IP Library › Granted Patent US 12,573,458
Granted Patent B2
US 12,573,458 · App. 18/677,836 · Granted Mar 10, 2026

Method for forming semiconductor structure with wave shaped erase gate

Inventors: Yi-Ning Peng (Miaoli County, TW); Hsueh-Chun Hsiao (Hsinchu County, TW); Tzu-Yun Chang (Hsinchu County, TW)
Assignee: UNITED MICROELECTRONICS CORP.
G11C16/24G11C16/08H10B41/10H10B41/27H10D30/681
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Quick Facts
Patent No.
US 12,573,458
App. No.
18/677,836
Granted
Mar 10, 2026
Kind
B2
Abstract

A method for forming semiconductor structure with wave shaped erase gate, the method including the steps: forming a floating gate having staggered islands on a substrate, forming a erase gate having a wave shape on the substrate at a first side of the floating gate, and forming a word line having the wave shape on the substrate at a second side of the floating gate opposite to the first side.

Claims (13)

1 . A method of forming a semiconductor structure with wave shaped erase gate, comprising:

forming a plurality of floating gates having staggered islands on a substrate;

forming an erase gate having a wave shape on the substrate at a first side of one of the floating gates, wherein the wave shape has first parts connecting to second-one parts and second-two parts, wherein the first parts, the second-one parts and the second-two parts are alternatively arranged, wherein the first parts extend along a second direction, the second-one parts extend along a third direction and the second-two parts extend along a fourth direction, and wherein the third direction and the fourth direction are not orthogonal to the second direction; and

forming a word line having the wave shape on the substrate at a second side of one of the floating gates opposite to the first side; and

forming a word line well in the substrate at the second side before the word line is formed.

2 . The method of forming a semiconductor structure with wave shaped erase gate according to claim 1 , further comprising:

forming a source line in the substrate beside one of the floating gates before the erase gate is formed.

3 . The method of forming a semiconductor structure with wave shaped erase gate according to claim 1 , wherein the word line and the erase gate are formed at the same time.

4 . The method of forming a semiconductor structure with wave shaped erase gate according to claim 1 , further comprising:

forming lightly doped regions beside the word line after the word line is formed.

5 . The method of forming a semiconductor structure with wave shaped erase gate according to claim 1 , wherein the erase gate has the wave shape when viewed from a top view.

6 . The method of forming a semiconductor structure with wave shaped erase gate according to claim 1 , wherein the second direction is orthogonal to a first direction, wherein a plurality of isolation structures are defined in the substrate to extend in the first direction.

7 . The method of forming a semiconductor structure with wave shaped erase gate according to claim 1 , wherein two of the first parts adjacent to each other are not aligned with each other along the second direction.

Continuity (2)
Division 17151226 · Jan 18, 2021
Related Publication 20240312527A1 · Sep 19, 2024
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