IP Library › Granted Patent US 12,567,862
Granted Patent B2
US 12,567,862 · App. 18/790,551 · Granted Mar 3, 2026

Level shifting circuit manufacturing method

Inventors: Yaqi Ma (Hsinchu, TW); Lei Pan (Hsinchu, TW); JunKui Hu (Hsinchu, TW)
Assignees: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.; TSMC CHINA COMPANY, LIMITED
H03K19/018521G06F30/392H03K3/35613H03K19/0185H10D84/85
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Quick Facts
Patent No.
US 12,567,862
App. No.
18/790,551
Granted
Mar 3, 2026
Kind
B2
Abstract

A method of generating an integrated circuit (IC) layout diagram includes defining first through fourth PMOS transistors in an n-well region, arranging a plurality of conductive regions whereby a bias circuit is configured to include the first and second PMOS transistors and a level shifter is configured to include the third and fourth PMOS transistors, and arranging a plurality of conductive elements whereby a first power domain includes electrical connections to each of the first and third PMOS transistors and a second power domain includes electrical connections to each of the second and fourth PMOS transistors.

Claims (86)

1 . A method of generating an integrated circuit (IC) layout diagram, the method comprising:

defining first through fourth PMOS transistors in an n-well region;

arranging a plurality of conductive regions whereby a bias circuit is configured to include the first and second PMOS transistors and a level shifter is configured to include the third and fourth PMOS transistors; and

arranging a plurality of conductive elements whereby a first power domain includes electrical connections to each of the first and third PMOS transistors and a second power domain includes electrical connections to each of the second and fourth PMOS transistors.

2 . The method of claim 1 , wherein

the configuring the bias circuit to include the first and second PMOS transistors comprises defining an electrical connection between the n-well region and each of a first source/drain (S/D) terminal and a bulk terminal of each of the first and second PMOS transistors, and

the arranging the plurality of conductive elements comprises:

arranging first power domain electrical connections to each of a second S/D terminal of the first PMOS transistor and a gate of the second PMOS transistor; and

arranging second power domain electrical connections to each of a second S/D terminal of the second PMOS transistor and a gate of the first PMOS transistor.

3 . The method of claim 2 , wherein

the first power domain is configured to have a first power supply voltage level,

the second power domain is configured to have a second power supply voltage level, and either:

the first power supply voltage level is greater than the second power supply voltage level by an amount greater than a threshold voltage of the first PMOS transistor, or

the second power supply voltage level is greater than the first power supply voltage level by an amount greater than a threshold voltage of the second PMOS transistor.

4 . The method of claim 1 , wherein

the configuring the bias circuit to include the first and second PMOS transistors comprises:

defining a first electrical connection between the n-well region and each of a first source/drain (S/D) terminal and a bulk terminal of each of the first and second PMOS transistors; and

defining a second electrical connection between a gate of the first PMOS transistor and a first S/D terminal of each of a fifth PMOS transistor and an NMOS transistor defined in a substrate region outside the n-well region, and the arranging the plurality of conductive elements comprises:

arranging first power domain electrical connections to each of a second S/D terminal of the first PMOS transistor and a gate of each of the second PMOS transistor, the fifth PMOS transistor, and the NMOS transistor;

arranging second power domain electrical connections to a second S/D terminal of each of the second PMOS transistor and the fifth PMOS transistor; and

arranging a reference voltage connection to a second S/D terminal of the NMOS transistor.

5 . The method of claim 4 , wherein

the first power domain is configured to have a first power supply voltage level,

the second power domain is configured to have a second power supply voltage level, and

the first power supply voltage level is greater than the second power supply voltage level by an amount less than one or more threshold voltages of the first and second PMOS transistors.

6 . The method of claim 1 , wherein

each of the first power domain and the second power domain is configured to operate in each of a power-on mode and a power-down mode.

7 . The method of claim 1 , further comprising:

storing the IC layout diagram comprising each of the first through fourth PMOS transistors, the n-well region, the plurality of conductive regions, and the plurality of conductive elements in a storage device.

8 . A method of generating an integrated circuit (IC) layout diagram, the method comprising:

defining first through fourth PMOS transistors in an n-well region and first through third NMOS transistors in a substrate region outside the n-well region;

arranging a plurality of conductive regions whereby a bias circuit is configured to include the first and second PMOS transistors and a level shifter is configured to include the third and fourth PMOS transistors and the first through third NMOS transistors; and

arranging a plurality of conductive elements whereby a first power domain includes electrical connections to each of the first and third PMOS transistors and a second power domain includes electrical connections to each of the second and fourth PMOS transistors.

9 . The method of claim 8 , wherein

the configuring the bias circuit to include the first and second PMOS transistors comprises defining an electrical connection between the n-well region and each of a first source/drain (S/D) terminal and a bulk terminal of each of the first and second PMOS transistors, and

the arranging the plurality of conductive elements comprises:

arranging first power domain electrical connections to each of a second S/D terminal of the first PMOS transistor, a gate of the second PMOS transistor, and a first S/D terminal of the third PMOS transistor; and

arranging second power domain electrical connections to each of a second S/D terminal of the second PMOS transistor, a gate of the first PMOS transistor, and a first S/D terminal of the fourth PMOS transistor.

10 . The method of claim 9 , wherein

the first power domain is configured to have a first power supply voltage level,

the second power domain is configured to have a second power supply voltage level, and either:

the first power supply voltage level is greater than the second power supply voltage level by an amount greater than a threshold voltage of the first PMOS transistor, or

the second power supply voltage level is greater than the first power supply voltage level by an amount greater than a threshold voltage of the second PMOS transistor.

