Buried signal wires for memory applications
Various implementations described herein refer to a device having a memory structure with a substrate. The device may have a signal wire buried or partially buried within at least one of the substrate and a dielectric for transmitting electrical signals. The device may be manufactured as a memory device having a memory cell structure with the signal wire buried or partially buried in the substrate.
1 . A device comprising:
a memory structure having a substrate; and
a signal wire buried or partially buried within at least one of the substrate at a depth below a bottom of a transistor fin, or within a backside dielectric of the substrate, for transmitting electrical signals.
2 . The device of claim 1 , wherein the electrical signals refer to critical signals that are transmitted for memory related applications.
3 . The device of claim 1 , wherein:
the memory structure includes a transistor disposed on the substrate, and
the electrical signals refer to critical signals transmitted to the transistor for memory related applications.
4 . The device of claim 1 , wherein:
the memory structure includes a transistor disposed on the substrate, and
the signal wire is coupled to the transistor with a buried via or a through-silicon via.
5 . The device of claim 1 , wherein the signal wire refers to a wordline, a bitline or a clock signal line.
6 . The device of claim 1 , wherein:
the memory structure includes a transistor disposed on the substrate, and
the signal wire refers to multiple signals wires.
7 . The device of claim 6 , wherein:
the multiple signals wires include a buried wordline coupled to a gate of the transistor with a first buried via.
8 . The device of claim 6 , wherein:
the multiple signals wires include a buried bitline coupled to a drain of the transistor with a second buried via.
9 . The device of claim 7 , wherein the buried wordline refers to a buried global wordline that is coupled to a local wordline through the first buried via and at least one of the gate of the transistor, a drain of the transistor, or a direct metal connection.
10 . The device of claim 1 , wherein the memory structure refers to SRAM, DRAM, eDRAM, MRAM, ReRAM, PCM, CeRAM, FLASH, NVRAM or ROM.
11 . A device comprising:
a memory cell structure disposed on a substrate; and
multiple signal wires buried or partially buried within a least one of the substrate at a depth below a bottom of a transistor fin, or within a backside dielectric of the substrate, for transmitting critical signals to the memory cell structure.
12 . The device of claim 11 , wherein the critical signals refer to data signals or clock signals that are transmitted to the memory cell structure for memory related applications.
13 . The device of claim 11 , wherein the multiple signal wires include at least one wordline and at least one bitline.
14 . The device of claim 13 , wherein:
the critical signals refer to one or more wordline signals that are transmitted on the at least one wordline to the memory cell structure, and
the critical signals refer to one or more bitline signals that are transmitted on the at least one bitline to the memory cell structure.
15 . The device of claim 11 , wherein:
the multiple signal wires include at least one clock signal line that is buried in the substrate.
16 . The device of claim 11 , wherein:
the multiple signal wires include at least one critical signal line for transmitting critical signals to the memory cell structure,
the multiple signal wires include at least one power signal line for transmitting power signals to the memory cell structure, and
the at least one critical signal line is separate from the at least one power signal line.
17 . The device of claim 11 , wherein the memory cell structure refers to an SRAM bitcell, a DRAM bitcell, an eDRAM bitcell, an MRAM bitcell, a ReRAM bitcell, a PCM bitcell, a CeRAM bitcell, a FLASH bitcell, an NVRAM bitcell or a ROM bitcell.
18 . A method comprising:
providing a memory cell structure disposed on a substrate;
burying or partially burying, within at least one of the substrate at a depth below a bottom of a transistor fin, or within a backside dielectric of the substrate, a signal wire for transmitting electrical signals to the memory cell structure; and
manufacturing, or causing to be manufactured, a memory device having the memory cell structure with the signal wire buried or partially buried in the substrate.
19 . The method of claim 18 , wherein:
the memory cell structure includes a transistor disposed on the substrate, and
the electrical signals refer to critical signals that are transmitted to the transistor by way of the buried signal wire for memory related applications.
20 . The method of claim 18 , wherein the memory cell structure refers to an SRAM bitcell, a DRAM bitcell, an eDRAM bitcell, an MRAM bitcell, a ReRAM bitcell, a PCM bitcell, a CeRAM bitcell, a FLASH bitcell, an NVRAM bitcell or a ROM bitcell.