Fabrication of gate-all-around integrated circuit structures having common metal gates and having gate dielectrics with differentiated dipole layers
Gate-all-around integrated circuit structures having common metal gates and having gate dielectrics with differentiated dipole layers are described. For example, an integrated circuit structure includes a first vertical arrangement of horizontal nanowires, and a second vertical arrangement of horizontal nanowires. A P-type gate stack is over the first vertical arrangement of horizontal nanowires, the P-type gate stack having a mid-gap to P-type conductive layer over a first gate dielectric including a high-k dielectric layer and a first dipole material layer. An N-type gate stack is over the second vertical arrangement of horizontal nanowires, the N-type gate stack having the mid-gap to P-type conductive layer over a second gate dielectric including the high-k dielectric layer and a second dipole material layer, the second dipole layer different than the first dipole material layer.
1 . An integrated circuit structure, comprising:
a first vertical arrangement of horizontal nanowires;
a second vertical arrangement of horizontal nanowires;
a P-type gate stack over the first vertical arrangement of horizontal nanowires, the P-type gate stack having a mid-gap to P-type conductive layer over a first gate dielectric comprising a high-k dielectric layer and a first dipole material layer, the mid-gap to P-type conductive layer in direct physical contact with the first dipole material layer; and
an N-type gate stack over the second vertical arrangement of horizontal nanowires, the N-type gate stack having the mid-gap to P-type conductive layer over a second gate dielectric comprising the high-k dielectric layer and a second dipole material layer, the mid-gap to P-type conductive layer in direct physical contact with the second dipole material layer, the second dipole material layer different than the first dipole material layer, wherein the mid-gap to P-type conductive layer is continuous between the first vertical arrangement of horizontal nanowires and the second vertical arrangement of horizontal nanowires.
2 . The integrated circuit structure of claim 1 , wherein the high-k dielectric layer comprises hafnium and oxygen.
3 . The integrated circuit structure of claim 1 , wherein the first dipole material layer comprises an oxide of Al, Ti, Nb or Ga, and wherein the second dipole material layer comprises an oxide of La, Mg, Y, Ba or Sr.
4 . The integrated circuit structure of claim 1 , wherein the first dipole material layer or the second dipole material layer has a thickness in the range of 1-3 Angstroms.
5 . The integrated circuit structure of claim 1 , wherein the first dipole material layer or the second dipole material layer has a thickness in the range of 4-6 Angstroms.
6 . The integrated circuit structure of claim 1 , wherein the mid-gap to P-type conductive layer is continuous between the first vertical arrangement of horizontal nanowires and the second vertical arrangement of horizontal nanowires.
7 . An integrated circuit structure, comprising:
a first vertical arrangement of horizontal nanowires;
a second vertical arrangement of horizontal nanowires;
a P-type gate stack over the first vertical arrangement of horizontal nanowires, the P-type gate stack having a mid-gap to N-type conductive layer over a first gate dielectric comprising a high-k dielectric layer and a first dipole material layer, the mid-gap to N-type conductive layer in direct physical contact with the first dipole material layer; and
an N-type gate stack over the second vertical arrangement of horizontal nanowires, the N-type gate stack having the mid-gap to N-type conductive layer over a second gate dielectric comprising the high-k dielectric layer and a second dipole material layer, the mid-gap to N-type conductive layer in direct physical contact with the second dipole material layer, the second dipole material layer different than the first dipole material layer, wherein the mid-gap to N-type conductive layer is continuous between the first vertical arrangement of horizontal nanowires and the second vertical arrangement of horizontal nanowires.
8 . The integrated circuit structure of claim 7 , wherein the high-k dielectric layer comprises hafnium and oxygen.
9 . The integrated circuit structure of claim 7 , wherein the first dipole material layer comprises an oxide of Al, Ti, Nb or Ga, and wherein the second dipole material layer comprises an oxide of La, Mg, Y, Ba or Sr.
10 . The integrated circuit structure of claim 7 , wherein the first dipole material layer or the second dipole material layer has a thickness in the range of 1-3 Angstroms.
11 . The integrated circuit structure of claim 7 , wherein the first dipole material layer or the second dipole material layer has a thickness in the range of 4-6 Angstroms.
12 . The integrated circuit structure of claim 7 , wherein the mid-gap to N-type conductive layer is continuous between the first vertical arrangement of horizontal nanowires and the second vertical arrangement of horizontal nanowires.
13 . A computing device, comprising:
a board; and
a component coupled to the board, the component including an integrated circuit structure, comprising:
a first vertical arrangement of horizontal nanowires;
a second vertical arrangement of horizontal nanowires;
a P-type gate stack over the first vertical arrangement of horizontal nanowires, the P-type gate stack having a mid-gap to P-type conductive layer over a first gate dielectric comprising a high-k dielectric layer and a first dipole material layer, the mid-gap to P-type conductive layer in direct physical contact with the first dipole material layer; and
an N-type gate stack over the second vertical arrangement of horizontal nanowires, the N-type gate stack having the mid-gap to P-type conductive layer over a second gate dielectric comprising the high-k dielectric layer and a second dipole material layer, the mid-gap to P-type conductive layer in direct physical contact with the second dipole material layer, the second dipole material layer different than the first dipole material layer, wherein the mid-gap to P-type conductive layer is continuous between the first vertical arrangement of horizontal nanowires and the second vertical arrangement of horizontal nanowires.
14 . The computing device of claim 13 , further comprising:
a memory coupled to the board.
15 . The computing device of claim 13 , further comprising:
a communication chip coupled to the board.
16 . The computing device of claim 13 , wherein the component is a packaged integrated circuit die.
17 . A computing device, comprising:
a board; and
a component coupled to the board, the component including an integrated circuit structure, comprising:
a first vertical arrangement of horizontal nanowires;
a second vertical arrangement of horizontal nanowires;
a P-type gate stack over the first vertical arrangement of horizontal nanowires, the P-type gate stack having a mid-gap to N-type conductive layer over a first gate dielectric comprising a high-k dielectric layer and a first dipole material layer, the mid-gap to N-type conductive layer in direct physical contact with the first dipole material layer; and
an N-type gate stack over the second vertical arrangement of horizontal nanowires, the N-type gate stack having the mid-gap to N-type conductive layer over a second gate dielectric comprising the high-k dielectric layer and a second dipole material layer, the mid-gap to N-type conductive layer in direct physical contact with the second dipole material layer, the second dipole material layer different than the first dipole material layer, wherein the mid-gap to N-type conductive layer is continuous between the first vertical arrangement of horizontal nanowires and the second vertical arrangement of horizontal nanowires.
18 . The computing device of claim 17 , further comprising:
a memory coupled to the board.
19 . The computing device of claim 17 , further comprising:
a communication chip coupled to the board.
20 . The computing device of claim 17 , wherein the component is a packaged integrated circuit die.