Semiconductor device and semiconductor device manufacturing method
According to one embodiment, a semiconductor device includes: a circuit board; a first semiconductor chip mounted on a face of the circuit board; a resin film covering the first semiconductor chip; and a second semiconductor chip having a chip area larger than a chip area of the first semiconductor chip, the second semiconductor chip being stuck to an upper face of the resin film and mounted on the circuit board. The resin film entirely fits within an inner region of a bottom face of the second semiconductor chip when viewed in a stacking direction of the first and second semiconductor chips.
1 . A semiconductor device comprising:
a circuit board;
a first semiconductor chip mounted on a face of the circuit board;
a resin film covering the first semiconductor chip; and
a second semiconductor chip having a chip area larger than a chip area of the first semiconductor chip, the second semiconductor chip being stuck to an upper face of the resin film and mounted on the circuit board, wherein
the resin film entirely fits within an inner region of a bottom face of the second semiconductor chip when viewed in a stacking direction of the first and second semiconductor chips,
the resin film is in contact with the circuit board, and
when viewed from a first direction that intersects the stacking direction, the resin film has a first width at a first height at which the resin film is in contact with the second semiconductor chip, and a second width at a second height that is above the circuit board and lower than the first height, the second width being smaller than the first width.
2 . The semiconductor device according to claim 1 , wherein
the resin film has, on a side face of the resin film, a concave portion recessed from the first height toward the second height.
3 . The semiconductor device according to claim 2 , wherein
a recessed amount of the concave portion is maximum near a center of an edge of the second semiconductor chip.
4 . The semiconductor device according to claim 2 , wherein
the second semiconductor chip has
a first edge extending in the first direction, and
a second edge extending in a second direction intersecting the stacking direction and the first direction, the second edge being longer than the first edge, and
the resin film has
a first concave portion on a side face extending along the first edge, and
a second concave portion on the side face extending along the second edge, the second concave portion being more recessed than the first concave portion toward the inner region.
5 . The semiconductor device according to claim 1 , wherein
the resin film covers the entirety of the bottom face of the second semiconductor chip.
6 . The semiconductor device according to claim 1 , wherein
a volume of the resin film is smaller than a volume obtained by a formula [Td×An], where Td denotes a thickness of the resin film, and An denotes an area of the bottom face of the second semiconductor chip.
7 . The semiconductor device according to claim 6 , wherein
the volume of the resin film is within a predetermined range including a volume obtained by a formula [Td×An−Vc], where Vc denotes a volume of the first semiconductor chip.
8 . The semiconductor device according to claim 1 , wherein
a nonvolatile memory is mounted on the second semiconductor chip, and
a control circuit that controls operation of the nonvolatile memory is mounted on the first semiconductor chip.
9 . The semiconductor device according to claim 1 , further comprising
a bonding wire that electrically connects the second semiconductor chip and the circuit board to each other.
10 . A semiconductor device manufacturing method comprising:
mounting a first semiconductor chip on a face of a circuit board;
sticking, to a dicing tape, a plurality of second semiconductor chips singulated in such a manner that each of the second semiconductor chips has a chip area larger than a chip area of the first semiconductor chip, each of the second semiconductor chips having a semiconductor element, at a predetermined spacing with a face having the semiconductor element facing down;
sticking a resin film having adhesiveness on a face of each of the second semiconductor chips stuck to the dicing tape, the face of each of the second semiconductor chips being opposite to the face having the semiconductor element;
forming a first cut having a first width larger than the predetermined spacing and a first depth on the resin film at a position corresponding to each boundary portion between the second semiconductor chips;
forming a second cut having a width substantially equal to the predetermined spacing on the resin film remaining on a bottom of the first cut at a position overlapping the boundary portion between the second semiconductor chips when viewed in a stacking direction of the second semiconductor chip and the resin film to cut the resin film in a thickness direction;
sticking the resin film having the first and second cuts to another dicing tape different from the dicing tape and transferring the second semiconductor chip onto the other dicing tape from the dicing tape; and
sticking the resin film having the first and second cuts to the first semiconductor chip on the circuit board and transferring the second semiconductor chip onto the circuit board having the second semiconductor chip from the other dicing tape so as to mount the second semiconductor chip on the circuit board at a position overlapping the first semiconductor chip when viewed in a stacking direction of the first and second semiconductor chips, wherein
in mounting the second semiconductor chip on the circuit board, the second semiconductor chip transferred onto the other dicing tape is picked up by a picker and mounted on the circuit board.