11 . The method of claim 8 , wherein

the configuring the bias circuit to include the first and second PMOS transistors comprises:

defining a first electrical connection between the n-well region and each of a first source/drain (S/D) terminal and a bulk terminal of each of the first and second PMOS transistors; and

defining a second electrical connection between a gate of the first PMOS transistor and a first S/D terminal of each of a fifth PMOS transistor and a fourth NMOS transistor defined in a substrate region outside the n-well region, and the arranging the plurality of conductive elements comprises:

arranging first power domain electrical connections to each of a second S/D terminal of the first PMOS transistor, a gate of each of the second PMOS transistor, the fifth PMOS transistor, and the NMOS transistor, and a first S/D terminal of the third PMOS transistor;

arranging second power domain electrical connections to a second S/D terminal of each of the second and fifth PMOS transistors and a first S/D terminal of the fourth PMOS transistor; and

arranging reference voltage connections to a first S/D terminal of each of the first through third NMOS transistors and a second S/D terminal of the fourth NMOS transistor.

12 . The method of claim 11 , wherein

the first power domain is configured to have a first power supply voltage level,

the second power domain is configured to have a second power supply voltage level, and

the first power supply voltage level is greater than the second power supply voltage level by an amount less than one or more threshold voltages of the first and second PMOS transistors.

13 . The method of claim 8 , wherein

each of the first power domain and the second power domain is configured to operate in each of a power-on mode and a power-down mode.

14 . The method of claim 8 , further comprising:

storing the IC layout diagram comprising each of the first through fourth PMOS transistors, the n-well region, the first through third NMOS transistors, the plurality of conductive regions, and the plurality of conductive elements in a storage device.

15 . A method of generating an integrated circuit (IC) layout diagram, the method comprising:

defining first through fifth PMOS transistors in an n-well region;

arranging a plurality of conductive regions whereby a bias circuit is configured to include the first and second PMOS transistors and a level shifter is configured to include the third through fifth PMOS transistors;

arranging a plurality of conductive elements whereby a first power domain includes electrical connections to each of the first and third PMOS transistors and a second power domain includes electrical connections to each of the second, fourth, and fifth PMOS transistors; and

storing the IC layout diagram comprising each of the first through fifth PMOS transistors, the n-well region, the plurality of conductive regions, and the plurality of conductive elements in a storage device.

16 . The method of claim 15 , wherein

the configuring the bias circuit to include the first and second PMOS transistors comprises defining an electrical connection between the n-well region and each of a first source/drain (S/D) terminal and a bulk terminal of each of the first and second PMOS transistors, and

the arranging the plurality of conductive elements comprises:

arranging first power domain electrical connections to each of a second S/D terminal of the first PMOS transistor, a gate of the second PMOS transistor, and a first S/D terminal of third PMOS transistor; and

arranging second power domain electrical connections to each of a second S/D terminal of the second PMOS transistor, a gate of the first PMOS transistor, and a first S/D terminal of each of the fourth and fifth PMOS transistors.

17 . The method of claim 16 , wherein

the first power domain is configured to have a first power supply voltage level,

the second power domain is configured to have a second power supply voltage level, and either:

the first power supply voltage level is greater than the second power supply voltage level by an amount greater than a threshold voltage of the first PMOS transistor, or

the second power supply voltage level is greater than the first power supply voltage level by an amount greater than a threshold voltage of the second PMOS transistor.

18 . The method of claim 15 , wherein

the configuring the bias circuit to include the first and second PMOS transistors comprises:

defining a first electrical connection between the n-well region and each of a first source/drain (S/D) terminal and a bulk terminal of each of the first and second PMOS transistors; and

defining a second electrical connection between a gate of the first PMOS transistor and a first S/D terminal of each of a sixth PMOS transistor and an NMOS transistor defined in a substrate region outside the n-well region, and the arranging the plurality of conductive elements comprises:

arranging first power domain electrical connections to each of a second S/D terminal of the first PMOS transistor, a gate of each of the second PMOS transistor, the sixth PMOS transistor, and the NMOS transistor, and a first S/D terminal of the third PMOS transistor;

arranging second power domain electrical connections to a second S/D terminal of each of the second PMOS transistor and the sixth PMOS transistor, and a first S/D terminal of each of the fourth and fifth PMOS transistors; and

arranging a reference voltage connection to a second S/D terminal of the NMOS transistor.

19 . The method of claim 18 , wherein

the first power domain is configured to have a first power supply voltage level,

the second power domain is configured to have a second power supply voltage level, and

a difference between the first power supply voltage level and the second power supply voltage level is less than one or more threshold voltages of the first and second PMOS transistors.

20 . The method of claim 15 , wherein

each of the first power domain and the second power domain is configured to operate in each of a power-on mode and a power-down mode.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 31, 2024
From: MA, YAQI; PAN, LEI; HU, JUNKUI
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.; TSMC CHINA COMPANY, LIMITED
Reel/Frame 068140/0771 →
Priority Claims (1)
CN 202110787741.9 · Jul 13, 2021 · national
Continuity (4)
Continuation 18447154 · Aug 9, 2023
Division 17883257 · Aug 8, 2022
Continuation 17384409 · Jul 23, 2021
Related Publication 20240396553A1 · Nov 28, 2024
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