IP Library › Granted Patent US 12,556,627
Granted Patent B2
US 12,556,627 · App. 18/204,695 · Granted Feb 17, 2026

Electronic device including housing having dissimilar metals

Inventors: Sungduck Park (Suwon-si, KR); Kwondeuk Yoon (Suwon-si, KR); Kitae Park (Suwon-si, KR); Yunho Son (Suwon-si, KR); Jaehoon Yoon (Suwon-si, KR); Cheolwoong Yoon (Suwon-si, KR); Youngsoo Kim (Suwon-si, KR); Kidoc Son (Suwon-si, KR); Hyunsuk Choi (Suwon-si, KR); Yongduk Kwon (Suwon-si, KR); Jongbo Kim (Suwon-si, KR)
Assignee: SAMSUNG ELECTRONICS CO., LTD.
H04M1/026H04M1/236H04W88/02H05K7/04
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,556,627
App. No.
18/204,695
Granted
Feb 17, 2026
Kind
B2
Abstract

An electronic device includes: a side bezel structure including a first body surrounding an inner space of the device, and a second body extending from the first body into the inner space and including a through hole; a plate including a support portion within the inner space; a protrusion portion extending from the support portion into the through hole, the protrusion portion being coupling to the second body and corresponding to the through hole; and a conductive adhesive member coupling the through hole and the protrusion portion, which is disposed between the through hole and the protrusion portion. An area of the protrusion portion contacting one surface of the second body toward the support portion is narrower than an area of the protrusion portion contacting another surface of the second body.

Claims (55)

1 . An electronic device comprising:

a side bezel structure comprising:

a first body surrounding at least a portion of an inner space of the electronic device, and

a second body extending from the first body into the inner space and including a through hole;

a plate comprising a support portion within the inner space;

a protrusion portion extending from the support portion into the through hole, the protrusion portion being coupling to the second body and corresponding to the shape of the through hole; and

a conductive adhesive member coupling the through hole and the protrusion portion, the conductive adhesive member being disposed between the through hole and the protrusion portion,

wherein a cross-sectional area of the protrusion portion contacting one surface of the second body toward the support portion is narrower than a cross-sectional area of the protrusion portion contacting another surface of the second body, and

wherein the another surface of the second body is opposite to the one surface of the second body.

2 . The electronic device of claim 1 , wherein the second body extends in a first direction parallel to the support portion, and

wherein the through hole extends in a second direction perpendicular to the first direction.

3 . The electronic device of claim 1 , wherein an intersection angle (A) between a generatrix (X) of the protrusion portion and the support portion is equal to or between 81 degrees to 87 degrees.

4 . The electronic device of claim 1 , wherein the side bezel structure comprises a first metal, and

wherein the plate includes a second metal different from the first metal.

5 . The electronic device of claim 4 , wherein a hardness of the first metal is higher than a hardness of the second metal.

6 . The electronic device of claim 1 , wherein an inner circumferential surface of the through hole is uneven and is in contact with the protruding portion.

7 . The electronic device of claim 1 , wherein a periphery of the support portion overlaps a periphery of the second body when viewing the support portion from above,

wherein the protrusion portion is disposed in an area comprising the periphery of the support portion, and

wherein the conductive adhesive member fills a gap between the protrusion portion and the through hole.

8 . The electronic device of claim 1 , wherein the through hole comprising:

a first region in contact with the support portion, and

a second region extending from the first region in a direction in which the protrusion portion extends from the support portion, and

wherein a cross-sectional area of the first region is different from a cross-sectional area of the second region.

9 . The electronic device of claim 8 , wherein a first intersection angle (A 1 ) between a first generatrix (X 1 ) of the protrusion portion disposed in the first region and the support portion is greater than a second intersection angle (A 2 ) between a second generatrix (X 2 ) of the protrusion portion disposed in the second region and the support portion.

10 . The electronic device of claim 9 , wherein the first intersection angle (A 1 ) is equal to or between 81 degrees to 87 degrees, and the second intersection angle (A 2 ) is equal to or between 60 degrees to 80 degrees.

11 . The electronic device of claim 1 , wherein the conductive adhesive member is disposed between the through hole and the protrusion portion, and

wherein the conductive adhesive member is disposed between the plate and the second body.

12 . The electronic device of claim 1 , wherein the protrusion portion comprises a head disposed on the another surface of the second body, and

wherein the head covers the through hole formed in the another surface.

13 . The electronic device of claim 12 , wherein the conductive adhesive member is disposed between the through hole and the protrusion portion, and

wherein the conductive adhesive member is disposed between the head and the second body.

14 . The electronic device of claim 1 , wherein the side bezel structure comprising a conductive portion and a non-conductive portion in contact with the conductive portion, and

wherein the electronic device further comprises a wireless communication circuit configured to communicate with an external electronic device through the conductive portion.

