IP Library › Granted Patent US 12,547,070
Granted Patent B2
US 12,547,070 · App. 18/734,037 · Granted Feb 10, 2026

Imprint apparatus, imprint method, and article manufacturing method

Inventor: Toshiaki Ando (Tokyo, JP)
Assignee: CANON KABUSHIKI KAISHA
G03F7/0002
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Quick Facts
Patent No.
US 12,547,070
App. No.
18/734,037
Granted
Feb 10, 2026
Kind
B2
Abstract

An imprint apparatus in which contamination in an apparatus due to an uncured material or the like can be minimized is provided. The imprint apparatus includes: a first irradiation unit configured to irradiate an imprint material on a substrate with light for performing curing in a state in which the imprint material is brought into contact with a pattern portion having a concave and convex pattern formed in a mold; and a second irradiation unit configured to irradiate a peripheral region of the pattern portion of the mold after the irradiation of the light using the first irradiation unit.

Claims (14)

1 . An imprint method, comprising:

a first irradiation step of irradiating, using a first irradiation unit, an imprint material on a substrate with light for performing curing in a state in which the imprint material is brought into contact with a pattern portion having a concave and convex pattern and being formed in a first surface of a mold that faces the imprint material in the state in which the imprint material is brought into contact with the pattern portion; and

a second irradiation step of irradiating a peripheral region of the pattern portion of the mold with light after the irradiation of the light using the first irradiation unit, the peripheral region of the pattern portion of the mold being formed in a second surface of the mold different from the first surface of the mold that faces the imprint material in the state in which the imprint material is brought into contact with the pattern portion.

2 . The imprint method according to claim 1 , wherein, in the second irradiation step, a second irradiation unit included in a holder configured to hold the mold irradiates the peripheral region of the pattern portion of the mold formed in the second surface with the light.

3 . The imprint method according to claim 1 , wherein, in the second irradiation step, a second irradiation unit included in a substrate moving portion configured to hold and move the substrate irradiates the peripheral region of the pattern portion of the mold formed in the second surface with the light.

4 . The imprint method according to claim 3 , wherein, in the second irradiation step, irradiation of the peripheral region of the pattern portion of the mold formed in the second surface is performed while the substrate moving portion is moving.

5 . The imprint method according to claim 1 , wherein irradiation of the light in the first irradiation step and irradiation of the light in the second irradiation step are performed in conjunction with each other.

6 . The imprint method according to claim 1 , wherein, in the first irradiation step, a limitation is provided so that the peripheral region of the pattern portion of the mold formed in the second surface is not irradiated with the light.

7 . The imprint method according to claim 1 , wherein, in the second irradiation step, the peripheral region of the pattern portion of the mold formed in the second surface is irradiated with reflected light.

8 . The imprint method according to claim 1 , wherein, in the second irradiation step, a region that was irradiated with the light in the first irradiation step is not irradiated.

9 . An article manufacturing method performed, at least in part, using an imprint apparatus which includes: a first irradiation unit configured to irradiate an imprint material on a substrate with light for performing curing in a state in which the imprint material is brought into contact with a pattern portion having a concave and convex pattern and being formed in a first surface of a mold that faces the imprint material in the state in which the imprint material is brought into contact with the pattern portion; and a second irradiation unit configured to irradiate a peripheral region of the pattern portion of the mold with light after the irradiation of the light using the first irradiation unit is utilized, the peripheral region of the pattern portion of the mold being formed in a second surface of the mold different from the first surface of the mold that faces the imprint material in the state in which the imprint material is brought into contact with the pattern portion, the method comprising:

a pattern forming step of forming a pattern on the substrate;

a processing step of processing the substrate after forming the pattern in the pattern forming step; and

a step of manufacturing an article from the substrate processed in the processing step.

Priority Claims (1)
JP 2020-068331 · Apr 6, 2020 · national
Continuity (2)
Division 17201025 · Mar 15, 2021
Related Publication 20240319589A1 · Sep 26, 2024
References Cited (29)
US 20060272535A1 · Seki · 2006 [cited by examiner]
US 20080099941A1 · Suehira et al. · 2008 [cited by applicant]
US 20100085555A1 · Schmid et al. · 2010 [cited by applicant]
US 20130078820A1 · Mikami · 2013 [cited by applicant]
US 20130078821A1 · Furutono · 2013 [cited by applicant]
US 20170075229A1 · Yamada · 2017 [cited by applicant]
US 20180243970A1 · Kokubo · 2018 [cited by applicant]
US 20180275510A1 · Kawamura · 2018 [cited by applicant]
US 20190079391A1 · Fukuhara et al. · 2019 [cited by applicant]
US 20200026183A1 · Fletcher · 2020 [cited by applicant]
US 20210005446A1 · Fletcher et al. · 2021 [cited by applicant]
US 20210397083A1 · Ter Meulen et al. · 2021 [cited by applicant]
JP 2005078723A · 2005 [cited by applicant]
JP 2011240662A · 2011 [cited by applicant]
JP 2015035509A · 2015 [cited by applicant]
JP 2016131257A · 2016 [cited by applicant]
JP 2018163946A · 2018 [cited by applicant]
JP 2019036572A · 2019 [cited by examiner]
JP 2019075551A · 2019 [cited by applicant]
KR 1020190013525A · 2019 [cited by applicant]
KR 1020190031862A · 2019 [cited by applicant]
KR 1020190069306A · 2019 [cited by applicant]
English translation of JP2019036572 (Year: 2019). [cited by examiner]
Office Action issued in U.S. Appl. No. 17/201,025, mailed on Oct. 28, 2022. [cited by applicant]
Office Action issued in U.S. Appl. No. 17/201,025, mailed on Apr. 11, 2023. [cited by applicant]
Office Action issued in U.S. Appl. No. 17/201,025, mailed on Oct. 4, 2023. [cited by applicant]
Notice of Allowance issued in U.S. Appl. No. 17/201,025, mailed on Mar. 20, 2024. [cited by applicant]
Office Action issued in Korean Patent Application No. 10-2021-0039293 mailed Aug. 9, 2024. English translation provided. [cited by applicant]
Office Action issued in Korean Appln. No. 10-2021-0039293 mailed May 23, 2025. [cited by applicant]