High efficiency thermal management devices for use with electronic components having high heat flux values
View Patent ↗High efficiency heat management devices for use with electronic components, are disclosed and include: at least one jet inlet channel, at least one non-uniform channel area or uniform channel area, at least two exit channels, at least one heat spreader conductive plate, wherein the at least one non-uniform channel area or uniform channel area is bounded by the at least one jet inlet channel, the at least two exit channels, and the at least one heat spreader conductive plate, and at least one porous component or at least one foam component, wherein the at least one porous component or at least one foam component at least partially fills the at least one non-uniform channel area or uniform channel area.
1 . A heat management device for use with an electronic component, comprising:
at least two jet inlet channels, wherein the at least two jet inlet channels comprise at least two inlet channel sizes,
at least one non-uniform channel area or uniform channel area,
at least two exit channels,
at least one heat spreader conductive plate, wherein the at least one non-uniform channel area or uniform channel area is bounded by the at least two jet inlet channels, the at least two exit channels, and the at least one heat spreader conductive plate, and
at least one porous component or at least one foam component, wherein the at least one porous component or at least one foam component at least partially fills the at least one non-uniform channel area or uniform channel area.
2 . The heat management device for use with an electronic component of claim 1 , wherein the at least one porous component or at least one foam component completely fills the at least one non-uniform channel area or uniform channel area.
3 . The heat management device for use with an electronic component of claim 1 , wherein the at least one porous component or at least one foam component comprises at least one metal.
4 . The heat management device for use with an electronic component of claim 1 , wherein the at least one foam component comprises a metal foam.
5 . The heat management device for use with an electronic component of claim 1 , further comprising at least one rib structure component that is coupled with the at least one heat spreader conductive plate and is located in the at least one non-uniform channel area or uniform channel area.
6 . The heat management device for use with an electronic component of claim 1 , wherein each of the at least two jet inlet channels comprises a shape, wherein the shape is square or rectangular.
7 . The heat management device for use with an electronic component of claim 1 , wherein each of the at least two jet inlet channels has a vertical enclosure having a top, a bottom, and at least one side.
8 . The heat management device for use with an electronic component of claim 7 , wherein each of the at least two jet inlet channels has a tapered directional component coupled with the bottom of the vertical enclosure.
9 . The heat management device for use with an electronic component of claim 1 , further comprising at least one electronic component having a heat flux value of at least 10 4 W/m 2 , wherein the component has a top surface.
10 . A heat management device for use with an electronic component, comprises:
at least two jet inlet channels, wherein the at least two jet inlet channels comprise at least two inlet channel sizes,
at least one non-uniform channel area or uniform channel area,
at least two exit channels,
at least one heat spreader conductive plate, wherein the at least one non-uniform channel area or uniform channel area is bounded by the at least two jet inlet channels, the at least two exit channels, and the at least one heat spreader conductive plate, and
at least one porous component or at least one foam component, wherein the at least one porous component or at least one foam component at least partially fills the at least one non-uniform channel area or uniform channel area,
at least one jet impingement of at least one thermal management liquid or gas, wherein the at least two jet inlet channels directs the at least one jet impingement of a liquid or a gas onto a surface of the at least one porous component or at least one foam component.
11 . The heat management device for use with an electronic component of claim 10 , wherein the at least one porous component or at least one foam component completely fills the at least one non-uniform channel area or uniform channel area.
12 . The heat management device for use with an electronic component of claim 11 , wherein the at least one non-uniform channel area or uniform channel area is coupled with, or connected to the top surface of the component.
13 . The heat management device for use with an electronic component of claim 10 , wherein the at least one porous component or at least one foam component comprises at least one metal.
14 . The heat management device for use with an electronic component of claim 10 , wherein the at least one foam component comprises a metal foam.
15 . The heat management device for use with an electronic component of claim 10 , further comprising at least one rib structure component that is coupled with the at least one heat spreader conductive plate and is located in the at least one non-uniform channel area or uniform channel area.
16 . The heat management device for use with an electronic component of claim 10 , wherein each of the at least two jet inlet channels comprises a shape, wherein the shape is square or rectangular.
17 . The heat management device for use with an electronic component of claim 10 , wherein each of the at least two jet inlet channels has a vertical enclosure having a top, a bottom, and at least one side.
18 . The heat management device for use with an electronic component of claim 17 , wherein each of the at least two jet inlet channels has a tapered directional component coupled with the bottom of the vertical enclosure.
19 . The heat management device for use with an electronic component of claim 10 , further comprising at least one electronic component having a heat flux value of at least 10 4 W/m 2 , wherein the component has a top surface.
20 . The heat management device for use with an electronic component of claim 19 , wherein the at least one non-uniform channel area or uniform channel area is coupled with, or connected to the top surface of the component.