Resonator device
A resonator device includes: a resonator element; a heat generating unit; a first package including a first base at which the resonator element and the heat generating unit are disposed, and a first lid bonded to the first base so as to accommodate the resonator element between the first lid and the first base; and a low emissivity layer that is disposed at an inner surface of the first lid and that has an emissivity lower than an emissivity of the first lid. In addition, a constituent material of the first lid is silicon, and the emissivity of the low emissivity layer at room temperature is less than 0.5.
1 . A resonator device comprising:
a resonator element;
a heat generating unit;
a first package including a first base at which the resonator element and the heat generating unit are disposed, and a first lid bonded to the first base so as to accommodate the resonator element between the first lid and the first base; and
a low emissivity layer that is disposed at an inner surface of the first lid and that has an emissivity lower than an emissivity of the first lid.
2 . The resonator device according to claim 1 , wherein
a constituent material of the first lid is silicon, and
the emissivity of the low emissivity layer at room temperature is less than 0.5.
3 . The resonator device according to claim 2 , wherein
a constituent material of the low emissivity layer contains at least one of copper, titanium, tungsten, aluminum, aluminum oxide, gold, chromium, nickel, nickel oxide, platinum, silver, and cobalt.
4 . The resonator device according to claim 1 , wherein
a constituent material of the first lid is Kovar, and
the emissivity of the low emissivity layer at room temperature is less than 0.05.
5 . The resonator device according to claim 4 , wherein
a constituent material of the low emissivity layer contains at least one of copper, tungsten, aluminum, and gold.
6 . The resonator device according to claim 1 , further comprising:
a bonding layer configured to bond the first lid and the first base, wherein
the low emissivity layer is made of same material as the bonding layer.
7 . The resonator device according to claim 1 , wherein
the low emissivity layer is also disposed at an outer surface of the first lid.
8 . The resonator device according to claim 1 , further comprising
a second package including a second base at which the first package is disposed and a second lid bonded to the second base so as to accommodate the first package between the second lid and the second base.
9 . A resonator device comprising:
a resonator element;
a heat generating unit;
a first package including a first base at which the resonator element is disposed, and a first lid bonded to the first base so as to accommodate the resonator element between the first lid and the first base;
a second package including a second base at which the first package is disposed, and a second lid bonded to the second base so as to accommodate the first package and the heat generating unit between the second lid and the second base; and
a first low emissivity layer that is disposed at an inner surface of the second lid and that has an emissivity lower than an emissivity of the second lid.
10 . The resonator device according to claim 9 , wherein
a constituent material of the second lid is Kovar, and
the emissivity of the first low emissivity layer at room temperature is less than 0.05.
11 . The resonator device according to claim 10 , wherein
a constituent material of the first low emissivity layer contains at least one of copper, tungsten, aluminum, and gold.
12 . The resonator device according to claim 9 , further comprising
a second low emissivity layer that is disposed at an inner surface of the first lid and that has an emissivity lower than an emissivity of the first lid.
13 . The resonator device according to claim 12 , wherein
a constituent material of the first lid is silicon, and
the emissivity of the second low emissivity layer at room temperature is less than 0.5.
14 . The resonator device according to claim 13 , wherein
a constituent material of the second low emissivity layer contains at least one of copper, titanium, tungsten, aluminum, aluminum oxide, gold, chromium, nickel, nickel oxide, platinum, silver, and cobalt.
15 . The resonator device according to claim 9 , wherein
the heat generating unit is disposed at the first base.
16 . The resonator device according to claim 9 , wherein
the heat generating unit is disposed at the second base, and
the first package is disposed at the heat generating unit.