater and 110 degrees or less.
5 . The multilayer electronic component of claim 2 , wherein an average value of a major axis length of the second grain is 1 μm or greater.
6 . The multilayer electronic component of claim 2 , wherein an average value of a major axis length of the second grain is 3 times greater than an average value of a minor axis length.
7 . The multilayer electronic component of claim 2 , wherein the major axis of the second grain is:
a straight line connecting a middle point of a segment most distant from the surface of the body in contact with the extension and a middle point of a segment nearest to the surface of the body in contact with the extension, or
a straight line connecting the middle point of a segment most distant from the surface of the body in contact with the extension and a tip nearest to the surface of the body.
8 . The multilayer electronic component of claim 2 , wherein an average size of the second grain is twice or more of an average size of the first grain.
9 . The multilayer electronic component of claim 2 , wherein an average size of the first grain is 0.5 μm or less.
10 . The multilayer electronic component of claim 2 , wherein an average size of the second grain is 1 μm or greater.
11 . The multilayer electronic component of claim 2 , wherein
a region of the plating layer disposed on the electrode layer is an electrode cover portion, the electrode cover portion includes a third region adjacent to the electrode layer and a fourth region disposed on the third region, and
the third region includes a third grain, the fourth region includes a fourth grain, and an angle between a major axis of the fourth grain and the surface of the body in contact with the extension is θ4, the fourth grain satisfies: θ4 is less than 60 degrees or 130 degrees or greater.
12 . The multilayer electronic component of claim 11 , wherein the fourth region includes a region adjacent to the extension and the region includes the fourth grain that satisfies: θ4 is 60 degrees or less or 130 degrees or greater.
13 . The multilayer electronic component of claim 11 , wherein an average size of the fourth grain is twice or more of an average size of the third grain.
14 . The multilayer electronic component of claim 1 , wherein the plating layer includes one or more of Cu, Ni, Pd, Cr, and alloys thereof.
15 . The multilayer electronic component of claim 1 , wherein the external electrode further includes an additional plating layer disposed on the plating layer.
16 . The multilayer electronic component of claim 15 , wherein the plating layer is Ni plating, and the additional plating layer is Sn plating layer.
17 . A multilayer electronic component comprising:
a body including a dielectric layer and internal electrodes; and
external electrodes including an electrode layer disposed on the body and a plating layer disposed on the electrode layer,
wherein the plating layer includes an extension extending onto the body to contact the body, and
the extension includes a grain having a growth direction that is substantially perpendicular to a surface of the body in contact with the extension.
18 . The multilayer electronic component of claim 17 , wherein a region of the plating layer disposed on the electrode layer is an electrode cover portion, the electrode cover includes a grain having a growth direction that is substantially perpendicular to a surface of the electrode layer in contact with the electrode cover portion.
19 . A multilayer electronic component comprising:
a body including a dielectric layer and internal electrodes; and
external electrodes including an electrode layer disposed on the body and a plating layer disposed on the electrode layer,
wherein the plating layer includes an extension extending onto the body to contact the body, and
the extension includes one or more grains in which an angle between a surface of the body in contact with the extension and a major axis of the one or more grains is 80 degrees or greater and 100 degrees or less.
20 . The multilayer electronic component of claim 19 , wherein the plating layer includes Ni.
21 . The multilayer electronic component of claim 20 , wherein the external electrode further includes an additional plating layer disposed on the plating layer.
22 . The multilayer electronic component of claim 21 , wherein the additional plating layer include Sn.
23 . The multilayer electronic component of claim 19 , wherein the extension includes a first region adjacent to the body and a second region disposed on the first region,
the first region includes a first grain, the second region includes a second grain, and an angle between a major axis of the second grain and the surface of the body in contact with the extension is 70 degrees or greater and 110 degrees or less, and
an average size of the second grain is twice or more of an average size of the first grain.
24 . The multilayer electronic component of claim 23 , wherein the plating layer includes an electrode cover portion disposed on the electrode layer, the electrode cover portion includes a third region adjacent to the electrode layer and a fourth region disposed on the third region, and
the third region includes a third grain, the fourth region includes a fourth grain, and an angle between a major axis of the fourth grain and the surface of the body in contact with the extension is θ4, the fourth grain satisfies: θ4 is less than 60 degrees or 130 degrees or greater.
25 . The multilayer electronic component of claim 24 , wherein the fourth region includes a region adjacent to the extension and the region includes the fourth grain that satisfies: θ4 is 60 degrees or less or 130 degrees or greater.