Electronic substrate
According to one embodiment of the present invention, an electronic substrate includes a base including a first surface and a second surface that is a surface opposite to the first surface, an electronic component disposed on the second surface of the base, and a line disposed on the second surface of the base and connected to the electronic component, wherein the base includes a frame region including a flexible material and a plurality of opening regions passing between the first surface and the second surface, and the electronic component and the line are disposed in the frame region.
1 . An electronic substrate comprising:
a base including a first surface and a second surface that is a surface opposite to the first surface;
an electronic component disposed on the second surface of the base;
a line disposed on the second surface of the base and connected to the electronic component, and
a flexible substrate,
wherein
the base includes a frame region including a flexible material and a plurality of opening regions passing between the first surface and the second surface,
the electronic component and the line are disposed in the frame region,
the frame region includes an edge region disposed to surround the plurality of opening regions and an island region disposed between the plurality of opening regions,
the electronic component is disposed in the island region,
the line is disposed in the edge region, and
the flexible substrate is disposed between the island region and the electronic component.
2 . The electronic substrate of claim 1 , further comprising an adhesive layer disposed on the first surface.
3 . The electronic substrate of claim 1 , wherein the flexible material includes at least one among a silicone-based elastomer, a urethane-based elastomer, a styrene-based elastomer, and an olefin-based elastomer.
4 . The electronic substrate of claim 1 , wherein the electronic component includes at least one among a sensor, a capacitor, a resistor, an inductor, a transistor, an antenna, a diode, a battery, and a communication module.
5 . The electronic substrate of claim 1 , wherein a Young's modulus of the flexible substrate is greater than a Young's modulus of the island region.
6 . The electronic substrate of claim 1 , further comprising a circuit pattern disposed on the flexible substrate and connected to the electronic component.
7 . The electronic substrate of claim 1 , wherein the flexible substrate includes at least one among polyethylene terephthalate (PET), polyimide (PI), polyethersulfone (PES), and polyethylent naphthalate (PEN).
8 . The electronic substrate of claim 1 , wherein the flexible substrate includes polymer layers, metal layers disposed on some of the polymer layers, and a molding layer to mold the polymer layers and the metal layers.
9 . The electronic substrate of claim 8 , wherein the molding layer includes polydimethylsiloxane (PDMS) or polyurethane.
10 . The electronic substrate of claim 8 , wherein a Young's modulus of the polymer layer is greater than a Young's modulus of the molding layer.
11 . The electronic substrate of claim 8 , wherein the polymer layer includes a fiber mat or a mesh film.
12 . The electronic substrate of claim 8 , wherein a via is formed in the molding layer to electrically connect the metal layer and the electronic component.
13 . The electronic substrate of claim 1 , wherein the line includes a flexible electrode including a flexible material and a metal.
14 . The electronic substrate of claim 1 , wherein a width of one of the plurality of opening regions is greater than a width of the edge region and is less than a width of the island region.
15 . The electronic substrate of claim 14 , wherein a width of the edge region ranges from 10 μm to 1 mm.
16 . The electronic substrate of claim 1 , wherein a maximum width of one of the plurality of opening regions ranges from 100 μm to 10 mm.
17 . An electronic substrate comprising:
a base including a first surface and a second surface that is a surface opposite to the first surface;
an electronic component disposed on the second surface of the base; and
a line disposed on the second surface of the base and connected to the electronic component,
wherein
the base includes a frame region including a flexible material and a plurality of opening regions passing between the first surface and the second surface,
the electronic component and the line are disposed in the frame region, and
the line has a curved shape that is repeated in a predetermined pattern.
18 . An electronic substrate comprising:
a base including a first surface and a second surface that is a surface opposite to the first surface;
an electronic component disposed on the second surface of the base; and
a line disposed on the second surface of the base and connected to the electronic component,
wherein
the base includes a frame region including a flexible material and a plurality of opening regions passing between the first surface and the second surface,
the electronic component and the line are disposed in the frame region, and
the line includes a first pad, a second pad, and a connection part connecting the first pad and the second pad, and the connection part has a curved shape that is repeated in a predetermined pattern.