IP Library › Granted Patent US 12,546,938
Granted Patent B2
US 12,546,938 · App. 18/196,796 · Granted Feb 10, 2026

Photodetectors integrated with a segmented coupling-assistance feature

Inventor: Yusheng Bian (Ballston Lake, NY)
Assignee: GlobalFoundries U.S. Inc.
G02B6/1228G02B6/13
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Quick Facts
Patent No.
US 12,546,938
App. No.
18/196,796
Granted
Feb 10, 2026
Kind
B2
Abstract

Structures including a photodetector and methods of forming a structure including a photodetector. The structure comprises a photodetector including a pad and a semiconductor layer on the pad, a first waveguide core including a tapered section adjacent to a sidewall of the semiconductor layer, and a second waveguide core including a curved section adjacent to the sidewall of the semiconductor layer. The curved section includes a plurality of segments, and the tapered section of the first waveguide core is overlapped by at least one of the plurality of segments in the curved section of the second waveguide core.

Claims (41)

1 . A structure comprising:

a photodetector including a pad and a semiconductor layer positioned on the pad, the semiconductor layer having a first sidewall, and the pad including a first side edge;

a first waveguide core including a tapered section adjacent to the first sidewall of the semiconductor layer, the tapered section terminating at the first side edge of the pad; and

a second waveguide core including a curved section and a non-curved section adjacent to the first sidewall of the semiconductor layer and the first side edge of the pad, the curved section including a first plurality of segments and the non-curved section including a second plurality of segments positioned between the first plurality of segments and the first side edge of the pad,

wherein the tapered section of the first waveguide core is overlapped by at least one of the first plurality of segments in the curved section of the second waveguide core, and the tapered section of the first waveguide core is overlapped by the second plurality of segments in the non-curved section of the second waveguide core.

2 . The structure of claim 1 wherein the curved section is terminated by one of the first plurality of segments.

3 . The structure of claim 1 wherein the tapered section has a first width dimension that increases with decreasing distance from the first sidewall of the semiconductor layer.

4 . The structure of claim 1 wherein at least one of the first plurality of segments in the curved section of the second waveguide core has a non-overlapping relationship with the tapered section of the first waveguide core.

5 . The structure of claim 1 wherein the first waveguide core and the pad comprise single-crystal silicon, the second waveguide core comprises polysilicon or silicon nitride, and the semiconductor layer comprises germanium.

6 . The structure of claim 1 wherein the first waveguide core and the pad comprise a first material, and the second waveguide core comprises a second material different than the first material.

7 . The structure of claim 1 wherein the tapered section of the first waveguide core has a longitudinal axis, and the curved section of the second waveguide core curves laterally away from the longitudinal axis.

8 . The structure of claim 1 wherein the tapered section of the first waveguide core has a first sidewall, and the curved section of the second waveguide core extends across the first sidewall of the tapered section of the first waveguide core.

9 . The structure of claim 8 wherein at least one of the first plurality of segments in the curved section of the second waveguide core has a non-overlapping relationship with the tapered section of the first waveguide core.

10 . The structure of claim 1 further comprising:

a third waveguide core including a curved section adjacent to the semiconductor layer and the first sidewall of the semiconductor layer, the third waveguide core including a plurality of segments adjacent to the curved section of the second waveguide core,

wherein the tapered section of the first waveguide core is overlapped by at least one of the plurality of segments in the curved section of the third waveguide core.

11 . The structure of claim 1 wherein the semiconductor layer has a second sidewall opposite from the first sidewall, and further comprising:

a third waveguide core including a tapered section positioned adjacent to the second sidewall of the semiconductor layer; and

a fourth waveguide core including a curved section adjacent to the second sidewall of the semiconductor layer, the curved section including a plurality of segments,

wherein the tapered section of the third waveguide core is overlapped by at least one of the plurality of segments in the curved section of the fourth waveguide core.

12 . The structure of claim 11 wherein the semiconductor layer is positioned between the tapered section of the first waveguide core and the tapered section of the third waveguide core.

13 . The structure of claim 1 wherein the semiconductor layer includes a first tapered section and a second tapered section that adjoins the first tapered section.

14 . The structure of claim 13 wherein the first tapered section of the semiconductor layer has a first width dimension that decreases with decreasing distance from the second tapered section of the semiconductor layer, and the second tapered section of the semiconductor layer has a second width dimension that decreases with decreasing distance from the first tapered section of the semiconductor layer.

15 . The structure of claim 1 wherein the semiconductor layer is positioned on a portion of the pad comprising an intrinsic semiconductor material, and further comprising:

a first doped region in the pad, the first doped region having a first conductivity type; and

a second doped region in the pad, the second doped region having a second conductivity type opposite to the first conductivity type,

wherein the portion of the pad is positioned in a lateral direction between the first doped region and the second doped region.

16 . A structure comprising:

a first waveguide core;

a second waveguide core adjacent to the first waveguide core; and

a ring resonator including a plurality of segments, at least one of the plurality of segments overlapped with a portion of the first waveguide core, and at least one of the plurality of segments overlapped with a portion of the second waveguide core.

17 . A method comprising:

forming a photodetector including a pad and a semiconductor layer on the pad, wherein the semiconductor layer includes a sidewall, and the pad includes a side edge;

forming a first waveguide core including a tapered section adjacent to the sidewall of the semiconductor layer, wherein the tapered section terminates at the side edge of the pad; and

forming a second waveguide core including a curved section and a non-curved section adjacent to the sidewall of the semiconductor layer and the side edge of the pad,

wherein the curved section includes a first plurality of segments and the non-curved section including a second plurality of segments positioned between the first plurality of segments and the side edge of the pad, the tapered section of the first waveguide core is overlapped by at least one of the first plurality of segments in the curved section of the second waveguide core, and the tapered section of the first waveguide core is overlapped by the second plurality of segments in the non-curved section of the second waveguide core.

18 . The structure of claim 1 further comprising:

a semiconductor substrate; and

a dielectric layer between the tapered section of the first waveguide core and the semiconductor substrate.

19 . The structure of claim 18 wherein the tapered section of the first waveguide core is positioned in elevation between the first plurality of segments of the first waveguide core and the semiconductor substrate.

20 . The structure of claim 8 wherein the tapered section of the first waveguide core has a second sidewall, and the first sidewall and the second sidewall intersect the first side edge of the pad.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 12, 2023
From: BIAN, YUSHENG
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 063628/0895 →
Continuity (1)
Related Publication 20240377583A1 · Nov 14, 2024
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