15 . The electronic device of claim 14 , wherein the wireless communication circuit is configured to transmit or receive a wireless communication signal in a designated band by feeding to a feed point of the conductive portion.

16 . An electronic device comprising:

a side bezel structure comprising:

a first body surrounding at least a portion of an inner space of the electronic device,

a second body extending from the first body into the inner space and the second body comprising a through hole,

a conductive portion comprising a first metal having a first hardness, and

a non-conductive portion in contact with the conductive portion;

a plate comprising:

a support portion within the inner space, and

a protrusion portion extending from the support portion into the through hole, the protrusion portion being coupling to the second body and being corresponding to a shape of the through hole, and

a second metal having a second hardness lower than the first hardness;

a conductive adhesive member electrically connecting the through hole and the protrusion portion, conductive adhesive member being disposed between the through hole and the protrusion portion; and

a wireless communication circuit operatively coupling with the conductive portion,

wherein a cross-sectional area of the protrusion portion is narrower than a cross-sectional area of the protrusion portion contacting another surface of the second body,

wherein the cross-sectional area of the protrusion portion contacts one surface of the second body toward the support portion, and

wherein the another surface of the second body is opposite to the one surface of the second body.

17 . The electronic device of claim 16 , wherein the second body extends in a first direction parallel to the support portion, and

wherein the through hole extends in a second direction perpendicular to the first direction.

18 . The electronic device of claim 16 , wherein an intersection angle (A) between a generatrix (X) of the protrusion portion and the support portion is equal to or between 81 degrees to 87 degrees.

19 . The electronic device of claim 16 , wherein an inner circumferential surface of the through hole is uneven and is in contact with the protruding portion.

20 . The electronic device of claim 16 , wherein the conductive adhesive member is disposed between the through hole and the protrusion portion, and

the conductive adhesive member is disposed between the plate and the second body.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 1, 2023
From: PARK, SUNGDUCK; YOON, KWONDEUK; PARK, KITAE; SON, YUNHO; YOON, JAEHOON; YOON, CHEOLWOONG; KIM, YOUNGSOO; SON, KIDOC; CHOI, HYUNSUK; KWON, YONGDUK; KIM, JONGBO
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 063831/0693 →
Priority Claims (2)
KR 10-2022-0085987 · Jul 12, 2022 · national
KR 10-2022-0107114 · Aug 25, 2022 · national
Continuity (2)
Continuation PCTKR2023004660 · Apr 6, 2023
Related Publication 20240022655A1 · Jan 18, 2024
References Cited (31)
US 10040120B2 · Wang et al. · 2018 [cited by applicant]
US 10321590B2 · Cater et al. · 2019 [cited by applicant]
US 10652372B2 · Wang et al. · 2020 [cited by applicant]
US 10665926B2 · Kim et al. · 2020 [cited by applicant]
US 11013109B2 · Han · 2021 [cited by examiner]
US 11070655B2 · Hill et al. · 2021 [cited by applicant]
US 11089142B2 · Ren et al. · 2021 [cited by applicant]
US 11457528B2 · Koo et al. · 2022 [cited by applicant]
US 20090059485A1 · Lynch · 2009 [cited by examiner]
US 20120071207A1 · Yoo · 2012 [cited by examiner]
US 20140262847A1 · Yang · 2014 [cited by examiner]
US 20150220115A1 · Gao et al. · 2015 [cited by applicant]
US 20160165027A1 · Hahn · 2016 [cited by examiner]
US 20160254832A1 · Yoo · 2016 [cited by examiner]
US 20180310426A1 · Cho · 2018 [cited by examiner]
US 20200136243A1 · Shin · 2020 [cited by examiner]
US 20200153950A1 · Hill et al. · 2020 [cited by applicant]
US 20200260605A1 · Lee et al. · 2020 [cited by applicant]
US 20200379512A1 · Cho · 2020 [cited by examiner]
US 20200384585A1 · Ren et al. · 2020 [cited by applicant]
US 20210037125A1 · Jung · 2021 [cited by examiner]
CN 103974577A · 2014 [cited by applicant]
CN 107087363A · 2017 [cited by applicant]
CN 108476248B · 2021 [cited by applicant]
CN 110582388B · 2023 [cited by applicant]
JP 6220900B2 · 2017 [cited by applicant]
KR 1020170037464A · 2017 [cited by applicant]
KR 1020190037739A · 2019 [cited by applicant]
KR 1020200139977A · 2020 [cited by applicant]
International Search Report (PCT/ISA/210) issued Jul. 12, 2023 by the International Searching Authority in International Patent Application No. PCT/KR2023/004660. [cited by applicant]
Written Opinion (PCT/ISA/237) issued Jul. 12, 2023 by the International Searching Authority in International Patent Application No. PCT/KR2023/004660. [cited by applicant]