Transfer molding system and methods
A transfer molding system includes a plurality of resin receptacles selectively movable by a resin support into registration with a first actuator for dispensing resin material through a transfer manifold and into a component core. Two or more component cores are supported on a core support for selective movement to a position for receiving resin material dispensed through the manifold. The resin receptacles and manifold may be controllably heated to melt the resin material and maintain temperatures to facilitate resin transfer into the component cores.
1 . A transfer molding system, comprising:
a first actuator for transferring molten resin to a component core;
a resin support supporting a plurality of resin receptacles and configured to selectively move the respective resin receptacles to and from a first position for operative engagement with the first actuator, and at least one second position displaced away from the first position;
a transfer manifold adjacent the resin support and adapted to receive resin from a resin receptacle located at the first position when the first actuator is actuated to operatively engage the resin receptacle, the transfer manifold having at least one outlet for dispensing resin therefrom;
a core support proximate the transfer manifold and supporting at least two component cores for movement to and from a first index location wherein the respective component core is aligned with the at least one outlet of the transfer manifold, and at least one second index location wherein the component core is displaced away from the first index location for handling or processing; and
a second actuator aligned with the first index location of the core support, the second actuator operative to move a respective component core at the first index location from a first position supported on the core support, to a second position raised from the core support and in operative engagement with the at least one outlet of the transfer manifold, whereby resin may be transferred from the transfer manifold into the component core.
2 . The transfer molding system of claim 1 , wherein at least one of the resin support or the core support is configured as a rotationally indexable table.
3 . The transfer molding system of claim 1 , wherein the plurality of resin receptacles each comprise a resin pot on the resin support.
4 . The transfer molding system of claim 1 , wherein each resin receptacle includes an associated heating device configured to heat resin within the receptacle.
5 . The transfer molding system of claim 4 , wherein at least one heating device comprises a heating band coupled with the respective resin receptacle.
6 . The transfer molding system of claim 1 , further comprising:
a vacuum assembly proximate the transfer manifold;
the vacuum assembly movable from a first position spaced away from the transfer manifold, to a second position for operative engagement with the transfer manifold;
the vacuum assembly configured to remove excess resin from a surface of the transfer manifold at least when the vacuum assembly is in the second position.
7 . The transfer molding system of claim 6 , wherein the vacuum assembly includes a brush positioned and arranged to clean a surface of the manifold proximate the outlet as the vacuum assembly moves between the first and second positions.