Camera module
A camera module according to an embodiment includes a circuit board including a cavity; a reinforcing plate including a first region corresponding to the cavity and a second region in which the circuit board is disposed; a wire part disposed in the first region of the reinforcing plate; and an image sensor disposed on the wire part, wherein a lower surface of the image sensor is in direct contact with the wire part, and wherein the wire part and the image sensor are electrically separated from each other.
1 . A camera module comprising:
a reinforcing plate;
a circuit board disposed on the reinforcing plate and including a cavity;
a wire part disposed on the reinforcing plate within the cavity;
a first adhesive member disposed on the reinforcing plate within the cavity;
an image sensor disposed on the wire part and the first adhesive member and having a lower surface in direct contact with the wire part; and
a connection wire electrically connecting the circuit board and the image sensor,
wherein the image sensor is electrically connected to the circuit board through the connection wire in a state of being supported on the reinforcing plate by the wire part.
2 . The camera module of claim 1 , wherein an uppermost end of the wire part is positioned lower than an upper surface of the circuit board.
3 . The camera module of claim 1 , wherein the wire part includes a bump portion bonded on the reinforcing plate, and an extension portion extending from the bump portion.
4 . The camera module of claim 1 , wherein the image sensor is a sensor chip including a silicon die.
5 . The camera module of claim 4 , wherein an area of the first adhesive member is 50% or less of an area of the lower surface of the image sensor.
6 . The camera module of claim 3 , wherein the wire part includes a plurality of sub wire parts spaced apart from each other, and
wherein the first adhesive member is disposed in a space between the plurality of sub wire parts.
7 . The camera module of claim 6 , wherein the plurality of sub wire parts overlap a corner region of the lower surface of the image sensor in an optical axis direction.
8 . The camera module of claim 4 , wherein the reinforcing plate is made of metal.
9 . The camera module of claim 1 , wherein the wire part is spaced apart from an inner wall of the cavity of the circuit board.
10 . The camera module of claim 8 , wherein the metal of the reinforcing plate includes any one of SUS, aluminum, and copper.
11 . The camera module of claim 10 , wherein the first adhesive member includes any one of an epoxy, a thermosetting adhesive, an ultraviolet curable adhesive, and an adhesive film.
12 . The camera module of claim 3 , wherein the extension portion of the reinforcing plate includes:
a first extension portion extending from the bump portion in an optical axis direction;
a second extension portion extending from the first extension portion in a direction perpendicular to the optical axis direction and in direct contact with the lower surface of the image sensor; and
a third extension portion extending from the second extension portion to an upper surface of the reinforcing plate and bonded to an upper surface of the reinforcing plate.
13 . The camera module of claim 12 , wherein a width of the bump portion is in a range of 80 um to 100 um, and
wherein a height of the bump portion is in a range of 10 um to 30 um.
14 . The camera module of claim 12 , wherein a height from a lower surface of the bump portion to an uppermost end of the second extension portion is in a range of 30 um to 50 um.
15 . The camera module of claim 12 , wherein a length of the second extension portion is in a range of 10 um to 30 um.
16 . The camera module of claim 1 , comprising:
a second adhesive member disposed between the reinforcing plate and the circuit board; and
wherein the second adhesive member includes an opening corresponding to the cavity of the circuit board.
17 . The camera module of claim 1 , wherein a coefficient of thermal expansion of the first adhesive member is greater than a coefficient of thermal expansion of the reinforcing plate and a coefficient of thermal expansion of the image sensor, and
wherein the coefficient of thermal expansion of the image sensor is smaller than the coefficient of thermal expansion of the reinforcing plate.
18 . An optical device comprising:
a main body, a camera module disposed at the main body and configured to photograph an image of a subject, and a display unit disposed on the main body and configured to output the image photographed by the camera module,
wherein the camera module includes:
a circuit board including a cavity;
a reinforcing plate including a first region corresponding to the cavity and a second region in which the circuit board is disposed;
a wire part bonded on the first region of the reinforcing plate; and
an image sensor disposed on the wire part,
wherein a lower surface of the image sensor is in direct contact with the wire part,
wherein the wire part and the image sensor are electrically separated from each other,
wherein the wire part includes:
a bump portion bonded on the reinforcing plate;
a first extension portion extending from the bump portion in an optical axis direction;
a second extension portion extending from the first extension portion in a direction perpendicular to the optical axis direction and in direct contact with the lower surface of the image sensor; and
a third extension portion extending from the second extension portion to an upper surface of the reinforcing plate and bonded to the upper surface of the reinforcing plate.
19 . The optical device of claim 18 , wherein a width of the bump portion is in a range of 80 um to 100 um,
wherein a height of the bump portion is in a range of 10 um to 30 um,
wherein a height from a lower surface of the bump portion to an uppermost end of the second extension portion is in a range of 30 um to 50 um, and
wherein a length of the second extension portion is in a range of 10 um to 30 um.
20 . The optical device of claim 18 , wherein a pixel region of the image sensor includes:
an active pixel region; and
a dummy pixel region between the active pixel region and a passivation region; and
wherein the wire part is in contact with a lower surface of a corner region of the active pixel region.