11 . The semiconductor device manufacturing method according to claim 10 , further comprising:
forming a recessed portion having a second depth on the resin film stuck to the second semiconductor chip at a position overlapping the second semiconductor chip when viewed in the stacking direction of the second semiconductor chip and the resin film, wherein
in mounting the second semiconductor chip on the circuit board,
the resin film is stuck to the first semiconductor chip on the circuit board in such a manner that the first semiconductor chip on the face of the circuit board and the recessed portion of the resin film overlap when viewed in the stacking direction of the first and second semiconductor chips.
12 . The semiconductor device manufacturing method according to claim 11 , wherein
the recessed portion has an area larger than the chip area of the first semiconductor chip when viewed in the stacking direction of the first and second semiconductor chips.
13 . The semiconductor device manufacturing method according to claim 12 , wherein
the recessed portion has a depth shallower than a thickness of the first semiconductor chip.
14 . The semiconductor device manufacturing method according to claim 11 , wherein
the recessed portion has a capacity equal to a volume of the first semiconductor chip within a predetermined error range.
15 . The semiconductor device manufacturing method according to claim 14 , wherein
the error range includes a processing tolerance of the recessed portion.
16 . The semiconductor device manufacturing method according to claim 10 , wherein
the second semiconductor chip has
a first edge extending in a first direction intersecting the stacking direction, and
a second edge extending in a second direction intersecting the stacking direction and the first direction, the second edge being longer than the first edge, and
in forming the first cut,
a third cut having a second width larger than the predetermined spacing and the first depth is formed on the resin film at a position corresponding to a boundary portion where the plurality of second semiconductor chips are adjacent to each other at the first edges, and
a fourth cut having a third width larger than the second width and the first depth is formed on the resin film at a position corresponding to a boundary portion where the plurality of second semiconductor chips are adjacent to each other at the second edges.
17 . The semiconductor device manufacturing method according to claim 10 , wherein,
in mounting the second semiconductor chip on the circuit board,
the resin film is heat-cured so as to cover the first semiconductor chip with the resin film.
18 . The semiconductor device manufacturing method according to claim 10 , wherein
a dicing saw is used to form the first cut, and
laser light is used to form the second cut.
19 . The semiconductor device manufacturing method according to claim 10 , wherein
in mounting the second semiconductor chip on the circuit board,
the second semiconductor chip and the circuit board are connected to each other through a bonding wire.
20 . A semiconductor device comprising:
a circuit board;
a first semiconductor chip mounted on a face of the circuit board;
a resin film covering the first semiconductor chip; and
a second semiconductor chip having a chip area larger than a chip area of the first semiconductor chip, the second semiconductor chip being stuck to an upper face of the resin film and mounted on the circuit board, wherein
the resin film entirely fits within an inner region of a bottom face of the second semiconductor chip when viewed in a stacking direction of the first and second semiconductor chips,
the second semiconductor chip has
a first edge extending in a first direction intersecting the stacking direction, and
a second edge extending in a second direction intersecting the stacking direction and the first direction, the second edge being longer than the first edge, and
the resin film has
a first concave portion, on a side face extending along the first edge, recessed toward the inner region when viewed in the first direction, and
a second concave portion, on the side face extending along the second edge, recessed toward the inner region when viewed in the first direction, the second concave portion being more recessed than the first concave portion toward the inner region.