Method of fabricating semiconductor device
A method of manufacturing a semiconductor device is provided. The method includes: forming a lower structure including a cell array region and an extension region, the cell array region including a first impurity region, a second impurity region and word lines extending in a first direction, and the extension region including an insulating layer; forming a preliminary bit line structure on the lower structure; forming a mask layer on the preliminary bit line structure and the lower structure; forming spacer patterns extending in a second direction, intersecting the first direction, on the mask layer; forming material layers on side surfaces of the spacer patterns, on the extension region; forming mask patterns by patterning the mask layer using the spacer patterns and the material layers as a first etching mask; and forming bit line structures by patterning the preliminary bit line structure using the mask patterns as a second etching mask. Each of the bit line structures includes a first portion formed on the cell array region and a second portion formed on the extension region, and the first portion is narrower than the second portion.
1 . A method of manufacturing a semiconductor device, comprising:
forming a lower structure comprising a cell array region and an extension region, the cell array region comprising a first impurity region, a second impurity region and word lines extending in a first direction, and the extension region comprising an insulating layer;
forming a preliminary bit line structure on the lower structure;
forming a mask layer on the preliminary bit line structure and the lower structure;
forming spacer patterns extending in a second direction, intersecting the first direction, on the mask layer;
forming material layers on side surfaces of the spacer patterns, on the extension region;
forming mask patterns by patterning the mask layer using the spacer patterns and the material layers as a first etching mask; and
forming bit line structures by patterning the preliminary bit line structure using the mask patterns as a second etching mask,
wherein each of the bit line structures comprises a first portion formed on the cell array region and a second portion formed on the extension region, and
wherein the first portion is narrower than the second portion.
2 . The method of claim 1 , wherein each of the mask patterns comprises a first pattern on the cell array region and a second pattern on the extension region, and
wherein the first pattern is narrower than the second pattern.
3 . The method of claim 2 , wherein a side surface of the first pattern is offset from a side surface of the second pattern.
4 . The method of claim 1 , further comprising:
removing the spacer patterns and the material layers used as the first etching mask; and
removing the mask patterns used as the second etching mask.
5 . The method of claim 1 , wherein a side surface of the first portion is offset from a side surface of the second portion.
6 . The method of claim 1 , wherein the forming the preliminary bit line structure on the lower structure comprises:
forming a conductive layer on the lower structure; and
forming a capping layer on the conductive layer.
7 . The method of claim 6 , wherein the forming the conductive layer on the lower structure comprises:
forming a bit line contact hole exposing the first impurity region in the cell array region of the lower structure;
forming a first conductive material layer in the bit line contact hole; and
forming a second conductive material layer on the first conductive material layer.
8 . The method of claim 1 , wherein the forming the spacer patterns comprises:
forming sacrificial patterns on the mask layer;
forming spacer layers on side surfaces of the sacrificial patterns; and
removing the sacrificial patterns.
9 . The method of claim 1 , wherein each of the spacer patterns comprises:
line portions extending parallel to each other; and
edge portions connecting the line portions adjacent to each other.
10 . The method of claim 1 , wherein the forming the material layers on the spacer patterns comprises forming the material layers using atomic layer deposition (ALD).
11 . The method of claim 1 , wherein a thickness of each of the material layers is in a range from about 10 Å to about 20 Å.
12 . The method of claim 1 , further comprising:
forming insulating patterns between the bit line structures adjacent to each other, on the word lines;
forming a hole exposing the second impurity region;
forming a conductive pattern in the hole; and
forming a data storage structure electrically connected to the conductive pattern.
13 . The method of claim 1 , wherein the forming the material layers comprises:
forming a photoresist mask defining an opening that exposes the extension region, on the lower structure; and
depositing the material layers on the side surfaces of the spacer patterns on the extension region, using the photoresist mask as an anti-deposition layer.
14 . A method of manufacturing a semiconductor device, comprising:
forming a lower structure comprising a cell array region and an extension region;
forming a preliminary bit line structure on the lower structure;
forming a spacer structure that extends in an extension direction from the cell array region to the extension region, on the preliminary bit line structure, the spacer structure having a symmetrical shape with respect to the extension direction, and the spacer structure being narrower in the cell array region than in the extension region; and
forming a bit line structure by patterning the preliminary bit line structure using the spacer structure as an etching mask.
15 . The method of claim 14 , wherein the bit line structure comprises a first portion formed in the cell array region and a second portion formed in the extension region, and
wherein the first portion is narrower than the second portion.
16 . The method of claim 15 , wherein the first portion of the bit line structure has a first side,
wherein the second portion of the bit line structure has a second side, and
wherein the first side is offset from the second side.
17 . The method of claim 14 , wherein the lower structure comprises an insulating layer disposed below the preliminary bit line structure, in the extension region.
18 . The method of claim 14 , wherein the spacer structure comprises:
a spacer pattern extending in the extension direction from the cell array region to the extension region and having a predetermined width; and
material layers on side surfaces of the spacer pattern, in the cell array region and the extension region.
19 . The method of claim 18 , wherein the material layers comprise:
a first spacer layer on the side surfaces of the spacer pattern, in the cell array region and the extension region, and
a second spacer layer on the first spacer layer, in the extension region.
20 . A method of manufacturing a semiconductor device, comprising:
forming a lower structure comprising a cell array region and an extension region;
forming a preliminary bit line structure on the lower structure;
forming spacer patterns extending in a direction from the cell array region to the extension region, on the preliminary bit line structure;
sequentially forming a first spacer layer and a second spacer layer on side surfaces of the spacer patterns, in the cell array region and the extension region;
selectively removing the second spacer layer in the cell array region;
forming bit line structures by patterning the preliminary bit line structure using the spacer patterns, the first spacer layer, and the second spacer layer as an etching mask; and
removing the spacer patterns, the first spacer layer, and the second spacer layer,
wherein each of the bit line structures comprises a first portion in the cell array region and a second portion in the extension region, the first portion being narrower than the second portion.